ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of
wafer-processing solutions for semiconductor and advanced
wafer-level packaging (WLP) applications, today announced the
introduction of its Thin Wafer Cleaning System, a high-throughput,
four-chamber system designed for single-wafer wet processes
including cleaning, etching and surface finishing. The system is
intended for the manufacture of both MOSFET and insulated-gate
bipolar transistor (IGBT) devices for the power semiconductor
market, and features complete touch-free handling and processing
based on the Bernoulli effect to eliminate possible wafer damage
and improve final device yield. It supports 200mm and 300mm Si
wafers and is suitable for Taiko wafers down to 50-micron
thickness, ultra-thin wafers of less than 200-micron thickness,
high aspect ratio (>10:1) deep trench wafers as well as
double-thickness bonded wafer pairs.
Modor Intelligence, a market research consulting firm, expects
the IGBT market to increase from US$5.4 billion in 2019 to US$9.4
billion in 2025, based on the broad application range of IGBTs to
modern appliances such as cookers, microwaves, electric cars,
trains, variable-frequency drives, variable speed refrigerators,
air conditioners, lamp ballasts, municipal power transmission
systems and stereo systems. Modor Intelligence also reports that
sales of electric cars in Europe, North America and China are
creating new avenues for IGBTs to support infrastructure and for
manufacturing electric vehicles.1
Furthermore, keeping up with the miniaturization trend while
improving device performance has sparked demand for smaller pitch,
deeper trench and thinner wafers. Yole Développement, a
market research and technology analysis firm, predicted the market
for thinned wafers will increase from 100 million in 2019 to 135
million in 2025, a compound annual growth rate (CAGR) of more than
5%. Yole Développement expects this market growth to be driven by
memory, CMOS image sensors and power silicon carbide components as
well as LED and laser diodes.2
“To compete for market share, power device manufacturers must
expand their MOSFET and IGBT manufacturing lines to include wafer
thinning equipment, without significantly increasing the overall
fab footprint,” said David Wang, ACM’s Chief Executive Officer and
President. “We have responded by developing a four-chamber tool
that offers much higher throughput than the currently-available
two-chamber systems. Additionally, we outfitted the tool with a
proprietary contactless handling and processing system to prevent
these fragile wafers -- which can be as thin as 50-microns -- from
being damaged during the backside thinning and cleaning processes,
thereby increasing overall device yield.”
ACM’s Thin Wafer Cleaning System has been designed to meet
manufacturers’ needs. After mechanical grinding/polishing is
performed to achieve desired thickness, the handling system
supports these ultra-thin, high-warpage wafers throughout
subsequent critical processes, including silicon thinning using a
wet-etch step to eliminate microcracks. Additionally, by
implementing a different combination of chemistries, the tool can
be used for cleaning, photoresist removal, thin film removal and
metal etching.
The tool’s handling system is programmable to accommodate deep
trench, Taiko, ultra-thin wafers or bonded wafers. The robot arms
for loading and unloading, as well as the chuck, have been designed
for non-contact wafer handling using a proprietary method based on
the Bernoulli effect. Nitrogen gas (N2) provides constant pressure
to keep the wafer floating in place on the arm, which can be
flipped for processing on either side while still holding the wafer
in place. This allows for handling high-warpage wafers without
contact.
During the wet process, the wafer sits front-side down on a
Bernoulli chuck, where an N2 flow cushions the wafer, protecting it
and keeping it dry. This proprietary design, using ACM’s patented
technology on a Bernoulli chuck, features a recipe-controlled gap
between the wafer and chuck to meet requirements for undercut width
control on the wafer device side edge and pin mark-free control.
Additionally, the system can be configured to include an optional
thickness measurement function.
Each chamber can be configured with up to four swing arms for
delivering process chemistries such as wet etchants, solvents, RCA
cleaning chemicals, deionized water and nitrogen. Additionally, the
chambers are designed to allow reclaiming of two types of
chemicals.
ACM delivered its first Thin Wafer Cleaning System to a
China-based analog/power semiconductor manufacturer in the second
quarter of 2020, with revenue recognition subject to qualification
and acceptance.
ACM’s Thin Wafer Cleaning System is available for purchase now.
For more information, please call the ACM regional company contact
listed below.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for single
wafer or batch wet cleaning, electroplating, stress-free polishing
and thermal processes critical to advanced semiconductor device
manufacturing, as well as wafer-level packaging. The company is
committed to delivering customized, high-performance,
cost-effective process solutions that semiconductor manufacturers
can use in numerous manufacturing steps to improve productivity and
product yield.
The ACM Research logo is a trademark of ACM Research,
Inc. For convenience, this trademarks appears in this press
release without a ™ symbol, but that practice does not mean that
ACM will not assert, to the fullest extent under applicable law,
its rights to the trademark.
References
-
https://www.mordorintelligence.com/industry-reports/insulated-gate-bipolar-transistor-igbt-market
-
http://www.yole.fr/iso_upload/News/2020/PR_THINNING_EQUIPMENT_MATERIALS_Technology_Market_Overview_YOLE_June2020.pdf
Statistical DataThe information included in
this press release contains statistical data and estimates,
including forecasts, that are based on information disclosed
publicly by Modor Intelligence and Yole Développement in their
respective publications listed under “References” above. These
publications represent research opinions or viewpoints and are not
representations of fact. The publications speak as of their
original publication dates (and not as of the date of this press
release), and the opinions expressed in the publications are
subject to change without notice. While ACM is not aware of any
misstatements regarding any of the statistical data or estimates
presented from these publications, estimates, and in particular
forecasts, inherently involve numerous assumptions and are subject
to risks and uncertainties, as well as change based on various
factors, that could cause results to differ materially from those
expressed in the data and estimates presented in this press
release. Readers are cautioned not to place undue reliance on any
statistical data or estimates, and ACM undertakes no obligation to
update any statistical data or estimates, whether as a result of
new information, future events or otherwise.
Media Contact: |
Company Contact: |
Eric
Lawson |
USA &
Europe |
Kiterocket |
Sallyann
Henry |
+1
480.276.9572 |
ACM Research, Inc. |
elawson@kiterocket.com |
+1
510.445.3700 |
|
|
|
China |
|
Xi Wang |
|
ACM Research
(Shanghai), Inc. |
|
+86 21
50808868 |
|
|
|
Korea |
|
YY Kim |
|
ACM Research
(Korea), Inc. |
|
+82 10
41415171 |
|
|
|
Taiwan |
|
David
Chang |
|
+866
921-999-884 |
|
|
|
Singapore |
|
Adrian
Ong |
|
+65
8813-1107 |
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