TAICHUNG, Taiwan, March 15,
2023 /PRNewswire/ -- Winbond Electronics Corporation,
a leading global supplier of semiconductor memory solutions, and
STMicroelectronics (NYSE: STM), a global semiconductor leader
serving customer across the spectrum of electronics applications,
today announced a partnership that teams Winbond's specialty memory
ICs with ST's STM32 microcontrollers (MCUs) and microprocessors
(MPUs).
The partnership formalizes collaboration between the two
companies to optimize integration and performance and assure
long-term availability of Winbond and ST devices, to meet the needs
of customers serving industrial markets.
"This partnership means product developers can confidently
integrate our memory with STM32 devices," said Tetsu Ho, Winbond DRAM Technology Manager. "Our
memories are the perfect choice for embedded projects, offering
attributes such as small size, power-saving design, and low
pin-count packages that simplify interconnection and save PCB
cost."
The STM32 family is the market leader in MCUs and MPUs built on
industry-standard Arm® Cortex 32-bit cores. They combine high
performance and energy efficiency with super-low power consumption,
advanced peripherals, and the extensive STM32 ecosystem that
comprises software, tools, and evaluation boards and kits to
simplify and accelerate development.
"STMicroelectronics and Winbond are happy to announce a close
partnership around STM32MPU families. Indeed, ST as a global leader
on General Purpose MCUs, ST is extending its family to STM32MPUs,
for that we need to have strong memory DRAM provider to support and
provide all our Customers." said Kamel Kholti, STM32MPU Ecosystem
Product Marketing Manager.
Currently, the partnership has focused on combining Winbond's
DDR3 (double data-rate 3rd generation) dynamic RAM with
ST's STM32MP1 MPUs, which contain up to two Cortex-A7 cores and
integrate features including advanced peripherals, IoT-security
hardware, and high-efficiency power conversion circuitry on-chip.
Winbond's DDR3 supports the MPU's memory buffer to enhance
performance in applications such as industrial gateways, data
concentrators, smart meters, barcode readers, smart-home devices,
and numerous applications that require both high performance and
state-of-the-art security.
In addition, ST and Winbond have collaborated to ensure that
Winbond's HYPERRAMTM provides ideal support for the
memory buffer of ST's recently announced STM32U5 ultra-low-power
MCUs based on the advanced Cortex-M33 core. HYPERRAM allows
replacement of older interfaces like SDR and earlier DDR
generations to realize whole-system power savings. It betters the
performance of conventional pSRAM and permits a high-speed,
low-cost, low pin-count, and super-low-power solution consistent
with the ultra-low-power STM32U5.
Winbond's extensive portfolio containing HYPERRAM, DDR3,
LPDDR4/4X, DDR4 and other Mobile and Specialty DRAM is available
through distributors and online. Please visit www.winbond.com for
more details.
About Winbond
Winbond Electronics Corporation is a total memory solution
provider. The Company provides customer-driven memory solutions
backed by the expert capabilities of product design, R&D,
manufacturing, and sales services. Winbond's product portfolio,
consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and
TrustME® Secure Flash, is widely used by tier-1 customers in
communication, consumer electronics, automotive and industrial, and
computer peripheral markets. Winbond is headquartered in
Central Taiwan Science Park
(CTSP), and it has subsidiaries in the USA, Japan,
Israel, China and Hong
Kong, and Germany. Based on
Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house
technologies to provide high-quality memory IC products.
Winbond is a registered trademark of Winbond Electronics
Corporation. All other trademarks and copyrights mentioned herein
are the property of their respective owners.
Spokesperson
Chih-Chung Chou
Chief Financial Officer
TEL: +886-3-567-8168/+886-987-365-682
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SOURCE Winbond Electronics Corporation