STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules
December 07 2022 - 09:00AM
STMicroelectronics boosts EV performance
and driving rangewith new silicon-carbide power
modules
Hyundai Motor Company has chosen ST’s highly
efficient ACEPACK DRIVE power modules for multiple models of its
E-GMP vehicle platform
Geneva, December 7,
2022 – STMicroelectronics (NYSE: STM), a global
semiconductor leader serving customers across the spectrum of
electronics applications, has released high-power modules for
electric vehicles that boost performance and driving range. ST’s
new silicon-carbide (SiC) power modules have been selected for
Hyundai’s E-GMP electric-vehicle platform shared by KIA EV6 and
several models.
Five new SiC-MOSFET based power modules provide flexible choices
for vehicle makers, covering a selection of power ratings and
support for operating voltages commonly used in electric vehicle
(EV) traction applications. Housed in ST’s ACEPACK DRIVE package
optimized for traction applications, the power modules are reliable
thanks to sintering technology, robust, and easy for manufacturers
to integrate in EV drives. Internally, the main power
semiconductors are ST’s third-generation (Gen3) STPOWER SiC
MOSFETs, which combine industry-leading figure of merit (RDS(ON) x
die area) with very low switching energy and super performance in
synchronous rectification.
“ST silicon carbide solutions are enabling major automotive OEMs
to set the pace of electrification when developing future
generations of EVs,” said Marco Monti, President, Automotive and
Discrete Group, STMicroelectronics. “Our third-generation SiC
technology ensures the greatest power density and energy
efficiency, resulting in superior vehicle performance, range, and
charge time.”
A leader in the automotive EV market, Hyundai Motor Company has
chosen ST’s ACEPACK DRIVE SiC-MOSFET Gen3 based power modules for
its current-generation EV platform, called E-GMP. In particular,
the modules will power the Kia EV6. “ST’s SiC-MOSFET based power
modules are the right choice for our traction inverters, enabling
longer range. The cooperation between our two companies has
realized a significant step towards more sustainable electric
vehicles, leveraging ST’s continuous technological investment to be
the leading semiconductor actor in the electrification revolution,”
said Mr. Sang-Cheol Shin, Inverter Engineering Design Team at
Hyundai Motor Group.
As an industry leader in this technology, ST has already
supplied STPOWER SiC devices for more than three million
mass-produced passenger cars worldwide. Compared to conventional
silicon power semiconductors, smaller SiC devices can handle higher
operating voltages that allow faster charging and superior vehicle
dynamics. Energy efficiency is also increased, which boosts driving
range, and reliability can be extended. SiC is gaining mass
adoption in multiple EV systems such as the DC-DC converter,
traction inverter, and on-board chargers (OBC) with bi-directional
operation ready for vehicle-to-grid power transfer. ST’s SiC
strategy, as an integrated device manufacturer (IDM), ensures
quality and security of supply to serve carmakers’ strategies for
electrification. With the recently announced fully integrated SiC
substrate manufacturing facility in Catania, expected to start
production in 2023, ST is moving quickly to support the rapid
market transition towards e-mobility.
Technical Notes to Editors:
ST’s 1200V ADP280120W3, ADP360120W3, ADP480120W3(-L) are already
in full production. The 750V ACEPACK DRIVE ADP46075W3 and
ADP61075W3 will be in full production by March 2023. They enable a
plug-and-play solution for traction inverters, compatible with
direct liquid cooling, and featuring a pin-fin array for efficient
heat dissipation. Specified up to a maximum junction temperature of
175°C, they provide long-lasting and reliable press-fit connections
and dice sintered to substrate to ensure extended lifetime in
automotive applications. ST will extend the product portfolio to
include IGBT and diode-based ACEPACK DRIVE versions.
The modules feature active metal brazed (AMB) substrate
technology, known for excellent thermal efficiency and mechanical
strength, mounting a dedicated NTC for each substrate. They are
also available with a choice of welded or screw-fit busbar, giving
flexibility to address different mounting requirements. A
long-busbar option further extends the flexibility by allowing the
choice of a Hall sensor to monitor the motor current.
ST’s latest-generation ACEPACK DRIVE modules are in production
now. Please contact your local ST sales representative for pricing
and sample requests.
About STMicroelectronicsAt ST, we are 48,000
creators and makers of semiconductor technologies mastering the
semiconductor supply chain with state-of-the-art manufacturing
facilities. An integrated device manufacturer, we work with more
than 200,000 customers and thousands of partners to design and
build products, solutions, and ecosystems that address their
challenges and opportunities, and the need to support a more
sustainable world. Our technologies enable smarter mobility, more
efficient power and energy management, and the wide-scale
deployment of the Internet of Things and connectivity. ST is
committed to becoming carbon neutral by 2027. Further information
can be found at www.st.com.
For Press Information
Contact:STMicroelectronicsMichael
MarkowitzDirector Technical Media RelationsTel: +1 781 591
0354Email: michael.markowitz@st.com
- T4502I -- Dec 7 2022 -- ACEPACK SiC modules in Hyundai
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- T4502I -- Dec 7 2022 -- ACEPACK SiC modules in Hyundai
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