ASE Introduces VIPack™ to Help Transform Packaging Solution Enablement
June 01 2022 - 9:30AM
Business Wire
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE
Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today
introduced VIPack™, an advanced packaging platform designed to
enable vertically integrated package solutions. VIPack™ represents
ASE’s next generation of 3D heterogeneous integration architecture
that extends design rules and achieves ultra-high density and
performance. The platform leverages advanced redistribution layer
(RDL) processes, embedded integration, and 2.5D and 3D technologies
to help customers achieve unprecedented innovation when integrating
multiple chips within a single package.
As our world navigates the data centric era, the semiconductor
market is growing exponentially, with the growth behind the data
coming from devices used across Artificial Intelligence (AI),
Machine Learning (ML), 5G Communications, High Performance
Computing (HPC), Internet-of-Things (IoT), and Automotive
applications. Demand for innovative package and IC co-design,
cutting-edge wafer level fabrication processes, sophisticated
packaging technologies, and comprehensive product and testing
solutions has never been greater. The role of packaging has become
increasingly critical, as applications call for solutions to enable
higher performance, greater functionality, and improved power,
while meeting stringent cost parameters. The rising adoption of
chiplet-based co-designs is further fueling demand for multi-chip
integration into a single package. The launch of VIPack™ firmly
establishes a collaborative platform for exceptional interconnect
solutions where 3D heterogeneous integration has become
critical.
ASE’s VIPack™ is comprised of six core packaging technology
pillars supported by a comprehensive and integrated co-design
ecosystem. These include ASE’s high density RDL-based Fanout
Package-on Package (FOPoP), Fanout Chip-on-Substrate, (FOCoS),
Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout
System-in-Package (FOSiP) as well as Through Silicon Via
(TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing
capabilities. The VIPack™ platform provides the capabilities
necessary to enable trailblazing highly integrated silicon
packaging solutions required to optimize clock speed, bandwidth,
and power delivery, and to reduce co-design time, product
development, and time to market. “Critical new innovations such as
double-sided RDL have allowed a series of new vertically integrated
package technology pillars that create the backbone of our VIPack™
platform,” commented Mark Gerber, Sr. Director of Technical
Marketing and Promotion at ASE.
The VIPack™ platform delivers the dense horizontal and vertical
interconnect solutions required to interconnect disaggregated SoCs
(System-on-Chip) and HBM (High Bandwidth Memory) used for
leading-edge HPC, AI, ML, and Network applications. High-speed
networking is also being challenged with several complex components
for optical packaging that require VIPack™ innovation to bring
these components together in a vertical structure for both space
and performance enablement. Applications supported by VIPack™
further extend to the mobile market with ultra-low profile SIP
modules to address the common RF iterative design process and
enable a higher level of performance with integrated passives in
the RDL layers. Additionally, the next generation of application
processors address the demand for lower profile package solutions,
while solving power delivery issues for advanced silicon nodes.
“ASE is delighted to bring its VIPack™ platform to market,
opening up new opportunities for our customers to innovate from the
design process all the way to production and to reap extensive
benefits in relation to functionality, performance, and cost,” said
Dr. C.P. Hung, Vice President of R&D, ASE. “As the world’s
leading OSAT, ASE is strategically positioned to help customers
improve efficiency, speed time-to-market, and sustain profitable
growth. VIPack™ underscores our commitment to deliver our most
innovative packaging technologies to date.”
“Our expanding digitized world is driving unparalleled
innovation across the semiconductor industry and VIPack™ represents
a crucial leap forward in the transformational packaging
technologies required to achieve the highly complex system
integration our customers need to remain competitive,” said Yin
Chang, Senior Vice President of Sales and Marketing. “Through
VIPack™, we’re empowering our customers to discover new
efficiencies in their semiconductor design and manufacturing
process and to reimagine the integration technologies required to
accomplish application excellence.”
Available now, ASE’s VIPack™ is a scalable platform that will
expand in alignment with industry roadmaps.
Supporting resources
- For more about VIPack™, please visit
www.ase.aseglobal.com/VIPack
- Read Mark Gerber’s Blog on VIPack™ announcement
- Visit the ASE Booth at ECTC 2022 in San Diego, CA, June 1-2,
2022
- Follow us on our LinkedIn page for targeted updates and
announcements @asegroup_global
- Follow us on Twitter @asegroup_global
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor
manufacturing services in assembly and test. Alongside a broad
portfolio of established assembly and test technologies, ASE is
also delivering innovative advanced packaging and system-in-package
solutions to meet growth momentum across a broad range of end
markets, including 5G, AI, Automotive, High Performance Computing,
and more. To learn about our advances in SiP, Fanout, MEMS &
Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all
ultimately geared towards applications to improve lifestyle and
efficiency, please visit: aseglobal.com or follow us on Twitter:
@asegroup_global.
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version on businesswire.com: https://www.businesswire.com/news/home/20220601005622/en/
Media Contacts: North America & Europe: Patricia
MacLeod +1.408.314.9740 patricia.macleod@aseus.com Asia Pacific:
Jennifer Yuen +65 97501975 jennifer.yuen@aseus.com
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