AMD (NASDAQ: AMD) today announced the new AMD Instinct™ MI200
series accelerators, the first exascale-class GPU accelerators. AMD
Instinct MI200 series accelerators includes the world’s fastest
high performance computing (HPC) and artificial intelligence (AI)
accelerator,1 the AMD Instinct™ MI250X.
Built on AMD CDNA™ 2 architecture, AMD Instinct MI200 series
accelerators deliver leading application performance for a broad
set of HPC workloads.2 The AMD Instinct MI250X accelerator provides
up to 4.9X better performance than competitive accelerators for
double precision (FP64) HPC applications and surpasses 380
teraflops of peak theoretical half-precision (FP16) for AI
workloads to enable disruptive approaches in further accelerating
data-driven research.1
“AMD Instinct MI200 accelerators deliver leadership HPC and AI
performance, helping scientists make generational leaps in research
that can dramatically shorten the time between initial hypothesis
and discovery,” said Forrest Norrod, senior vice president and
general manager, Data Center and Embedded Solutions Business Group,
AMD. “With key innovations in architecture, packaging and system
design, the AMD Instinct MI200 series accelerators are the most
advanced data center GPUs ever, providing exceptional performance
for supercomputers and data centers to solve the world’s most
complex problems.”
Exascale With AMDAMD, in collaboration with the
U.S. Department of Energy, Oak Ridge National Laboratory, and HPE,
designed the Frontier supercomputer expected to deliver more than
1.5 exaflops of peak computing power. Powered by optimized 3rd
Gen AMD EPYC™ CPUs and AMD Instinct MI250X accelerators, Frontier
will push the boundaries of scientific discovery by dramatically
enhancing performance of AI, analytics, and simulation at scale,
helping scientists to pack in more calculations, identify new
patterns in data, and develop innovative data analysis methods to
accelerate the pace of scientific discovery.
“The Frontier supercomputer is the culmination of a strong
collaboration between AMD, HPE and the U.S. Department of Energy,
to provide an exascale-capable system that pushes the boundaries of
scientific discovery by dramatically enhancing performance of
artificial intelligence, analytics, and simulation at scale,” said
Thomas Zacharia, director, Oak Ridge National Laboratory.
Powering The Future of HPCThe AMD Instinct
MI200 series accelerators, combined with 3rd Gen AMD EPYC CPUs and
the ROCm™ 5.0 open software platform, are designed to propel new
discoveries for the exascale era and tackle our most pressing
challenges from climate change to vaccine research.
Key capabilities and features of the AMD Instinct MI200 series
accelerators include:
- AMD CDNA™ 2 architecture – 2nd Gen Matrix
Cores accelerating FP64 and FP32 matrix operations, delivering up
to 4X the peak theoretical FP64 performance vs. AMD previous gen
GPUs. 1,3,4
- Leadership Packaging Technology –
Industry-first multi-die GPU design with 2.5D Elevated Fanout
Bridge (EFB) technology delivers 1.8X more cores and 2.7X higher
memory bandwidth vs. AMD previous gen GPUs, offering the industry’s
best aggregate peak theoretical memory bandwidth at 3.2 terabytes
per second. 4,5,6
- 3rd Gen AMD Infinity Fabric™ technology – Up
to 8 Infinity Fabric links connect the AMD Instinct MI200 with
3rd Gen EPYC CPUs and other GPUs in the node to enable
unified CPU/GPU memory coherency and maximize system throughput,
allowing for an easier on-ramp for CPU codes to tap the power of
accelerators.
Software for Enabling Exascale ScienceAMD ROCm™
is an open software platform allowing researchers to tap the power
of AMD Instinct™ accelerators to drive scientific discoveries. The
ROCm platform is built on the foundation of open portability,
supporting environments across multiple accelerator vendors and
architectures. With ROCm 5.0, AMD extends its open platform
powering top HPC and AI applications with AMD Instinct MI200 series
accelerators, increasing accessibility of ROCm for developers and
delivering leadership performance across key workloads.
Through the AMD Infinity Hub, researchers, data scientists and
end-users can easily find, download and install containerized HPC
apps and ML frameworks that are optimized and supported on AMD
Instinct accelerators and ROCm. The hub currently offers a range of
containers supporting either Radeon Instinct™ MI50, AMD Instinct™
MI100 or AMD Instinct MI200 accelerators including several
applications like Chroma, CP2k, LAMMPS, NAMD, OpenMM and more,
along with popular ML frameworks TensorFlow and PyTorch. New
containers are continually being added to the hub.
Available Server
SolutionsThe AMD Instinct MI250X and AMD Instinct MI250
are available in the open-hardware compute accelerator module or
OCP Accelerator Module (OAM) form factor. The AMD Instinct MI210
will be available in a PCIe® card form factor in OEM servers.
The AMD MI250X accelerator is
currently available from HPE in the HPE Cray EX Supercomputer, and
additional AMD Instinct MI200 series accelerators are expected in
systems from major OEM and ODM partners in enterprise markets in Q1
2022, including ASUS, ATOS, Dell Technologies, Gigabyte, Hewlett
Packard Enterprise (HPE), Lenovo, Penguin Computingand
Supermicro.
MI200 Series Specifications
Models |
Compute Units |
Stream Processors |
FP64 | FP32 Vector (Peak) |
FP64 | FP32 Matrix (Peak) |
FP16 | bf16(Peak) |
INT4 | INT8 (Peak) |
HBM2eECCMemory |
Memory Bandwidth |
Form Factor |
AMD Instinct MI250x |
220 |
14,080 |
Up to 47.9 TF |
Up to 95.7 TF |
Up to 383.0 TF |
Up to 383.0 TOPS |
128GB |
3.2 TB/sec |
OCP Accelerator Module |
AMD Instinct MI250 |
208 |
13,312 |
Up to 45.3 TF |
Up to 90.5 TF |
Up to 362.1 TF |
Up to 362.1 TOPS |
128GB |
3.2 TB/sec |
OCP Accelerator Module |
Supporting Resources
- Learn more about AMD Instinct™ Accelerators
- Learn more about AMD HPC Solutions
- Learn more about AMD CDNA™ 2 architecture
- Learn more about the AMD EPYC™ processors
- Become a fan of AMD on Facebook
- Follow AMD on Twitter
- Connect with AMD On LinkedIn
About AMDFor more than 50 years AMD has driven
innovation in high-performance computing, graphics and
visualization technologies ― the building blocks for gaming,
immersive platforms and the data center. Hundreds of millions of
consumers, leading Fortune 500 businesses and cutting-edge
scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD
employees around the world are focused on building great products
that push the boundaries of what is possible. For more information
about how AMD is enabling today and inspiring tomorrow, visit the
AMD (NASDAQ: AMD) website, Facebook, LinkedIn and
Twitter pages.
CAUTIONARY STATEMENTThis press release contains
forward-looking statements concerning Advanced Micro Devices, Inc.
(AMD) such as the features, functionality, performance,
availability, timing and expected benefits of AMD products
including the AMD Instinct™ MI200 series accelerators, which are
made pursuant to the Safe Harbor provisions of the Private
Securities Litigation Reform Act of 1995. Forward-looking
statements are commonly identified by words such as "would," "may,"
"expects," "believes," "plans," "intends," "projects" and other
terms with similar meaning. Investors are cautioned that the
forward-looking statements in this press release are based on
current beliefs, assumptions and expectations, speak only as of the
date of this press release and involve risks and uncertainties that
could cause actual results to differ materially from current
expectations. Such statements are subject to certain known and
unknown risks and uncertainties, many of which are difficult to
predict and generally beyond AMD's control, that could cause actual
results and other future events to differ materially from those
expressed in, or implied or projected by, the forward-looking
information and statements. Material factors that could cause
actual results to differ materially from current expectations
include, without limitation, the following: Intel Corporation’s
dominance of the microprocessor market and its aggressive business
practices; global economic uncertainty; loss of a significant
customer; impact of the COVID-19 pandemic on AMD’s business,
financial condition and results of operations; competitive markets
in which AMD’s products are sold; market conditions of the
industries in which AMD products are sold; cyclical nature of the
semiconductor industry; quarterly and seasonal sales patterns;
AMD's ability to adequately protect its technology or other
intellectual property; unfavorable currency exchange rate
fluctuations; ability of third party manufacturers to manufacture
AMD's products on a timely basis in sufficient quantities and using
competitive technologies; availability of essential equipment,
materials, substrates or manufacturing processes; ability to
achieve expected manufacturing yields for AMD’s products; AMD's
ability to introduce products on a timely basis with expected
features and performance levels; AMD's ability to generate revenue
from its semi-custom SoC products; potential security
vulnerabilities; potential security incidents including IT outages,
data loss, data breaches and cyber-attacks; uncertainties involving
the ordering and shipment of AMD’s products; AMD’s reliance on
third-party intellectual property to design and introduce new
products in a timely manner; AMD's reliance on third-party
companies for design, manufacture and supply of motherboards,
software and other computer platform components; AMD's reliance on
Microsoft and other software vendors' support to design and develop
software to run on AMD’s products; AMD’s reliance on third-party
distributors and add-in-board partners; impact of modification or
interruption of AMD’s internal business processes and information
systems; compatibility of AMD’s products with some or all
industry-standard software and hardware; costs related to defective
products; efficiency of AMD's supply chain; AMD's ability to rely
on third party supply-chain logistics functions; AMD’s ability to
effectively control sales of its products on the gray market;
impact of government actions and regulations such as export
administration regulations, tariffs and trade protection measures;
AMD’s ability to realize its deferred tax assets; potential tax
liabilities; current and future claims and litigation; impact of
environmental laws, conflict minerals-related provisions and other
laws or regulations; impact of acquisitions, joint ventures and/or
investments on AMD's business, including the announced acquisition
of Xilinx, and ability to integrate acquired businesses; AMD’s
ability to complete the Xilinx merger; impact of the announcement
and pendency of the Xilinx merger on AMD’s business; impact of any
impairment of the combined company’s assets on the combined
company’s financial position and results of operation; restrictions
imposed by agreements governing AMD’s notes and the revolving
credit facility; AMD's indebtedness; AMD's ability to generate
sufficient cash to meet its working capital requirements or
generate sufficient revenue and operating cash flow to make all of
its planned R&D or strategic investments; political, legal,
economic risks and natural disasters; future impairments of
goodwill and technology license purchases; AMD’s ability to attract
and retain qualified personnel; AMD’s stock price volatility; and
worldwide political conditions. Investors are urged to review in
detail the risks and uncertainties in AMD’s Securities and Exchange
Commission filings, including but not limited to AMD’s most recent
reports on Forms 10-K and 10-Q.
©2021 Advanced Micro Devices, Inc. All rights reserved. AMD, the
AMD Arrow logo, AMD CDNA, EPYC, AMD Instinct, Infinity Fabric,
Radeon Instinct, ROCm and combinations thereof are trademarks of
Advanced Micro Devices, Inc. PyTorch is a trademark or registered
trademark of PyTorch. TensorFlow, the TensorFlow logo and any
related marks are trademarks of Google Inc. Other product names
used in this publication are for identification purposes only and
may be trademarks of their respective companies.
Additional benchmark data is available on AMD.com
- World’s fastest data center GPU is the AMD Instinct™ MI250X.
Calculations conducted by AMD Performance Labs as of Sep 15, 2021,
for the AMD Instinct™ MI250X (128GB HBM2e OAM module) accelerator
at 1,700 MHz peak boost engine clock resulted in 95.7 TFLOPS peak
theoretical double precision (FP64 Matrix), 47.9 TFLOPS peak
theoretical double precision (FP64), 95.7 TFLOPS peak theoretical
single precision matrix (FP32 Matrix), 47.9 TFLOPS peak theoretical
single precision (FP32), 383.0 TFLOPS peak theoretical half
precision (FP16), and 383.0 TFLOPS peak theoretical Bfloat16 format
precision (BF16) floating-point performance. Calculations conducted
by AMD Performance Labs as of Sep 18, 2020 for the AMD Instinct™
MI100 (32GB HBM2 PCIe® card) accelerator at 1,502 MHz peak boost
engine clock resulted in 11.54 TFLOPS peak theoretical double
precision (FP64), 46.1 TFLOPS peak theoretical single precision
matrix (FP32), 23.1 TFLOPS peak theoretical single precision
(FP32), 184.6 TFLOPS peak theoretical half precision (FP16)
floating-point performance. Published results on the NVidia Ampere
A100 (80GB) GPU accelerator, boost engine clock of 1410 MHz,
resulted in 19.5 TFLOPS peak double precision tensor cores (FP64
Tensor Core), 9.7 TFLOPS peak double precision (FP64). 19.5 TFLOPS
peak single precision (FP32), 78 TFLOPS peak half precision (FP16),
312 TFLOPS peak half precision (FP16 Tensor Flow), 39 TFLOPS peak
Bfloat 16 (BF16), 312 TFLOPS peak Bfloat16 format precision (BF16
Tensor Flow), theoretical floating-point performance. The TF32 data
format is not IEEE compliant and not included in this comparison.
https://www.nvidia.com/content/dam/en-zz/Solutions/Data-Center/nvidia-ampere-architecture-whitepaper.pdf,
page 15, Table 1. MI200-01
- AMD Instinct MI250X accelerator application and benchmark
performance can be found at
https://www.amd.com/en/graphics/server-accelerators-benchmarks.
- Calculations conducted by AMD Performance Labs as of Sep 15,
2021, for the AMD Instinct™ MI250X accelerator (128GB HBM2e OAM
module) at 1,700 MHz peak boost engine clock resulted in 95.7
TFLOPS peak double precision matrix (FP64 Matrix) theoretical,
floating-point performance. Published results on the NVidia Ampere
A100 (80GB) GPU accelerator resulted in 19.5 TFLOPS peak double
precision (FP64 Tensor Core) theoretical, floating-point
performance. Results found
at:https://www.nvidia.com/content/dam/en-zz/Solutions/Data-Center/nvidia-ampere-architecture-whitepaper.pdf,
page 15, Table 1.MI200-02
- Calculations conducted by AMD Performance Labs as of Sep 21,
2021, for the AMD Instinct™ MI250X and MI250 (128GB HBM2e) OAM
accelerators designed with AMD CDNA™ 2 6nm FinFet process
technology at 1,600 MHz peak memory clock resulted in 128GB HBM2e
memory capacity and 3.2768 TFLOPS peak theoretical memory bandwidth
performance. MI250/MI250X memory bus interface is 4,096 bits times
2 die and memory data rate is 3.20 Gbps for total memory bandwidth
of 3.2768 TB/s ((3.20 Gbps*(4,096 bits*2))/8).The highest published
results on the NVidia Ampere A100 (80GB) SXM GPU accelerator
resulted in 80GB HBM2e memory capacity and 2.039 TB/s GPU memory
bandwidth
performance.https://www.nvidia.com/content/dam/en-zz/Solutions/Data-Center/a100/pdf/nvidia-a100-datasheet-us-nvidia-1758950-r4-web.pdf
MI200-07
- The AMD Instinct™ MI250X accelerator has 220 compute units
(CUs) and 14,080 stream cores. The AMD Instinct™ MI100 accelerator
has 120 compute units (CUs) and 7,680 stream cores. MI200-027
- Calculations conducted by AMD Performance Labs as of Sep 21,
2021, for the AMD Instinct™ MI250X and MI250 (128GB HBM2e) OAM
accelerators designed with AMD CDNA™ 2 6nm FinFet process
technology at 1,600 MHz peak memory clock resulted in 3.2768 TFLOPS
peak theoretical memory bandwidth performance. MI250/MI250X memory
bus interface is 4,096 bits times 2 die and memory data rate is
3.20 Gbps for total memory bandwidth of 3.2768 TB/s ((3.20
Gbps*(4,096 bits*2))/8). Calculations by AMD Performance Labs as of
OCT 5th, 2020 for the AMD Instinct™ MI100 accelerator designed with
AMD CDNA 7nm FinFET process technology at 1,200 MHz peak memory
clock resulted in 1.2288 TFLOPS peak theoretical memory bandwidth
performance. MI100 memory bus interface is 4,096 bits and memory
data rate is 2.40 Gbps for total memory bandwidth of 1.2288 TB/s
((2.40 Gbps*4,096 bits)/8) MI200-33
Contacts:
Aaron Grabein
AMD Communications
+1 512-602-8950
Aaron.Grabein@amd.com
Laura Graves
AMD Investor Relations
+1 408-749-5467
Laura.Graves@amd.com
Advanced Micro Devices (NASDAQ:AMD)
Historical Stock Chart
From Mar 2024 to Apr 2024
Advanced Micro Devices (NASDAQ:AMD)
Historical Stock Chart
From Apr 2023 to Apr 2024