Veeco Announces Capacity Expansion Plan for Laser Annealing Technology That Serves the World’s Leading Semiconductor Custom...
February 25 2021 - 04:15PM
Veeco Instruments Inc. (NASDAQ: VECO) today announced plans to
expand its manufacturing capabilities in San Jose, California to
meet growing demand for its advanced laser annealing technology
that serves the world’s leading semiconductor technology companies.
Veeco’s new, SEMI-compliant facility will serve as the company’s
center of excellence for the development and production of laser
annealing and advanced packaging lithography systems for
semiconductor applications.
“As Veeco continues to deliver world-class laser
annealing systems to our Semiconductor customers, it is essential
that we begin our expansion process in the Silicon Valley area,”
said William J. Miller, Ph.D., Chief Executive Officer, Veeco. “We
see clear indications that our laser annealing technologies are
becoming an increasingly critical part of semiconductor
manufacturing where device architecture and scale drive new
material challenges. Veeco delivers the advanced solutions our
customers need to bring new and more demanding applications to
market. We are excited about the expansion not only as a crucial
part of executing Veeco’s growth plan, but also as a catalyst in
helping our customers bring new technologies to market.”
Advanced semiconductor device scaling requires
higher temperature for dopant activation with shorter time at
temperature to avoid dopant diffusion. Veeco’s patented LSA101® and
LSA201® Laser Spike Annealing (LSA) Systems deliver the highest
temperatures in the microsecond time scale. The unique nature of
the LSA platform enables our customers to anneal complex patterns
with high temperature uniformity and precision, which is highly
desired in advanced device processing.
“We are excited to enter this stage of Veeco’s
expansion plan for our laser annealing systems as demand
accelerates for critical process steps at advanced nodes for logic
and advanced memory applications,” commented Adrian Devasahayam,
Ph.D., Senior Vice President, Product Line Manager. “The
configuration of the new facility will allow for accelerated
product development, expedited system shipments and an enhanced
customer demo experience.”
Veeco’s new, leased facility will feature
approximately 70,000 square-feet of manufacturing and engineering
lab space and 30,000 square-feet of office space. Manufacturing
space will be nearly double that of Veeco’s current San Jose
facility and will improve efficiency. The build-out of the new
facility will result in a period of duplicate expenses until the
transition is completed. Capital expenditures associated with this
project are expected to be between $30 million and $40 million
dollars over the next two years. The initial term of the lease is
through 2037, with two renewal options for Veeco to extend the
lease for a period of three years each.
About Veeco Veeco (NASDAQ:
VECO) is an innovative manufacturer of semiconductor process
equipment. Our proven ion beam, laser annealing, lithography, MOCVD
and single wafer etch & clean technologies play an integral
role in the fabrication and packaging of advanced semiconductor
devices. With equipment designed to optimize performance, yield and
cost of ownership, Veeco holds leading technology positions in the
markets we serve. To learn more about Veeco’s systems and service
offerings, visit www.veeco.com.
Veeco
Contacts |
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Investors:Media: |
Anthony BencivengaKevin Long |
(516) 252-1438(516) 714-3978 |
abencivenga@veeco.comklong@veeco.com |
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