Tower Semiconductor Announces Third Quarter 2020 Financial Results and Conference Call
October 12 2020 - 6:00AM
MIGDAL HAEMEK, Israel – October 12,
2020 – Tower Semiconductor (NASDAQ/ TASE: TSEM), the
leading foundry of high-value analog semiconductor solutions, will
issue its third quarter 2020 earnings release on Thursday, November
12, 2020.
The Company will hold a conference call on
Thursday, November 12, 2020, at 10:00 a.m. Eastern Time (09:00 a.m.
Central, 08:00 a.m. Mountain, 07:00 a.m. Pacific and 05:00 p.m.
Israel time) to discuss its third quarter 2020 financial results,
fourth-quarter 2020 guidance, business outlook as well as will
provide additional information on its recent cyber event and
actions taken. Further to the expeditious recovery of
operations of its manufacturing facilities after the cyber event,
the Company expects the third-quarter revenues to be within its
previously announced guidance range.
This call will be webcasted and can be accessed
through the Investor Relations section on Tower Semiconductor’s
website at https://ir.towersemi.com/ or can also
be accessed by calling the following numbers: U.S. Toll Free:
1-888-642-5032; Israel: 03-918-0644; International:
+972-3-918-0644. The teleconference will be available for replay
for 90 days.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leading
foundry of high value analog semiconductor solutions, provides
technology and manufacturing platforms for integrated circuits
(ICs) in growing markets such as consumer, industrial, automotive,
mobile, infrastructure, medical and aerospace and defense. Tower
Semiconductor focuses on creating positive and sustainable impact
on the world through long term partnerships and its advanced and
innovative analog technology offering, comprised of a broad range
of customizable process platforms such as SiGe, BiCMOS,
mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors,
integrated power management (BCD and 700V), and MEMS. Tower
Semiconductor also provides world-class design enablement for a
quick and accurate design cycle as well as Transfer Optimization
and development Process Services (TOPS) to IDMs and fabless
companies. To provide multi-fab sourcing and extended capacity for
its customers, Tower Semiconductor operates two manufacturing
facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and
three facilities in Japan (two 200mm and one 300mm) through TPSCo.
For more information, please visit: www.towersemi.com
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority. Tower does not intend
to update, and expressly disclaim any obligation to update, the
information contained in this release.
###
Contact Information: Tower Semiconductor
Investor Relations | Noit Levy, +972 4 604 7066 |
noitle@towersemi.com
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