MACOM Demonstrates Open Eye MSA Compliant Analog Chipset at CIOE 2019
September 05 2019 - 9:00AM
Business Wire
- Analog chipset features a four-channel transmit CDR with
integrated laser driver, quad TIA and a four-channel CDR on the
receive side
- MACOM’s Open Eye MSA compliant analog chipset is interoperable
with multiple vendors and enables 200G (4 x 53Gbps) QSFP
modules
- MACOM will host live demonstrations of the chipset enabled
module at CIOE 2019 in the MACOM booth #1A32
MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of
semiconductor solutions, today announced a live demonstration of a
complete 200G optical module solution designed in collaboration
with an industry leading optical manufacturer, leveraging MACOM’s
Open Eye MSA compliant analog chipset. The chipset is optimized for
volume-scale deployment in high-density Cloud Data Center
links.
This press release features multimedia. View
the full release here:
https://www.businesswire.com/news/home/20190905005090/en/
Targeted for faster, power efficient and
lower cost optical interconnects, the chipset aims to provide a
clear pathway to 200G throughput speeds utilizing industry leading
analog components. MACOM’s fully analog transmit and receive
chipset is comprised of the MAOM-38053 four-channel transmit CDR
with integrated laser driver and, on the receive side, features
MACOM BSP56B photodetectors, a MATA-03819 quad TIA and the
MASC-38040 four-channel receive CDR. (Photo: Business Wire)
Targeted for faster, power efficient and lower cost optical
interconnects, the chipset aims to provide a clear pathway to 200G
throughput speeds utilizing industry leading analog components.
MACOM’s fully analog transmit and receive chipset is comprised of
the MAOM-38053 four-channel transmit CDR with integrated laser
driver and, on the receive side, features MACOM BSP56B
photodetectors, a MATA-03819 quad TIA and the MASC-38040
four-channel receive CDR.
MACOM is applying its expertise and market leadership in 25Gbps
and 100Gbps solutions to 50Gbps PAM-4 applications and specifically
to 200G QSFP and 2 x 200G OSFP/QSFP-DD modules to bring the
benefits of low power and low latency solutions in addition to
existing digital signal processing (DSP) architectures, to Cloud
Data Centers.
All of the MACOM analog chipset products mentioned in this
release are Open Eye MSA compliant and interoperable with multiple
vendors. MACOM’s chipset is sampling to customers today and can be
utilized for both single mode and multimode fiber applications.
CIOE 2019 attendees are invited to visit with MACOM’s booth #1A32
to preview the live demonstration and learn more about the
chipset.
ABOUT MACOM: MACOM designs and manufactures semiconductor
products for Data Center, Telecommunication and Industrial and
Defense applications. Headquartered in Lowell, Massachusetts, MACOM
has design centers and sales offices throughout North America,
Europe and Asia. MACOM is certified to the ISO9001 international
quality standard and ISO14001 environmental management
standard.
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version on businesswire.com: https://www.businesswire.com/news/home/20190905005090/en/
FOR SALES INFORMATION, PLEASE CONTACT: North Americas –
Phone: +1.800.366.2266 Europe – Phone: +353.21.244.6400 India –
Phone: +91.80.43537383 China – Phone: +86.21.2407.1588
MEDIA CONTACTS: Ozzie Billimoria MACOM +1 978-656-2896
ozzie.billimoria@macom.com
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