MACOM to Showcase High Speed Analog PON and 100G Data Center Components at CIOE 2019
August 26 2019 - 9:00AM
Business Wire
MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of
semiconductor solutions, will showcase its optoelectronic and
photonic components at the China International Optoelectronic
Exposition (CIOE) 2019 in Shenzhen, China, September 4th – 7th,
Booth #1A32. CIOE is the world’s leading exhibition in the
optoelectronic and photonic industry.
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the full release here:
https://www.businesswire.com/news/home/20190826005014/en/
Our complete and robust portfolio
includes high-performance modulator drivers, transimpedance
amplifiers (TIAs), clock/data recovery circuits (CDR), crosspoint
switches, APDs, pin photodiodes, FP and DFB lasers, mixed signal
PHYs and PAM-4 for enterprise and telecom optical systems operating
up to 100/200/400 Gbps and beyond. (Photo: Business Wire)
Meet with MACOM and learn how our broad portfolio of components
is enabling high bandwidth and low latency, addressing the
high-performance analog interfaces between electrical and optical
domains, and providing solutions aimed at meeting the demanding
size, power and signal integrity requirements of today’s high-speed
next-generation PON, Wireless and Wireline Telecom and Cloud Data
Center networks.
Our complete and robust portfolio includes high-performance
modulator drivers, transimpedance amplifiers (TIAs), clock/data
recovery circuits (CDR), crosspoint switches, APDs, pin
photodiodes, FP and DFB lasers, mixed signal PHYs and PAM-4 for
enterprise and telecom optical systems operating up to 100/200/400
Gbps and beyond.
Join the Next Generation with MACOM at Booth #1A32 to learn more
about:
- PON Components: 10/25 Gbps-PON ONU/OLT
- Telecom Portfolio: 25Gbps CDR, TIA and driver
portfolios, 25Gbps FP lasers, APD photodiodes and 50 Gbps PAM-4
chipset
- Data Center Components: 100 Gbps CWDM4, DR1/FR1/LR1 and
100/200/400 Gbps PAM-4
- Long-Haul and Metro Components: 64 GBaud driver and
TIA
Members of MACOM’s product management, engineering and
applications teams will be available at Booth #1A32 to answer
questions.
Show Information: Shenzhen Convention and Exhibition
Center
- Wednesday, September 4th 9:00 AM – 5:00 PM
- Thursday, September 5th 9:00 AM – 5:00 PM
- Friday, September 6th 9:00 AM – 5:00 PM
- Saturday, September 7th 9:00 AM – 4:00 PM
For more information, visit Booth #1A32 at CIOE or contact us
via www.macom.com.
ABOUT MACOM: MACOM designs and manufactures semiconductor
products for Data Center, Telecommunication and Industrial and
Defense applications. Headquartered in Lowell, Massachusetts, MACOM
has design centers and sales offices throughout North America,
Europe and Asia. MACOM is certified to the ISO9001 international
quality standard and ISO14001 environmental management
standard.
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version on businesswire.com: https://www.businesswire.com/news/home/20190826005014/en/
FOR SALES INFORMATION, PLEASE CONTACT: North Americas –
+1.800.366.2266 Europe – Phone: +353.21.244.6400 India – Phone:
+91.80.43537383 China – Phone: +86.21.2407.1588
MEDIA CONTACTS: Ozzie Billimoria MACOM +1 978-656-2896
ozzie.billimoria@macom.com
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