Aehr Receives Initial Order from New Customer for Newly Released FOX-CP™ System for 100% Test and Burn-in of Devices Within...
May 07 2019 - 7:30AM
Aehr Test Systems
(NASDAQ: AEHR),
a worldwide supplier of semiconductor test and burn-in equipment,
today announced it has received an initial order from a new
customer for its FOX-CP TM single-wafer test and burn-in system.
This new lost-cost compact system will be used to perform 100% test
and burn-in of the customer’s new device for high-volume production
over a multi-year ramp of products in the enterprise and data
center market.
The over $1.2 million order includes a FOX-CP System configured
with 2,048 independent universal test resources, multiple
proprietary high-power WaferPak contactors, and an integrated high
power and fully automated high force chuck wafer prober. The
shipment is expected during the second calendar quarter of 2019.
The customer forecasts additional FOX-CP systems to be delivered to
multiple locations worldwide where Aehr Test will support the
turnkey solution directly with Aehr Test personnel.
Gayn Erickson, President and CEO of Aehr, commented, “We
are delighted to begin this relationship with this major new
customer for our FOX-CP system for 100% test and burn-in of
devices, versus sampling, that will be used in a very high-volume
application for the Enterprise and Data Center market, with a build
out of this production ramp over the new several years. IDC,
a global provider of market intelligence for the information
technology, telecommunications, and consumer technology markets,
recently released a report forecasting that the collective sum of
the world’s data will grow from 33 zettabytes in 2018 to 175
zettabytes by 2025, for a compounded annual growth rate of 61
percent. A zettabyte is one trillion gigabytes. We see the data
storage market, as well as multiple devices related to the
worldwide 5G build-out, as critical new opportunities for our
systems, where these end markets and customers require devices to
have extremely high levels of quality and long-term
reliability.”
The FOX-CP single-wafer test system reduces test cost by
functionally testing wafers during reliability screening to
identify failing logic, memory and photonic die before integration
into their final package. This integrated test system, with wafer
handling and stepping capabilities, utilizes Aehr’s custom FOX
WaferPak™ contactor and wafer prober with thermal chucks to support
a wide range of wafer power requirements. Key features of the
FOX-CP include:
- 2,048 “Universal Channels” per wafer, enabling massively
parallel test.
- Innovative “Universal Channel” architecture, where any channel
can be any function (I/O, Device Power Supply (DPS) or Per-pin
Precision Measurement Unit (PPMU)).
- Configurable with Universal Channel Modules, High Voltage
Channel Modules or High Current Channel Modules.
- Ability to perform single touchdown or multiple touchdown wafer
probing.
- Available as an integrated solution with fully automated wafer
prober and custom-designed WaferPak Contactor.
FOX-P PlatformAehr’s FOX-P platform is the
company’s next-generation multi-wafer and singulated die/module
test solution that is capable of functional test and
burn-in/cycling of photonics devices, flash memories,
microcontrollers, sensors, and other leading-edge ICs before they
are assembled into single or multi-die stacked packages. The FOX-P
family of test and burn-in low cost small foot print configurable
products includes the FOX-CP single-wafer system, FOX-NP 2 wafer
system and FOX-XP 18 wafer system. The FOX-P wafer-level systems
utilize Aehr’s FOX WaferPak contactors, which provide cost
effective solutions for making electrical contact with a full wafer
or substrate in a multi-wafer environment. The configuration with
the DiePak® Carriers enables burn-in of singulated die and
multi-die modules to screen for defects in both the die and the
module assembly process. The resulting known-good die (KGD),
single-die or stacked-die packaged parts can then be used for high
reliability and quality applications such as enterprise solid state
drives, automotive devices, highly valuable mobile applications,
and mission critical integrated circuits and sensors.
The key features of the FOX-P platform that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test system
may be configured with up to 18 blades of wafer test resources,
enabling up to 18 wafers to be tested simultaneously. The footprint
of the 18-wafer FOX-XP test system is similar to the footprint of
typical semiconductor Automatic Test Equipment (ATE) that can only
test one wafer at a time. The highly integrated 2-blade FOX-NP
system has a very small footprint and is designed to be easily
integrated into product design, reliability and test lab
applications. The new FOX-CP single-wafer system is integrated with
a wafer prober and performs wafer-level testing and reliability
screening.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr’s expectations, beliefs, intentions or strategies
regarding its products, including statements regarding future
market opportunities and conditions, expected product shipment
dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr’s products, the ability of new products to meet
customer needs or perform as described, as well as general market
conditions and Aehr’s ability to execute on its business strategy.
See Aehr’s recent 10-K, 10-Q and other reports from time to time
filed with the Securities and Exchange Commission for a more
detailed description of the risks facing Aehr’s business. Aehr
disclaims any obligation to update information contained in any
forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts:
Aehr Test
SystemsVernon RogersEVP Sales and Marketing(510) 623-9400
215vrogers@aehr.com |
MKR Group
Inc.Todd Kehrli or Jim ByersAnalyst/Investor
Contact (323) 468-2300aehr@mkr-group.com |
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