Cohu Introduces Infra-Red Automated Optical Inspection Module
July 09 2018 - 4:05PM
Business Wire
Cohu, Inc. (NASDAQ: COHU), a leading supplier of semiconductor
test and inspection equipment, today announced the introduction of
the new Infra-Red Automated Optical Inspection (AOI) module for
enhanced micro-crack and sub-surface defect detection on
wafer-level chipscale packages (WLCSPs).
The continuous increase of product quality requirements in IoT,
mobility and automotive markets are driving the need for upstream
detection of silicon defects on integrated circuits, which are not
otherwise identifiable via electrical test. This is a growing
segment in semiconductor inspection with increasing volume of
WLCSPs and advanced packaging.
Infra-Red imaging has the ability to see through silicon,
inspecting the structure underneath the surface that is not
otherwise observable with traditional vision inspection systems.
Cohu’s new vision module offers a breakthrough by integrating
infra-red imaging onto a high-speed automation platform that
delivers an economical solution for high quality inspection. This
new module, in combination with previously announced Aquilae
inspection and 3D Flex metrology, further strengthens Cohu’s
differentiation in the growing semiconductor inspection market.
Cohu will demonstrate the Infra-Red AOI module and other
innovative products during the SEMICON West show in San Francisco
at booth #5650 from July 10 to July 12, 2018.
About Cohu:
Cohu is a leading supplier of semiconductor test and inspection
handlers, micro-electro mechanical system (MEMS) test modules, test
contactors and thermal sub-systems used by global semiconductor
manufacturers and test subcontractors.
Forward-Looking Statements:
Certain matters discussed in this release, including statements
concerning Cohu's Infra-Red Automated Optical Inspection capability
and WLCSP segment growth are forward-looking statements that are
subject to risks and uncertainties that could cause actual results
to differ materially from those projected or forecasted. Such risks
and uncertainties include, but are not limited to, risks associated
with our ability to convert new products into production on a
timely basis and to support product development and meet customer
delivery and acceptance requirements for new products; our reliance
on third-party contract manufacturers and suppliers; failure to
obtain customer acceptance resulting in the inability to recognize
revenue and accounts receivable collection problems; revenue
recognition impacts due to ASC 606; market demand and adoption of
our new products; customer orders may be canceled or delayed; the
concentration of our revenues from a limited number of customers;
intense competition in the semiconductor equipment industry; our
reliance on patents and intellectual property; compliance with U.S.
export regulations; geopolitical issues; the seasonal, volatile and
unpredictable nature of capital expenditures by semiconductor
manufacturers; and rapid technological change. These and other
risks and uncertainties are discussed more fully in Cohu's filings
with the Securities and Exchange Commission, including the most
recently filed Form 10-K and Form 10-Q, and in the Registration
Statement on Form S-4 that has been filed by Cohu with the SEC
containing a prospectus with respect to the Cohu common stock to be
issued in the proposed Xcerra transaction and a joint proxy
statement of Cohu and Xcerra in connection with the proposed
transaction that is contained therein. The forward-looking
statements included in this release are not assurances, and speak
only as of the date of this release, and Cohu does not undertake
any obligation to update these forward-looking statements to
reflect subsequent events or circumstances.
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version on businesswire.com: https://www.businesswire.com/news/home/20180709005657/en/
CohuJeffrey D. Jones, 858-848-8106Investor Relations
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