MOUNTAIN VIEW, Calif.,
Oct. 17, 2017 /PRNewswire/ --
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal
processing IP for smarter, connected devices, announced today a
partnership with LG Electronics, a global leader in consumer
electronics and appliances, to deliver a high-performance, low-cost
smart 3D camera solution for consumer electronics and robotic
applications.
The 3D camera module incorporates a Rockchip RK1608 coprocessor
with multiple CEVA-XM4 imaging and vision DSPs, which provide the
processing power to perform a wide variety of 3D sensing
applications. These include biometric face authentication, 3D
reconstruction, gesture/posture tracking, obstacle detection, AR
and VR. Computer vision experts from CEVA, Rockchip and LG worked
closely together to optimize LG's proprietary algorithms for the
CEVA-XM4 using CEVA's tool kit and optimized algorithm libraries
ensuring optimal performance under stringent power constraints.
"There is a clear demand for cost-efficient 3D camera sensor
modules to enable an enriched user experience for smartphones, AR
and VR devices and to provide a robust localization and mapping
(SLAM) solution for robots and autonomous cars," said Shin Yun-sup, principal engineer at LG
Electronics. "Through our collaboration with CEVA, we are
addressing this demand with a fully-featured compact 3D module,
offering exceptional performance thanks to our in-house algorithms
and the CEVA-XM4 imaging and vision DSP."
"We're delighted to announce our collaboration with LG for the
3D camera module market," said Ilan
Yona, vice president and general manager of the Vision
Business Unit at CEVA. Our CEVA-XM family of imaging and vision
DSPs and software development environment allows companies like LG
to deploy their in-house developed computer vision and deep
learning technologies quickly and efficiently."
LG will be presenting and demonstrating their smart 3D module at
the CEVA Technology Symposium Series in China and Taiwan, October
23rd to October
27th, 2017. Visitors can meet computer vision
experts from CEVA and LG at these events. For more information on
how to register, please visit the Symposium website at
http://events.ceva-dsp.com/symposium-2017-en/.
CEVA's latest generation imaging and vision DSP platforms
address the extreme processing requirements and low power
constraints of the most sophisticated machine learning and machine
vision applications used in smartphones, surveillance, augmented
reality, sense and avoid drones and self-driving cars. These
DSP-based platforms include a hybrid architecture composed of
scalar and vector DSP processors coupled with a comprehensive
Application Development Kit (ADK) to streamline software
deployment. The CEVA ADK includes: CEVA-Link for seamless software
level integration with a host processor; a range of widely used and
optimized software algorithms; the CEVA Deep Neural Network (CDNN2)
real-time Neural Network software framework which streamlines
machine learning deployment at a fraction of the power consumption
of the leading GPU-based systems, and; state-of-the-art development
and debugging tools. For more information, visit
http://www.ceva-dsp.com/app/imaging-computer-vision/.
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter,
connected world. We partner with semiconductor companies and OEMs
worldwide to create power-efficient, intelligent and connected
devices for a range of end markets, including mobile, consumer,
automotive, industrial and IoT. Our ultra-low-power IPs for vision,
audio, communications and connectivity include comprehensive
DSP-based platforms for LTE/LTE-A/5G baseband processing in
handsets, infrastructure and machine-to-machine devices, advanced
imaging, computer vision and deep learning for any camera-enabled
device, audio/voice/speech and ultra-low power always-on/sensing
applications for multiple IoT markets. For connectivity, we offer
the industry's most widely adopted IPs for Bluetooth (low energy
and dual mode), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial
storage (SATA and SAS). Visit us at www.ceva-dsp.com and follow us
on Twitter, YouTube and LinkedIn.
Logo -
http://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg
View original
content:http://www.prnewswire.com/news-releases/ceva-and-lg-electronics-partner-for-smart-3d-camera-solution-300537628.html
SOURCE CEVA, Inc.