NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module
October 17 2017 - 2:00AM
News Highlights:
NXP Semiconductors N.V. (NASDAQ:NXPI) today announced its new,
ultra-thin contactless chip module that transforms how passport and
identity cards are designed. Measuring just 200 μm thick – roughly
four times the thickness of an average human hair – the MOB10 is 20
percent thinner than its predecessor and is ideally suited for use
in ultra-thin inlays for passport data pages and identity cards.
The MOB10 is the thinnest contactless module available in high
volumes today and supports polycarbonate technology, along with new
security and durability features. Additionally, the MOB10 is the
first ultra-thin platform designed to be compatible with existing
production lines so manufacturers can add it without retooling;
allowing them to support multiple products without increasing costs
or slowing down production.
The new ultra-thin MOB10 is designed to combat electronic
document fraud by enabling slimmer and more secure eDatapages,
eCovers and ID card inlays that are harder to forge or modify. The
ultra-thin profile of 200 μm makes it possible to accommodate new
security features and still include the secure microcontroller and
its antenna without adding bulk to passports, national eID cards,
eHealth cards, citizenship cards, resident cards, driver licenses,
and smart cards. For passports, the MOB10 now allows the IC to be
moved from the cover of the passport booklet to the personal data
page within the inside of the passport. This new feature offers
additional security by preventing attempts to peel off or re-insert
the IC after tampering. Additionally, the MOB10 is designed to
reduce micro-cracks, sustain mechanical and environmental stresses,
and is less susceptible to reverse-engineering or other security
attacks.
“We are experiencing increased demand for slimmer solutions that
can meet the future embedding requirements needed to produce
thinner, and more cost-effective identity documents,” said
Sebastien Clamagirand, general manager of the secure identification
business line at NXP. “As the world’s thinnest contactless chip
module, the MOB10 is uniquely suited to answer this need and will
empower a new generation of passports and ID cards that are
thinner, more durable and even more secure than ever before.”
The MOB10 is designed for high volume and offers higher density
per reel. This feature optimizes machine throughput and storage
space, so manufacturers of identity documents can reduce cost,
operate more efficiently, and deliver more resilient end products.
To ensure flexibility in implementation, the MOB10 solution is
compatible with ICAO 9303 and ISO/IEC 14443 standards.
NXP Webinar To learn more about the MOB10, NXP
will host a webinar on Wednesday, November 8 between 12-8 a.m. PST.
To register for the free webinar, click here.
About NXP SemiconductorsNXP Semiconductors N.V.
(NASDAQ:NXPI) enables secure connections and infrastructure for a
smarter world, advancing solutions that make lives easier, better
and safer. As the world leader in secure connectivity solutions for
embedded applications, NXP is driving innovation in the secure
connected vehicle, end-to-end security & privacy, and smart
connected solutions markets. Built on more than 60 years of
combined experience and expertise, the company has 31,000 employees
in more than 33 countries and posted revenue of $9.5 billion in
2016. Find out more at www.nxp.com.
NXP and the NXP logo are trademarks of NXP B.V. All other
product or service names are the property of their respective
owners. All rights reserved. © 2017 NXP B.V.
For more information, please
contact:
Americas |
Greater China/Asia |
Europe |
Tate
Tran |
Esther
Chang |
Martijn van
der Linden |
Tel: +1 408
802 0602 |
Tel: +886 2
8170 9990 |
Phone: +31
6 1091 4896 |
Email:
tate.tran@nxp.com
|
Email:
esther.chan@nxp.com
|
Email:
martijn.van.der.linden@nxp.com |
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