Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays With New Automotive MCU Solution
October 16 2017 - 8:00AM
Business Wire
Newest Member of Traveo™ Microcontroller Family
Integrates More Onboard Memory with a 3D and 2.5D Graphic Engine in
a Single-chip, Scalable Solution
Cypress Semiconductor Corp. (NASDAQ: CY) today announced a new
series in its Traveo™ automotive microcontroller (MCU) family with
more memory to support a hybrid instrument cluster with 3D graphics
and up to 6 traditional gauges, as well as a head-up display. The
highly integrated, single-chip devices in the S6J32xEK series
include an advanced 3D and 2.5D graphics engine and provide
scalability with Cypress’ low-pin-count HyperBus™ memory interface.
The series continues Cypress’ expansion of its broad automotive
portfolio with differentiated system performance via its MCUs,
wireless radios, capacitive-touch solutions, memories and Power
Management ICs (PMICs). More information on the Traveo MCU family
is available at http://www.cypress.com/traveo.
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Pictured is Cypress' Traveo automotive
MCU for instrument cluster applications. (Photo: Business Wire)
“Our automotive customers are looking to integrate increasingly
more dynamic 3D graphics in their hybrid instrument cluster and
head-up displays to appeal to consumers,” said Mathias Braeuer,
product marketing director of the Automotive Business Unit at
Cypress. “Cypress developed our new Traveo MCU series specifically
to provide a scalable, cost-effective, single-chip solution to
address these applications, and we are pleased to having some of
the world’s leading automotive suppliers designing in this
solution.”
The Traveo S6J32xEK series integrates up to 4MB of high-density
embedded flash, 512 KB RAM and 2MB of Video RAM, an Arm® Cortex®-R5
core at 240-MHz performance, a Low-Voltage Differential Signaling
(LVDS) video output, a Low-Voltage Transistor-Transistor Logic
(LVTTL) video output and a 6x stepper motor control. This
combination enables the devices to serve as single-chip solutions
to drive two displays. The devices have up to two 12-pin HyperBus
memory interfaces that dramatically improve read and write
performance of graphical data and other data or code. A single
HyperBus interface can be used to connect to two memories for
Firmware Over-The-Air (FOTA) updates, which enable end-users to get
software fixes and new features and applications for their vehicles
on-the-go. The devices support all in-vehicle networking standards
required for instrument clusters, including Controller Area
Network-Flexible Data (CAN-FD) and Ethernet AVB. Additionally, the
series provides robust security with integrated enhanced secure
hardware extension (eSHE) support.
The Traveo S6J32xEK series include 50 channels of 12-bit Analog
to Digital Converters (ADC), 12 channels of multi-function serial
interfaces and I2S interfaces with an AUDIO DAC to output the
complex, high-quality sounds required in today’s instrument
clusters. The devices’ support for Ethernet AVB delivers increased
bandwidth in multimedia applications and reduced programming time.
The S6J32xEK series offers functional safety features to support
Automotive Safety Integrity Level (ASIL) B, and the devices feature
a wide ambient temperature range of -40˚C to +105˚C. The Traveo
family is backed by a comprehensive tools and software ecosystem
that simplifies system integration, including AUTOSAR MCAL 4.0.3
support.
Availability
The Traveo S6J32xEK series is sampling now and will be in
production in the first quarter of 2018. The MCUs are available in
a 208-pin and 216-pin thermally enhanced quad flat package
(TEQFP).
Cypress Enables Leading-Edge Automotive Systems
Cypress works with the world's top automotive companies to bring
leading-edge automotive systems typical of luxury models to
mainstream vehicles, including Advanced Driver Assistance Systems
(ADAS), 3-D graphics displays, wireless connectivity, full-featured
touchscreens and superior body electronics. Cypress’ automotive
portfolio includes the Traveo MCU family, power-management ICs
(PMICs), PSoC® programmable system-on-chip solutions,
CapSense® capacitive-sensing solutions,
TrueTouch® touchscreens, NOR flash, F-RAM™ and SRAM memories,
and USB, Wi-Fi® and Bluetooth® connectivity solutions. The
portfolio is backed by Cypress' commitment to zero defects,
excellent service and adherence to the most stringent industry
standards, such as the ISO/TS 16949 quality management system,
the Automotive Electronics Council (AEC) guidelines for
ICs and the Production Part Approval Process (PPAP). Learn more
at www.cypress.com/automotive.
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About Cypress
Cypress is the leader in advanced embedded system solutions for
the world’s most innovative automotive, industrial, home automation
and appliances, consumer electronics and medical products. Cypress’
programmable systems-on-chip, general-purpose microcontrollers,
analog ICs, wireless and USB-based connectivity solutions and
reliable, high-performance memories help engineers design
differentiated products and get them to market first. Cypress is
committed to providing customers with the best support and
engineering resources on the planet enabling innovators and
out-of-the-box thinkers to disrupt markets and create new product
categories in record time. To learn more, go to
www.cypress.com.
Cypress, the Cypress logo, PSoC and CapSense are registered
trademarks and Traveo, HyperBus and F-RAM are trademarks of Cypress
Semiconductor Corp. All other trademarks are property of their
owners.
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Cypress PRSamer Bahou, 408-232-4552samer.bahou@cypress.com
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