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| Company Name | Stock Ticker Symbol | Market | Type |
|---|---|---|---|
| ACM Research Inc | ACMR | NASDAQ | Common Stock |
| Price Change | Change Percent | Stock Price | Last Traded
|
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|---|---|---|---|---|
| 0.00 | 0.00% | 28.21 | 20:00:00 |
| Open Price | Low Price | High Price | Close Price | Prev Close |
|---|---|---|---|---|
| 28.21 |
| Trades | Volume | Avg Volume | 52 Week Range |
|---|---|---|---|
| 0 | 0 | - | 8.75 - 34.3507 |
| Last Trade Time | Type | Quantity | Stock Price | Currency |
|---|---|---|---|---|
| - | 0 | $ 28.21 | USD |
ACM Research (ACMR) Options Flow Summary
ACM Research Inc Financials
| Market Cap | Shares in Issue | Float | Revenue | Profit/Loss | EPS | PE Ratio |
|---|---|---|---|---|---|---|
| 1.72B | 61.10M | - | 557.72M | 77.35M | 1.27 | 22.29 |
| Short Interest | Dividends Per Share | Dividend Yield | Ex-Div Date | Insider B/S | Insider % Owned |
|---|---|---|---|---|---|
| - | - | - | - |
ACM Research News
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Historical ACMR Price Data
| Period | Open | High | Low | VWAP | Avg. Daily Vol | Change | % |
|---|---|---|---|---|---|---|---|
| 1 Week | 31.36 | 31.70 | 28.01 | 29.01 | 1,144,468 | -3.15 | -10.04% |
| 1 Month | 27.75 | 33.40 | 24.07 | 29.71 | 1,378,427 | 0.46 | 1.66% |
| 3 Months | 21.50 | 34.3507 | 15.70 | 26.43 | 1,776,258 | 6.71 | 31.21% |
| 6 Months | 18.96 | 34.3507 | 12.53 | 22.50 | 1,473,777 | 9.25 | 48.79% |
| 1 Year | 10.39 | 34.3507 | 8.75 | 19.64 | 1,122,435 | 17.82 | 171.51% |
| 3 Years | 81.81 | 119.12 | 5.46 | 25.69 | 784,153 | -53.60 | -65.52% |
| 5 Years | 15.58 | 144.8065 | 5.46 | 32.62 | 606,279 | 12.63 | 81.07% |
ACM Research Description
| ACM Research Inc is an us-based company. It is engaged in developing, manufacturing, and selling single-wafer wet cleaning equipment, which is used by semiconductor manufacturers in numerous manufacturing steps to remove particles, contaminants, and other random defects to improve product yield, in fabricating integrated circuits, or chips. The company offers space alternated phase shift which employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces on a microscopic level; and Timely Energized Bubble Oscillation technology which provides effective, damage-free cleaning for both conventional two and three-dimensional patterned wafers at process nodes. |
