Fonon Highlights BlackStar Laser Wafer Dicing Benefits for Semiconductor Industry
September 27 2024 - 5:15PM
Business Wire
Fonon, a multi-market holding company, R&D center, equipment
designer and manufacturer of advanced laser material processing
systems for subtractive and additive manufacturing, highlights
benefits of its BlackStar silicon wafer dicing system for
applications in the semiconductor industry.
Conventional laser dicing challenges include reducing material
losses and reducing cracks and thermal distortions at an effective
machining speed. Leveraging Fonon’s patented Fantom Width Laser
Dicing (FWLD) technology, the BlackStar system aims to solve these
challenges by using a pulsed fiber laser to split brittle silicon,
thereby maximizing die yield per wafer.
By utilizing the BlackStar system, manufacturers benefit from
high-quality, precise, and clean cuts essential for processing
brittle materials. Laser processing is a cost-effective method that
significantly reduces die street width, minimizing overall material
loss. This reduction in material loss not only lowers production
costs but also decreases production time, making the entire process
more efficient.
Fonon’s exceptionally flexible FWLD technology produces multiple
size dies on the same wafer. It also dices complex shapes, cutting
each die individually regardless of shape, size, or position. It
cuts wafers secured on backing tape frame for stability, a dry
processing technique which eliminates water jet use for cooling as
well as extra handling steps. No replacement parts or regular
maintenance are required in the process.
In addition to all other benefits, BlackStar offers a range of
safety features, including an enclosure with safe viewing windows
that allow no accidental eyes and skin exposure to laser radiation,
an interlocking device to deactivate the laser in open mode, a key
control, emission indication and an emergency stop button.
About Fonon
Fonon is a diversified industrial laser equipment company with a
continuously growing umbrella of building-block technologies
supported by patents, licenses, next-generation hardware, and
proprietary metal processing IP. The company is dedicated to
advancing industrial technology and designing specialized 3D metal
printing systems for manufacturing purposes, representing the
fastest path to Manufacturing Readiness Level 10.
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Fonon Media Relations 1 (800) 520-3453 Marketing@fonon.com