GBT's
Patent for 3D Monolithic, Multi-Dimensional/Plane, Memory
Structure
- Integrated Circuits –
Granted
San Diego, CA --
November 24, 2020 -- InvestorsHub NewsWire
-- GBT Technologies Inc.
(OTC
PINK: GTCH)
("GBT", or the "Company"), announced
as
continuance update to its press release from October
29, 2020,
that
its
3D
microchip patent received a grant date as of December
1, 2020
by the United States Patent and Trademark Office ("USPTO"); U.S.
Patent No. 10,854,763. The Company filed for
this patent on March 5, 2019.
The invention relates
to the field of integrated circuit (IC) silicon structure, and more
particularly to multi-dimensional, multi-planar microchips.
This patent covers GBT's futuristic integrated circuit technology
which introduces new methods for microchip's manufacturing. The
concept presents a new die structure
and orientation. The Company
believes that the new methods are
efficient for all manufacturing nodes and especially for deep
nanometer ranges. The technology enables the manufacturing of more
transistors on a silicon wafer in order to place more
circuits/features on a die. The new manufacturing architecture
enables larger designs within smaller areas and significantly
increases the silicon yield. The invention supports analog, RF,
digital, MIXED and MEMS designs. We
believe
that it
has the potential to revolutionize integrated circuits
manufacturing and packaging, enabling huge chips on affordable
silicon areas. It may be especially significant
when it comes to heavily
area-dependent ICs, for example memory chips, MEMS
(Micro-Electro-Mechanical Systems)
and micro solar cells.
When it comes to
these types of microchips, silicon area is crucial and every micron
is important. The new approach will enable the manufacturing of
much larger chips within affordable areas. A three-dimensional
integrated circuit is a metal-oxide semiconductor (MOS) integrated
circuit, manufactured by stacking silicon dies and electrically
interconnecting them vertically. GBT's invention goes beyond 3D
concept with multi-plane silicon structures, for example honeycomb,
hexagonal and further multi-planetary structures,
with the
goal of increasing
silicon
surface area. The patent covers silicon interconnection not only
vertically but in a multi planar way which opens an entire world of
possibilities maximizing silicon area. Manufacturing these types of
structures will enable the design of chips with multi-trillion
transistors on die, creating new horizons for our
entire
electronics world. Few examples of areas that will be significantly
enhanced are flash memories, GPUs,
CPUs, displays, micro-solar cells panels,
RF, and MEMS.
"We are
glad to announce that we will be granted our multi-planer microchip
patent on December 1,
2020" said Danny Rittman,
GBT's
CTO.
"By
manufacturing honeycomb, hexagonal and other multi planer
structural shapes die, we believe
IC design
houses will be able to
increase their silicon surface
for transistors. Especially when it comes to memory circuits,
silicon real-estate is a key factor. As more we can place on the
silicon, as better, given reasonable, affordable die size.
We
believe the invention will
enable to design and manufacture gigantic chips
for all design processes including advanced
nodes like
10nm, 7nm, 5nm and below. "
Forward-Looking
Statements
Certain statements
contained in this press release may constitute "forward-looking
statements".
Forward-looking
statements provide current expectations of future events based on
certain assumptions and include any statement that does not
directly relate to any historical or current fact. Actual results
may differ materially from those indicated by such forward-looking
statements as a result of various important factors as disclosed in
our filings with the Securities and Exchange Commission located at
their website ( http://www.sec.gov).
In
addition to these factors, actual future performance, outcomes, and
results may differ materially because of more general factors
including (without limitation) general industry and market
conditions and growth rates, economic conditions, governmental and
public policy changes, the Company's ability to raise capital on
acceptable terms, if at all, the Company's successful development
of its products and the integration into its existing products and
the commercial acceptance of the Company's
products.
The
forward-looking statements included in this press release represent
the Company's views as of the date of this press release and these
views could change.
However,
while the Company may elect to update these forward-looking
statements at some point in the future, the Company specifically
disclaims any obligation to do so.
These
forward-looking statements should not be relied upon as
representing the Company's views as of any date subsequent to the
date of the press release.
Contact:
Dr. Danny
Rittman, CTO
press@gopherprotocol.com