1934 Act Registration No. 1-14700

 

 

 

 

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

 

 

FORM 6-K

 

 

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934

 

 

 

For the month of November 2021

(Commission File Number: 001-14700)

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

 

 

 

No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)

 

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  ☒            Form 40-F  ☐

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1): ☐

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7): ☐

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

 

SIGNATURES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

Date:

November 9, 2021

By

/s/ Wendell Huang

 

 

 

 

Wendell Huang

 

 

 

 

Vice President & Chief Financial Officer

 


 


 

 

 

TSMC Board of Directors Meeting Resolutions

 

Hsinchu, Taiwan, R.O.C., - Nov. 9, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

 

1. Approved the distribution of a NT$2.75 per share cash dividend for the third quarter of 2021, and set March 22, 2022 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be March 16, 2022. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (March 18 through March 22, 2022) for registration transfer, and the dividend will be paid on April 14, 2022. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be March 16, 2022. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be March 17, 2022.

 

2. Approved capital appropriations of approximately US$9,036.44 million (approximately NT$239,464.84 million) for purposes including: 1) Installation and upgrade of advanced technology capacity; 2) Installation of mature and specialty technology capacity; 3) Installation of advanced packaging capacity; 4) Fab construction, installation of fab facility systems, and capitalized leased assets; 5) First quarter 2022 R&D capital investments and sustaining capital expenditures.

 

3. Approved an equity investment of no more than US$2,123.40 million to establish a TSMC-majority-owned subsidiary in Japan to provide foundry services.

 

4. Approved the appointment of Mr. K.C. Hsu as Vice President of Integrated Interconnect & Packaging, effective November 9, 2021.

 

 

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s largest dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

 

TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.


 

 

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TSMC Spokesperson:

 

Media Contacts:

 

 

 

 

Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901

 

Nina Kao

Head of Public Relations

Tel: 886-3-5636688 ext.7125036

Mobile: 886-988-239-163

E-Mail: nina_kao@tsmc.com

 

Baker Li

Public Relations

Tel: 886-3-5636688 ext.7125037

Mobile: 886-988-932-757

E-Mail: baker_li@tsmc.com



 

 

Taiwan Semiconductor Manufacturing Company Limited

 

 

This is to report the major financials for the nine months ended September 30, 2021 reported in TSMC Board of Directors meeting. All figures were prepared in accordance with TIFRS on a consolidated basis.

 

 

 

 

 

 

(Unaudited; in NT$ thousands, except for EPS)

 

 

 

 

 

 

Comprehensive Income Statements Items

(for the nine months ended September 30, 2021)

 

 

Net sales

1,149,225,731

 

 

Gross profit

588,782,443

 

 

Income from operations

467,208,943

 

 

Income before tax

478,307,103

 

 

Net income

430,699,619

 

 

Net income attributable to shareholders of the parent

430,307,722

 

 

Basic EPS (NT$)

16.59

 

 

 

 

 

 

Balance Sheets Items

(as of September 30, 2021)

 

 

Total assets

3,332,311,884

 

 

Total liabilities

1,253,991,574

 

 

Equity attributable to shareholders of the parent

2,076,020,062

 

 

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