Enhanced scalability with low power and cost in
new form factors enable UltraScale+ devices for numerous growth
market opportunities ranging from IoT to networking
Xilinx, Inc., (NASDAQ: XLNX), the leader in adaptive computing,
today announced the company has expanded its UltraScale+™ portfolio
for markets with new applications that require ultra-compact and
intelligent edge solutions. With form factors that are 70 percent
smaller than traditional chip-scale packaging, the new Artix® and
Zynq® UltraScale+ devices can now address a wider range of
applications within the industrial, vision, healthcare, broadcast,
consumer, automotive, and networking markets.
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Xilinx® Zynq® UltraScale™ + Chip (Photo:
Business Wire)
As the world’s only hardware adaptable cost-optimized portfolio
based on 16 nanometer technology, Artix and Zynq UltraScale+
devices are available in TSMC’s state-of-the-art InFO (Integrated
Fan-Out) packaging technology. Using InFO, Artix and Zynq
UltraScale+ devices meet the need for intelligent edge applications
by delivering high-compute density, performance-per-watt, and
scalability in compact packaging options.
“Demand for compact, intelligent edge applications is driving
the requirement for processing and bandwidth engines to not only
provide higher performance, but also new levels of compute density
to enable the smallest form factor systems,” said Sumit Shah,
senior director, Product Line Management and Marketing at Xilinx.
“The new cost-optimized additions to our UltraScale+ portfolio are
powerful enhancements that leverage the architecture and
production-proven technology of Xilinx’s UltraScale+ FPGAs and
MPSoCs, which collectively have been deployed in millions of
systems worldwide.”
Artix UltraScale+ FPGAs: Built for High I/O Bandwidth and DSP
Compute
The Artix UltraScale+ family is built on its production-proven
FPGA architecture and is ideal for a range of applications
including machine vision with advanced sensor technology,
high-speed networking, and ultra-compact “8K-ready” video
broadcasting. Artix UltraScale+ devices deliver 16
gigabits-per-second transceivers to support emerging and advanced
protocols in networking, vision, and video, while also delivering
the highest DSP compute in its class.
Zynq UltraScale+ MPSoCs: Optimized for Power and Cost
Cost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 and
production-proven ZU2 and ZU3 devices, all available in InFO
packaging. As part of the multiprocessing SoC line from the Zynq
UltraScale+ family, ZU1 is designed for connectivity at the edge
and for industrial and healthcare IoT systems, including embedded
vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held
test equipment, as well as consumer and medical applications. ZU1
is built for miniaturized compute-intensive applications and
powered by a heterogeneous Arm® processor-based multicore processor
subsystem, while also being able to migrate to common package
footprints for greater compute.
“LUCID has worked closely with Xilinx to integrate the new
UltraScale+ ZU3 into our next generation industrial machine vision
camera, the Triton Edge,” said Rod Barman, founder and president at
LUCID Vision Labs. “With the UltraScale+ ZU3 and its InFO
packaging, LUCID was able to utilize an innovative rigid-flex board
architecture to squeeze an amazing amount of processing power into
an ultra-compact IP67, factory-tough camera.”
Artix and Zynq UltraScale+ are Scalable and Secure
With the addition of Artix devices and the extension to the Zynq
UltraScale+ family, Xilinx’s portfolio now spans across the
high-end with Virtex® UltraScale+, to the midrange with Kintex®
UltraScale+, to the new cost-optimized low-end. These new devices
round out the portfolio and provide scalability for customers to
develop multiple solutions using the same Xilinx platform. This
preserves design investments across the portfolio and speeds
time-to-market.
Security is a critical component in Xilinx designs, and both
cost-optimized Artix and Zynq UltraScale+ families include the same
robust security features found across the UltraScale+ portfolio.
Included are RSA-4096 authentication, AES-CGM decryption, DPA
countermeasures, and Xilinx’s proprietary Security Monitor IP that
adapts to security threats across the product life cycle, meeting
the security needs for both defense and commercial projects.
“The ability for customers to scale their designs using a single
secure platform for a wide range of applications and markets is key
to enabling faster, easier design integration as well as for
capturing critical time-to-market opportunities,” said Dan Mandell,
senior analyst, IoT and Embedded Technology at VDC Research.
“Xilinx’s strategy to expand its portfolio to meet these market
needs with its scalable and secure UltraScale+ Artix and Zynq
families is compelling, especially considering the strong business
opportunities in growth markets where these solutions are being
deployed.”
Availability
The first cost-optimized Artix UltraScale+ devices are expected
to be available in production by Q3 CY2021, with Vivado® Design
Suite and Vitis™ Unified Software Platform tool support starting
late summer. Zynq UltraScale+ ZU1 devices will also begin sampling
in Q3 with tool support in Q2, and volume production of the
extended portfolio beginning Q4.
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About Xilinx
Xilinx, Inc. develops highly flexible and adaptive processing
platforms that enable rapid innovation across a variety of
technologies - from the cloud, to the edge, to the endpoint. Xilinx
is the inventor of the FPGA and Adaptive SoCs (including our
Adaptive Compute Acceleration Platform, or ACAP), designed to
deliver the most dynamic computing technology in the industry. We
collaborate with our customers to create scalable, differentiated
and intelligent solutions that enable the adaptable, intelligent
and connected world of the future. For more information, visit
xilinx.com.
Source: Xilinx Newsroom
Category: Product Announcements
© Copyright 2021 Xilinx, Inc. Xilinx, the Xilinx logo and other
designated brands included herein are trademarks of Xilinx in the
United States and other countries.
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PR Contact: Xilinx PR media@xilinx.com
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