MOUNTAIN VIEW, Calif.,
Oct. 21, 2020 /PRNewswire/ --
Highlights:
- Unique IBM collaboration leverages Synopsys as lead EDA and IP
partner for IBM's AI Hardware Center; silicon verification and
demonstrable performance improvements already achieved
- Synopsys delivers design, verification and IP solutions, and
technical expertise focused on developing new AI-specific hardware
architectures
- Cross-industry partners addressing key technology challenges to
achieve performance scaling and power efficiency necessary to
expand AI use across a wide range of applications and use
cases
Synopsys, Inc. (Nasdaq: SNPS) today announced the latest
stages in its ongoing collaboration with IBM Research's AI Hardware
Center to advance the development of chip architectures and design
methodologies critical to the next generation of AI chips. Synopsys
is working closely with IBM to implement the latest AI Hardware
Center technologies in full chip solutions, which could be
commercialized in the near future. Their unique collaboration was
established last year, leveraging the rich expertise of IBM's
renowned research organization, and combining the efforts of
multiple commercial partners, as well as academic and government
entities that support the initiative.
The overarching goal of the work with IBM is to achieve a
continued trend of annual doubling of the AI compute performance
for a decade or more. To do this, the companies are working
together to redesign hardware with AI specifically in mind, with a
vision of expanding the use of AI to solve more problems in
business and the world in general. This work includes developing
new computing accelerators, technologies, and architectures
designed and optimized specifically for AI computation.
"Together, AI and hybrid cloud will play a critical role in the
next generation of enterprise computing and scaling AI, with new
hardware solutions as part of a wider effort at IBM Research to
envision and realize What's Next in AI," said Mukesh Khare, Vice President, Hybrid Cloud, IBM
Research. "To achieve this, we need to build a new class of AI
hardware accelerators that increase compute power without the
demand for more energy. Additionally, developing new AI chip
architectures will enable companies to dynamically run large AI
workloads in the hybrid cloud. Synopsys' unmatched breadth of
experience and technical offering is an extremely valuable asset in
this effort."
The AI Hardware Center has achieved several tapeouts and test
chips of designs targeting advanced process manufacturing nodes,
supporting its aggressive roadmap. Part of the roadmap to reach
1,000x performance improvement by 2029 was the delivery of AI
processor cores that improve performance by 2.5x each year; IBM
Research realized a gain of twice that in its first year.
Synopsys' participation, which includes both technology and
engineering personnel collaborating with the IBM researchers,
focuses on addressing several of the key challenges in complex AI
chip design, verification and manufacturing. Specifically, Synopsys
brings expertise in three main areas:
- Multi-die integration in a package, silicon design and
verification, with Synopsys 3DIC Compiler, Fusion Design
Platform™ and Verification Continuum®
Platform, which include the use of state-of-the-art functional
verification, prototyping and emulation systems that address the
size and scale of the designs being developed, and support for
hardware and software co-design and co-analysis methodologies.
- Silicon engineering, provides software to address
critical manufacturing and yield challenges introduced by
leading-edge process technologies such as the use of novel
materials, gate-all-around 3D stacked architectures, and source and
mask creation for EUV technology. Our Design Technology
Co-Optimization (DTCO) solution combines our capabilities to
provide more options and help achieve global optimality.
- Silicon IP, which addresses the processing, memory
performance and real-time connectivity requirements of AI chips,
providing a broad portfolio of silicon-proven
DesignWare® IP such as LPDDR5 and PCI
Express® 5.0 for a wide array of applications.
"This a unique opportunity for Synopsys to be part of a
collaborative effort that connects the entire semiconductor value
chain," said Arun Venkatachar, Vice President, Artificial
Intelligence and Central Engineering at Synopsys. "To realize IBM
Research's vision, the AI hardware being designed requires a
fundamentally new approach, which needs innovative strategies –
from tools, to IP, to workflows and manufacturing. Our involvement
with the AI Hardware Center provides a platform for us to help
drive the future of AI chip design with a synergistic partner."
Read more about Synopsys' collaboration with the IBM Hardware
Research Center:
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the
Silicon to Software™ partner for innovative companies
developing the electronic products and software applications we
rely on every day. As the world's 15th largest software
company, Synopsys has a long history of being a global leader in
electronic design automation (EDA) and semiconductor IP and is also
growing its leadership in software security and quality solutions.
Whether you're a system-on-chip (SoC) designer creating advanced
semiconductors, or a software developer writing applications that
require the highest security and quality, Synopsys has the
solutions needed to deliver innovative, high-quality, secure
products. Learn more at www.synopsys.com.
Editorial
Contact:
Simone Souza
Synopsys, Inc.
650-584-6454
simone@synopsys.com
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SOURCE Synopsys, Inc.