Rambus Tapes Out 112G XSR SerDes PHY on Leading-Edge 7nm Process
September 25 2019 - 5:00PM
Business Wire
Highlights:
- Provides critical building block to deliver data for
next-generation data center, networking, high-performance computing
(HPC), artificial intelligence (AI) and machine learning (ML)
applications
- Delivers superior power, performance and area (PPA) for extra
short reach (XSR) links with innovative architecture designed for
leading-edge 7nm process node
- Expands SerDes PHY portfolio for 112G OIF-CEI industry
standard
Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip
provider making data faster and safer, today announced the tapeout
of its 112G XSR SerDes PHY on a leading-edge 7nm process node
optimized for PPA to support data center, networking, HPC, AI and
ML applications. As the industry continues to adopt chiplet
architectures for networking and compute applications, the Rambus
112G XSR SerDes PHY represents the latest advancement in high-speed
signaling technology for die-to-die (D2D) and die-to-optical engine
(D2OE) connections. Rambus continues at the forefront of
implementing 112G designs to address the needs for next-generation
data-intensive applications.
In today’s increasingly connected world, zettabytes of data are
generated constantly by a wide range of devices including IoT
endpoints such as vehicles, wearables, smartphones and appliances.
AI and ML add new workloads and new data streams from the data
center to the edge, driving new architectures to move data. These
new architectures, combined with the trend toward chip
disaggregation and the industry’s transition to 400Gb and 800Gb
Ethernet, will require new, faster interconnect solutions.
"As semiconductor markets turn towards chiplets to enable their
high-performance products, chip-to-chip interconnects will be
critical for maintaining high speed and signal integrity across
variable physical distances," said Shane Rau, research vice
president, computing semiconductors at IDC. "SerDes PHYs at
advanced process nodes, like the 7nm 112G XSR, enable that speed
and signal integrity."
“Our 112G XSR SerDes PHY is implemented in the leading-edge 7nm
process technology, providing chip and system architects the most
advanced platform for their designs,” said Hemant Dhulla, vice
president and general manager of IP cores at Rambus. “We are
excited to continue our tradition of delivering leading-edge IP
solutions that address the systems design challenges of the most
demanding applications in networking, HPC and AI.”
Technical Details
The Rambus 112G XSR SerDes PHY will deliver enterprise-class
performance within D2D and D2OE interconnects for 400Gb and 800Gb
Ethernet environments. To achieve the demanding data rates of these
high-speed applications requires an innovative SerDes architectural
approach.
The Rambus 112G XSR SerDes PHY includes:
- High-bandwidth connectivity greater than 800 Gbps per
millimeter of beachfront making it ideal for D2D and D2OE
interconnects in networking and HPC applications
- Designed to provide a low-power, high-speed interface that
supports chip disaggregation
- Best-in-class architecture for power, performance, area (PPA)
with approximately 1 pJ/bit or 1mW/Gbps power
- Compliance with Open Interface Forum Common Electrical I/O
Consortium (OIF-CEI) standard
Availability and Additional Information
The Rambus 112G XSR SerDes PHY is the latest addition to the
Rambus leading-edge portfolio of SerDes solutions including the
112G LR SerDes PHY announced earlier this year. The PHY is
available for licensing, and early access design customers can
engage today. To learn more about Rambus SerDes technology, visit
Rambus Booth #408 at the TSMC 2019 Open Innovation Platform®
Ecosystem Forum on September 26, 2019 at the Santa Clara Convention
Center in Santa Clara, CA.
For more information on various Rambus SerDes PHY offerings,
please visit rambus.com/serdes.
Follow Rambus:
Company website: rambus.com Rambus blog: rambus.com/blog
Twitter: @rambusinc LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates
innovative hardware, software and services that drive technology
advancements from the data center to the mobile edge. Our
architecture licenses, IP cores, chips, software, and services span
memory and interfaces, security, and emerging technologies to
positively impact the modern world. We collaborate with the
industry, partnering with leading chip and system designers,
foundries, and service providers. Integrated into tens of billions
of devices and systems, our products and technologies power and
secure diverse applications, including Big Data, Internet of Things
(IoT) security, mobile payments, and smart ticketing. For more
information, visit rambus.com.
Source: Rambus Inc.
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version on businesswire.com: https://www.businesswire.com/news/home/20190925005924/en/
Cori Pasinetti Rambus Corporate Communications t: (408) 462-8306
cpasinetti@rambus.com
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