Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process
September 23 2019 - 9:05AM
Business Wire
Highlights:
- GDDR6, HBM2, and 112G Long Reach (LR) interfaces designed for
TSMC’s industry-leading N7 process technology expand Rambus’
leading-edge memory and SerDes PHY offerings
- Portfolio enables critical building blocks for next-generation
data center, networking, wireless 5G, high-performance computing
(HPC), advanced driver assistance systems (ADAS), artificial
intelligence (AI) and machine learning (ML) applications
Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip
provider making data faster and safer, today announced a broad
portfolio of high-speed memory and SerDes PHYs for next-generation
applications on TSMC’s industry-leading N7 process technology.
Leveraging almost 30 years of high-speed interface design expertise
and using leading process technology, Rambus offers GDDR6, HBM2 and
112G LR PHY IP available for licensing. These solutions enable
demanding applications for data center, networking, wireless 5G,
HPC, ADAS, AI and ML.
As the fastest discrete memory interface from Rambus, GDDR6
memory PHY adds to TSMC’s most comprehensive portfolio of
silicon-proven intellectual property (IP), design tools and
Reference Flows through the TSMC IP Alliance Program, a key
component of TSMC Open Innovation Platform® (OIP). Along with HBM2
and 112G LR SerDes PHY, Rambus offers leading-edge memory and
serial link interfaces for a broad range of high-performance
applications.
“TSMC OIP Alliance partners continue to deliver innovative
solutions that will address the tremendous demands for computing
power driven by AI and next-generation networks,” said Suk Lee,
TSMC senior director, Design Infrastructure Management Division.
“We’re pleased with the availability of Rambus’ high-speed memory
and SerDes interface solutions on TSMC’s industry-leading N7
process technology to address customer’s requirements for the most
demanding applications.”
Expanding beyond the traditional GPU and graphics applications,
GDDR6 and HBM2 address market needs in multiple, advanced
applications like AI/ML, ADAS and networking, as memory bandwidth
becomes more critical for overall system performance. As the
industry rapidly transitions to 400 and 800GbE communications
systems, 112G LR is a key building block necessary to support the
ever-growing demand for more bandwidth in data center and network
applications.
“This announcement highlights Rambus’ leadership in high-speed
SerDes and memory PHY IP, leveraging the company’s long tradition
of signal- and power-integrity expertise,” said Hemant Dhulla, vice
president and general manager of IP cores at Rambus. “We are very
proud to be able to offer these advanced solutions as part of the
TSMC ecosystem.”
Availability
The Rambus GDDR6 and HBM2 Memory PHYs, and 112G LR SerDes PHY
are available from Rambus today for licensing and integrating into
system-on-chip (SoC) designs.
Demonstration Details at TSMC 2019 Open Innovation Platform®
Ecosystem Forum
Join Rambus in Booth #408 at the TSMC 2019 Open Innovation
Platform® Ecosystem Forum on September 26, 2019 at the Santa
Clara Convention Center in Santa Clara, California and learn more
about its extensive portfolio of interface IP and innovation in
advanced memory and interface technology.
Additional Information
To learn more about the TSMC 2019 Open Innovation
Platform® Ecosystem Forum, visit
https://www.rambus.com/event/tsmc-oip-santa-clara-2019/. For
additional details about Rambus silicon applications or more
information on our latest Rambus high-speed memory and SerDes PHY
solutions, go to rambus.com/memory-and-interfaces/.
Follow Rambus:
Company website: rambus.com Rambus blog: rambus.com/blog
Twitter: @rambusinc LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates
innovative hardware, software and services that drive technology
advancements from the data center to the mobile edge. Our
architecture licenses, IP cores, chips, software, and services span
memory and interfaces, security, and emerging technologies to
positively impact the modern world. We collaborate with the
industry, partnering with leading chip and system designers,
foundries, and service providers. Integrated into tens of billions
of devices and systems, our products and technologies power and
secure diverse applications, including Big Data, Internet of Things
(IoT) security, mobile payments, and smart ticketing. For more
information, visit rambus.com.
Source: Rambus Inc.
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version on businesswire.com: https://www.businesswire.com/news/home/20190923005211/en/
Press Contact: Cori Pasinetti Rambus Corporate
Communications t: (408) 462-8306 cpasinetti@rambus.com
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