Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology
January 30 2019 - 9:00AM
Business Wire
Leading IP to support TSMC’s customers with AI,
HPC, automotive and networking applications
Rambus Inc. (NASDAQ: RMBS) today announced the tapeout of
its GDDR6 PHY on TSMC 7nm FinFET process technology and is
available from Rambus for licensing today. Leveraging almost 30
years of high-speed interface design expertise and using advanced
process technology, Rambus has successfully taped out a GDDR6 PHY
IP on TSMC 7nm process technology. With ongoing engagements among
design and verification customers, GDDR6 is applicable to a broad
range of high-performance applications including networking, data
center, advanced driver assistance systems (ADAS), machine learning
and artificial intelligence (AI). This fastest discrete memory
interface from Rambus will add to TSMC’s large portfolio of silicon
proven intellectual property (IP), design tools and reference
flows.
Expanding beyond traditional GPU and graphic applications, GDDR6
helps to address market needs in multiple, high-bandwidth
applications, as memory performance becomes more critical for
overall system performance. This latest addition to the Rambus
high-speed-interface IP portfolio highlights the company’s
leadership and long tradition of signal- and power-integrity
expertise, remaining at the forefront of innovation in interface
technology. By providing the industry’s highest speed of up to 16
Gbps, while utilizing established packaging and testing techniques,
GDDR6 offers system designers an alternative memory choice that is
five times faster than traditional memory available today.
The Rambus GDDR6 offering will also add to TSMC’s portfolio of
silicon-proven IP, via its Open Innovation Platform® (OIP) IP
Alliance Program. In this program, TSMC’s IP and ecosystem partners
like Rambus are able to tapeout and validate in silicon critical IP
for TSMC's various process nodes.
Benefits of the Rambus GDDR6 PHY:
- Provides the industry’s highest speed
of up to 16 Gbps, providing a maximum bandwidth of up to 512
Gbps.
- Offers PCB and Package design support –
allowing customers to quickly and reliably bring their high-speed
designs to production.
- Delivers a timing-closed hard macro
solution for easy ASIC integration.
- Provides access to Rambus system and
SI/PI experts helping ASIC designers to ensure maximized signal and
power integrity for devices and systems.
- Presents a LabStation™ development
environment that enables quick system bring-up, characterization
and debug.
- Supports high-performance applications
including networking, data center, ADAS, machine learning and
AI.
“By leveraging TSMC’s 7nm process technology, Rambus furthers
its ability to offer first to market products and be on the leading
edge of industry standards,” said Hemant Dhulla, VP and GM of IP
Cores, Rambus. “We offer a complete system solution for
integration, including PCB and package design, to help customers
get to production faster. We’re excited to grow as a valuable
ecosystem partner of TSMC and deliver a broad IP portfolio to
maximize performance and flexibility for today’s most challenging
systems.”
Availability
GDDR6 is available from Rambus today for licensing and
integrating into system-on-chips (SoCs).
Demonstration Details at DesignCon 2019
At DesignCon from Jan. 29 – Jan. 31, 2019 in Santa Clara,
California, Rambus will demonstrate a memory channel signaling at
GDDR6 speeds. Rambus will also present, “Memory Options for High
Performance Applications,” starting at 9:05 am PT on Jan. 30 in the
room, “Great America 3,” that will discuss GDDR6 and other leading
technologies. Visit Rambus at Booth 837 to learn more about GDDR6
applications.
For more information on our latest Rambus GDDR6 high speed
memory offerings on TSMC, please visit
https://www.rambus.com/gddr6.
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About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces Division develops products and
services that solve the power, performance, and capacity challenges
of the communications and data center computing markets. Rambus
enhanced standards-compatible and custom memory and serial link
solutions include chips, architectures, memory and SerDes
interfaces, IP validation tools, and system and IC design services.
Developed through our system-aware design methodology, Rambus
products deliver improved time-to-market and first-time-right
quality.
About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates
innovative hardware, software and services that drive technology
advancements from the data center to the mobile edge. Our
architecture licenses, IP cores, chips, software, and services span
memory and interfaces, security, and emerging technologies to
positively impact the modern world. We collaborate with the
industry, partnering with leading chip and system designers,
foundries, and service providers. Integrated into tens of billions
of devices and systems, our products and technologies power and
secure diverse applications, including Big Data, Internet of Things
(IoT) security, mobile payments, and smart ticketing. For more
information, visit rambus.com.
Source: Rambus Inc.
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version on businesswire.com: https://www.businesswire.com/news/home/20190130005216/en/
Cori PasinettiRambus Corporate Communicationst: (408)
462-8306cpasinetti@rambus.com
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