ISSI Announces SRAM, DRAM, and EEPROM Memory with Copper Leadframes for Automotive and Industrial Applications
November 11 2008 - 3:00AM
PR Newswire (US)
Copper Leadframe Enhances Reliability over Standard Leadframes
MUNICH, Germany, Nov. 11 /PRNewswire-FirstCall/ -- Integrated
Silicon Solution, Inc. (NASDAQ:ISSI), a leader in advanced memory
solutions, today announced a complete line of copper leadframe
memories including SRAM, DRAM and EEPROM devices. The use of copper
leadframes enhances the long-term reliability of these devices in
harsh environments such as automotive engine controls and
industrial applications. The improved reliability comes from better
performance in two different areas when compared to the industry
common Alloy42 leadframes. First, the thermal conductivity of
copper is twelve times better than that of Alloy42. This translates
to better heat dissipation from the die into the leadframe and out
of the package. This results in less heat stress inside the
component. Since heat stress at the die is one of the leading
causes of a non-mechanical component failure in a long-life
application, the copper leadframe improves the reliability of the
device. Second, unlike Alloy42, the coefficient of thermal
expansion in a copper leadframe closely matches that of the pads on
the printed circuit board. As a result, less stress is applied to
the solder joints due to the similar expansion and contraction
rates of the adjoining materials during temperature swings
experienced in harsh environments. Also, copper is not as stiff as
Alloy42. This allows the bends in the leadframe to minimize the
stress being applied to the solder joints. This greatly reduces the
risk of a crack forming in a solder joint. ISSI now offers a full
line of SRAMs and EEPROMs that support operating temperatures of
-40C to +85C, +105C, and +125C and a full line of DRAMs that
support operating temperatures of -40C to +85C and +105C that are
available with copper leadframes. This allows the customer to match
both the temperature range and the leadframe to the application's
environment for enhanced system reliability. About ISSI ISSI is a
fabless semiconductor company that designs and markets high
performance integrated circuits for the following key markets: (i)
digital consumer electronics, (ii) networking, (iii) mobile
communications (iv) automotive electronics and (v) industrial. The
Company's primary products are high speed and low power SRAM and
low and medium density DRAM. The Company also designs and markets
EEPROM, SmartCards and is developing selected non-memory products
focused on its key markets. ISSI is headquartered in Silicon Valley
with worldwide offices in Taiwan, Japan, Singapore, China, Europe,
Hong Kong, India, and Korea. Visit our web site at
http://www.issi.com/. DATASOURCE: Integrated Silicon Solution, Inc.
CONTACT: Ron Kalakuntla, +1-408-969-4675, , or Tom Doczy,
+1-408-969-4620, , both of Integrated Silicon Solution, Inc.; or
Larry Hayes of Hayes Marketing, +1-408-921-5806, , for Integrated
Silicon Solution, Inc. Web site: http://www.issi.com/
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