SANTA
CLARA, Calif., Oct. 20,
2022 /PRNewswire/ -- Marvell Technology, Inc.
(NASDAQ: MRVL), a leader in data infrastructure semiconductor
solutions, today announced a comprehensive 3nm silicon platform to
advance its industry-leading products across the cloud data center,
carrier, enterprise, and automotive markets. Leveraging Marvell's
success in 5nm, which includes the industry's first 5nm Data
Processing Unit (DPU) – the OCTEON® 10 platform, this suite of
advanced technology enables cutting-edge monolithic and multi-die
solutions for its customers in the industry's most advanced process
node, delivering the performance, power, and density (size)
necessary to meet most demanding infrastructure requirements for
compute, next generation 100T Ethernet switching, and 5G Advanced
baseband processing.
The new 3nm Marvell silicon, which is now in fabrication with
Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm
shuttle, is available for new product designs and includes
foundational IP building blocks such as long reach SerDes, PCIe
Gen6 PHY, and several standards-based die-to-die interconnect
technologies for managing data flow across the data infrastructure.
This 3nm development follows numerous 5nm solutions from Marvell –
in production or development – that span its unrivaled portfolio of
electro-optics, switch, PHY, compute, 5G baseband, and storage
products, as well as a wide range of custom ASIC programs.
Additionally, this IP portfolio is compatible with 2.5D
packaging technologies such as TSMC's leading-edge 2.5D
Chip-on-Wafer-on-Substrate (CoWoS) and will enable Marvell to
develop some of the most advanced multi-die, multi-chiplet
systems-in-package (SiP) for its industry-leading infrastructure
products and co-development of custom ASIC solutions optimized for
some of the most challenging infrastructure use cases, such as
machine learning.
Silicon Advancing the
Cloud
With data and internet traffic approximately doubling every two
years, cloud service providers, software-as-a-service (SaaS)
companies, and telecommunication carriers are increasingly relying
on silicon optimized by semiconductor providers to deliver
breakthrough performance and bandwidth while minimizing power
consumption, emissions, and cost. Achieving these objectives,
particularly for hyperscale cloud providers, requires silicon
partners to move quickly to the most advanced process node
available to take advantage of the inherent scaling benefits in
power, performance, and density.
Marvell delivers a wide range of industry-leading standard
products for cloud infrastructure including electro-optics,
processors, accelerators, optical modules, Ethernet switches,
storage controllers and PHY chips, and offers customized products
through Marvell's ASIC portfolio. By developing and validating each
of the critical IP blocks in silicon early in the availability of
the 3nm process, Marvell can significantly accelerate customers'
time-to-market while reducing the design risk and verification
efforts associated with its complex monolithic or multi-die SoC
designs.
"Marvell teamed with TSMC to provide our customers with the
power to build high-performance, cloud-optimized solutions for the
most demanding applications requiring the industry's first 3nm IP
on silicon," said Raghib Hussain,
President of Products & Technologies at Marvell. "The 3nm
platform provides advantages for a wide range of solutions, from
standard and application-specific SoCs to highly custom chips with
unique and innovative designs."
"TSMC is pleased to collaborate with Marvell in taping out a
chip on our 3nm shuttle to validate critical cloud-focused IPs,"
said Yujun Li, Director of High
Performance Computing Business Development at TSMC. "TSMC is
looking forward to our continued collaboration with Marvell in the
development of leading-edge multi-die SoCs utilizing TSMC's process
and packaging technologies."
"The cloud will play an outsized role in transforming
healthcare, curbing emissions, and taking on other real-world
challenges, but only if cloud providers can continue to increase
the overall performance and efficiency of their infrastructure,"
said Alan Weckel, co-founder of the
650 Group. "Marvell's collaboration with TSMC and its strategy of
optimizing silicon building blocks for a wide spectrum of devices
and applications is poised to play a critical role in allowing
cloud providers to fulfill that promise."
About Marvell
To deliver the data infrastructure technology that connects the
world, we're building solutions on the most powerful foundation:
our partnerships with our customers. Trusted by the world's leading
technology companies for over 25 years, we move, store, process and
secure the world's data with semiconductor solutions designed for
our customers' current needs and future ambitions. Through a
process of deep collaboration and transparency, we're ultimately
changing the way tomorrow's enterprise, cloud, automotive, and
carrier architectures transform—for the better.
Marvell and the M logo are trademarks of Marvell or its
affiliates. Please visit www.marvell.com for a complete list of
Marvell trademarks. Other names and brands may be claimed as the
property of others.
This press release contains forward-looking statements within
the meaning of the federal securities laws that involve risks and
uncertainties. Forward-looking statements include, without
limitation, any statement that may predict, forecast, indicate or
imply future events or achievements. Actual events or results may
differ materially from those contemplated in this press release.
Forward-looking statements speak only as of the date they are made.
Readers are cautioned not to put undue reliance on forward-looking
statements, and no person assumes any obligation to update or
revise any such forward-looking statements, whether as a result of
new information, future events or otherwise.
For further information, contact:
Kim Markle
pr@marvell.com
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SOURCE Marvell