Intel Wins US Government Advanced Packaging Project
October 02 2020 - 9:30AM
Business Wire
What’s New: The U.S. Department of Defense has awarded
Intel Federal LLC the second phase of its State-of-the-Art
Heterogeneous Integration Prototype (SHIP) program. The SHIP
program enables the U.S. government to access Intel’s
state-of-the-art semiconductor packaging capabilities in Arizona
and Oregon and take advantage of capabilities created by Intel’s
tens of billions of dollars of annual R&D and manufacturing
investment. The project is executed by the Naval Surface Warfare
Center, Crane Division, and administered by the National Security
Technology Accelerator.
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Intel’s newest, leading-edge
manufacturing facility is Fab 42 in Ocotillo, Arizona. Fab 42
connects to three other Intel fabrication plants, making the site
Intel’s first mega-factory network. It manufactures our newest
generation of leadership products that will power hundreds of
millions of computing devices worldwide. (Credit: Intel
Corporation)
“Intel and the U.S. government share a
priority to advance domestic semiconductor manufacturing
technology. The SHIP program will enable the Department of Defense
to take advantage of Intel’s advanced semiconductor packaging
capabilities, diversifying their supply chain and protecting their
intellectual property while also supporting ongoing semiconductor
R&D in the U.S. and preserving critical capabilities
onshore.”
— Jim Brinker, president and general manager
of Intel Federal LLC
Why It Matters: SHIP is sponsored by the Office of the
Under Secretary of Defense for Research and Engineering and funded
by the Trusted and Assured Microelectronics program. The second
phase of the program will develop prototypes of multichip packages
and accelerate advancement of interface standards, protocols and
security for heterogeneous systems. SHIP prototypes will integrate
special-purpose government chips with Intel’s advanced,
commercially available silicon products, including field
programmable gate arrays, application-specific integrated circuits
and CPUs. This combination of technologies provides new paths for
the U.S. government’s industry partners to develop and modernize
the government’s mission-critical systems while taking advantage of
Intel’s U.S. manufacturing capabilities.
“To ensure that the U.S. defense industry base can continue to
deliver state-of-the-art electronics for national security, it is
imperative that the Department of Defense (DoD) partners with
leading U.S. semiconductor companies," Nicole Petta, principal
director of microelectronics, Office of the Under Secretary of
Defense for Research and Engineering. "The DoD microelectronics
roadmap recognizes the importance of strategic partnerships with
industry. The roadmap also prioritizes and recognizes that as
process scaling slows, heterogeneous assembly technology is a
critical investment for both the DoD and our nation. SHIP directly
contributes to advancing the objectives outlined in the DoD roadmap
and the DoD looks forward to working with Intel, a world leader in
this technology.”
How It Works: Heterogeneous packaging allows the assembly
of multiple, separately manufactured integrated circuit dies
(chips) onto a single package to increase performance while
reducing power, size and weight. SHIP provides the U.S. government
access to Intel’s advanced heterogeneous packaging technologies,
including embedded multi-die interconnect bridge (EMIB), 3D Foveros
and Co-EMIB (combining both EMIB and Foveros).
Intel Customer Stories: Intel Customer Spotlight on
Intel.com | Customer Stories on Intel Newsroom
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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William Moss 650-521-1754 william.moss@intel.com
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