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Company Name | Stock Ticker Symbol | Market | Type |
---|---|---|---|
Electro Scientific Industries, Inc. | ESIO | NASDAQ | Common Stock |
Open Price | Low Price | High Price | Close Price | Prev Close |
---|---|---|---|---|
29.99 |
Trades | Volume | Avg Volume |
---|---|---|
0 | 0 | - |
Last Trade Time | Type | Quantity | Stock Price | Currency |
---|---|---|---|---|
- | 0 | $ 29.99 | USD |
Electro Scientific Industries, Inc. Financials
Market Cap | Shares in Issue | Float | Revenue | Profit/Loss | EPS | PE Ratio |
---|---|---|---|---|---|---|
$ 944.01M | - | - | - | 8.30 |
Short Interest | Dividends Per Share | Dividend Yield | Ex-Div Date | Insider B/S | Insider % Owned |
---|---|---|---|---|---|
- | - | - | - |
Electro Scientific Industries, Inc. News
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Historical ESIO Price Data
Period | Open | High | Low | VWAP | Avg. Daily Vol | Change | % |
---|---|---|---|---|---|---|---|
1 Week | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
1 Month | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
3 Months | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
6 Months | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
1 Year | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
3 Years | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
5 Years | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
Electro Scientific Industries, Inc. Description
Electro Scientific Industries Inc is a manufacturer of electronic components. The company operates through two segments: Component Processing and Micromachining. The Component Processing segment includes interconnect products, semiconductor products, and component products. The interconnect, semiconductor and component products are sold to manufacturers of electronic components and are used to drill, cut, trim, ablate and test and mark features for the functionality of the component. The Micromachining segment includes products that are sold to manufacturers of end devices across various industries and are used to drill, cut or mark features on a range of materials, generally on the casing or external surface of the end device. |