BEVERLY, Mass., Sept. 30, 2020 /PRNewswire/ -- Axcelis
Technologies, Inc. (Nasdaq: ACLS), a leading supplier of
innovative, high-productivity solutions for the semiconductor
industry, announced today the first shipment of a Purion H200 high
current implanter evaluation system, as well as another follow on
order for a Purion M SiC medium current implanter to leading power
device manufacturers. The Purion H200 system is targeted for use in
a production ramp for Si power devices and the Purion M SiC system
is being utilized for a fab capacity expansion. Both systems
shipped in the third quarter.
Executive Vice President of Product Development, Bill Bintz, commented, "The Purion H200 is the
first and only single wafer high current implanter designed to
cover all high dose implant applications from energies as low as
5keV to a maximum of 200keV, and is especially suited to foundry
and power device manufacturers' needs. Built upon the
industry-proven Purion H high current beamline with its unique
scanned spot beam architecture, the Purion H200 delivers the
productivity of high current tools with the precision and accuracy
of medium current implanters. The superior precision, productivity
and process capabilities (widest dose and energy range) position
the Purion H200 as the most versatile single wafer high current ion
implanter in the fab, enabling device manufacturers to develop
novel material modification applications previously considered
impractical with implant."
Mary Puma, president and CEO of
Axcelis Technologies, said, "We are very pleased to be able to
offer new and innovative implant solutions to leading device makers
serving this very important market segment. Expanding our customer
footprint in the power device market is a key objective of our
growth strategy and will help us achieve our long term $650M business model."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative,
high-productivity solutions for the semiconductor industry for over
40 years. Axcelis is dedicated to developing enabling process
applications through the design, manufacture and complete life
cycle support of ion implantation systems, one of the most critical
and enabling steps in the IC manufacturing process. Learn more
about Axcelis at www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media)
978.787.4266
Doug Lawson (investor relations)
978.787.9552
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SOURCE Axcelis Technologies, Inc.