Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna-in-Package Technology
July 22 2019 - 1:00PM
Business Wire
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of
outsourced semiconductor assembly and test (OSAT) services, is
paving the way for 5G mmWave antenna-in-package (AiP) technology.
Amkor’s cutting-edge AiP technology has already been deployed into
modules designed for smartphones and other mobile devices. Starting
in July 2018, Amkor was the first OSAT to market with 5G mmWave AiP
technology, expanding on years of advanced System in Package (SiP)
experience.
“Amkor has deployed our AiP technology into 5G product
applications with a major global communications company, working
with them to produce their first AiP product to go to market,” said
Ron Huemoeller, Corporate VP of R&D for Amkor Technology. “A
key focus for us is to continue to develop AiP products with
revolutionary packaging concepts that are vital to the
implementation of highly integrated circuitry,” he added.
The total RF front-end module SiP market is projected to reach
US $5.3 billion by 2023, representing an 11.3% compound annual
growth rate (CAGR) according to Yole Développement, SA, an industry
consulting firm.
“5G will bring more packaging business for OSAT providers,” said
Santosh Kumar, Yole Korea principal analyst and director,
Packaging, Assembly & Substrates. “Typical RF front-end
components in smartphones include various switches, filters,
amplifiers and the antennas themselves. More and more, SiP
technology is needed to implement an increasing number of bands and
the development of circuitry in ever-smaller surfaces.”
In addition to its formidable SiP capacity and AiP technology,
Amkor has developed an extensive toolset to maximize circuit
density and address the sophisticated packaging formats required to
productize 5G applications – such as double-sided assembly,
embedded die in substrate, advanced RDL molding and various types
of RF shielding. This toolset, combined with the company’s
expertise in RF and antenna package design, uniquely positions
Amkor to serve customers who want to outsource the challenges and
high investment associated with combining multiple ICs with
advanced package assembly and test technologies for 5G
networks.
As demand for packages that support 5G starts to climb, Amkor is
already well underway with the successful implementation of AiP
technology. To learn more about Amkor’s capabilities in SiP and
AiP, visit https://amkor.com/aip-aop
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers
of outsourced semiconductor packaging and test services. Founded in
1968, Amkor pioneered the outsourcing of IC packaging and test, and
is now a strategic manufacturing partner for more than 250 of the
world’s leading semiconductor companies, foundries and electronics
OEMs. Amkor’s operating base includes 11 million square feet of
floor space with production facilities, product development centers
and sales and support offices located in key electronics
manufacturing regions in Asia, Europe and the U.S. For more
information, visit www.amkor.com.
Keywords OSAT
Semiconductor packaging
Advanced IC packaging
Assembly and test
Antenna-in-package
System-in-package
SiP
AiP
5G mmWave
RDL molding
RF shielding
IoT
Smartphone
Social Media: @amkortechnology
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