Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it has received an order totaling over
$1.4 million from an existing customer for a FOX-XPTM multi-wafer
test and burn-in system and multiple WaferPak™ Contactors to
perform volume production qualification of the customers’ high
performance silicon photonics devices. The total FOX solution is
expected to ship prior to the end of Aehr’s current fiscal year
ending May 31, 2021.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “This customer is a major supplier of fiber optic
transceivers in the Data Center Interconnect (DCI) market and is
moving to silicon photonics integration to address higher
performance and lower cost needs of the market. We are delighted to
see them transition from our FOX-NP™ system for initial production
burn-in and stabilization of their high-performance silicon
photonic devices to using our production FOX-XP system to meet
their high-volume production forecast. The DCI market includes
DCI-Long Haul from city to city, DCI-Metro from Data Center to Data
Center within a city, and DCI-Campus/Edge for high bandwidth
transmission between multiple data centers within a campus or used
to connect regional, distributed data centers. The five year
cumulative average growth rate (CAGR) of the DCI market is expected
to grow at over 55% from 2019 to 2023 alone according to Cignal AI.
This is now our sixth customer in the silicon photonics space that
is using our FOX platform for qualification and production.
“This is a 100% production test application, so unlike a
sampling burn-in process step, this customer is using the FOX
system to stabilize each device as a critical production process
step, and will need incremental capacity for FOX systems and
WaferPaks with each increment in their volume production forecast.
Our high volume, high power production FOX-XP system is capable of
testing up to 9 high-power wafers in parallel to meet their
production needs. With up to 2,000 watts of power per wafer, and
the ability to test thousands of individual devices in parallel
with our WaferPak full wafer contactor, the FOX-XP solution can
test all devices on each wafer in parallel in a single touchdown.
The FOX-XP is 100% compatible with our dual-wafer FOX-NP and
proprietary WaferPaks, which allow our customers to make a very
simple transition between initial qualification and low volume
production to high volume production.
“We are excited to see this new wave of capacity needs from our
silicon photonics customers, and to see the resumption of orders to
these customers for devices for data center and 5G infrastructure
expansions that is driving the increased test capacity need. We
continue to be very optimistic about the silicon photonics market,
which is seeing increasing deployment of devices used in the
expansion of bandwidth and infrastructure to meet the explosive
growth of data center and 5G. Silicon photonics devices are highly
integrated silicon based semiconductors that have embedded or
integrated the non-silicon based laser transmitters and receivers
to enable a smaller, lower cost, higher reliable alternative to
traditional fiber optic transceivers currently used in data center
and telecommunication infrastructure.
“Silicon photonics devices all need to have their photonics
transmitters stabilized under high power and temperature and
customers also use our systems to screen for infant mortality of
these devices to ensure high initial quality and long-term
reliability. This is a manufacturing step done on 100% of the die,
and in the case of silicon photonics we provide a much more cost
effective and scalable solution for this step than doing this
equivalent stabilization and screening after the die are put onto
the final PCB substrate and package. Market research company Yole
Dévelopement predicts the silicon photonics market will grow at a
CAGR of 42% between 2019 and 2025 to a $3.6 billion annual market
and we believe that the industry will transition to wafer level or
singulated die for this critical manufacturing step, which is where
our FOX-P products stand alone as the most cost-effective solution
for this on the market”
The semiconductor industry today exceeds $400 billion per year
with a single CMOS chip containing billions of transistors, forming
complex circuits that are still 100% electrical. Using photons
instead of electrons, silicon photonics brings optical
communications into the fabrication space of the semiconductor
industry, enabling low-cost, high-volume assembly and the
capability to bring faster, smaller, interconnects, which consume
less power and offer the entire semiconductor industry a whole new
world of opportunities. Silicon photonics is expected to be
the most scalable optical transceiver technology available while
delivering lowest cost per bit for 100Gb and higher transfer
speeds. Next generation data centers, high performance computers,
and eventually consumer video products will all benefit from
optical interconnects built from silicon photonics.
The FOX-XP system, available with multiple
WaferPak™ Contactors (full wafer test) or multiple
DiePak™ Carriers (singulated die/module test) configurations,
is capable of functional test and burn-in/cycling of integrated
devices such as silicon carbide power devices, silicon photonics as
well as other optical devices, 2D and 3D sensors, flash memories,
Gallium Nitride (GaN), magnetic sensors, microcontrollers, and
other leading-edge ICs in either wafer formfactor, before they are
assembled into single or multi-die stacked packages, or in
singulated die or module formfactor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and
FOX-P™ families of test and burn-in systems and FOX
WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The FOX-CP system is a new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and the newest addition to the FOX-P product
family. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, Aehr’s ability to generate
bookings and revenue increases in the future, including the second
half of fiscal 2021; future requirements and orders of Aehr’s new
and existing customers; bookings forecasted for proprietary
WaferPak™ and DiePak consumables across multiple market
segments; the temporary nature of customer pushouts; shipping
timelines for products and follow-on capacity orders; the growth of
Aehr’s systems and consumables, including as a percentage of total
sales; financial guidance for fiscal 2021, including related to
revenue and profitability; Aehr’s ability to expand its number of
customers using its FOX-P™ solutions; the ability to secure
potential customer engagements; expectations related to long-term
demand for Aehr’s productions and the attractiveness of key
markets; the belief that Aehr will be stronger after the current
worldwide COVID-19 pandemic, including expectations related to
greater production, more customers, more applications, and higher
value products. The forward-looking statements contained in this
press release are also subject to other risks and uncertainties,
including those more fully described in Aehr’s Form 10-K for fiscal
2020, Form 10-Q for the first fiscal quarter of fiscal 2021 and
other reports filed from time to time with the Securities and
Exchange Commission. Aehr disclaims any obligation to update
information contained in any forward-looking statement to reflect
events or circumstances occurring after the date of this press
release.
Contacts:
Aehr
Test Systems |
|
MKR
Investor Relations Inc. |
Vernon Rogers |
|
Todd Kehrli or Jim Byers |
EVP Sales and Marketing |
|
Analyst/Investor Contact |
(510) 623-9400 x215 |
|
(323) 468-2300 |
vrogers@aehr.com |
|
aehr@mkr-group.com |
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