Aehr Test Systems to Participate in the Virtual 12th Annual CEO Investor Summit 2020
December 08 2020 - 7:30AM
Aehr Test Systems (Nasdaq: AEHR), a worldwide supplier of
semiconductor test and reliability qualification equipment, today
announced that Gayn Erickson, President and CEO, and Ken Spink,
CFO, will participate in the 12th Annual CEO Investor Summit being
held virtually this year on December 16, 2020.
“We look forward to discussing our semiconductor
wafer level and singulated die test and burn-in solutions and the
markets they serve with investors,” said Mr. Erickson. “Aehr Test
provides complete production solutions for improving yield and
reliability of semiconductors, and devices such as silicon carbide
semiconductors used in electric and hybrid electric vehicles,
silicon photonics devices used in data centers and 5G
infrastructure, and 2D/3D and other sensors used in mobile and
wearable applications, which are expected to be significant revenue
drivers for our products this fiscal year and next.”
About The 12th
Annual Virtual CEO Summit 2020
The CEO Summit is hosted by executive management
from participating companies and will feature a virtual
“round-robin” format consisting of small group meetings, each 40
minutes in duration. Each company will be available for up to six
meeting slots during the conference, while investors and analysts
will have the opportunity to meet with 12 of the participating
management teams from 8:15a.m. until 5:15p.m. EST on December
16th.
The 16 management teams collectively hosting the
12th Annual Virtual CEO Summit 2020 currently include:
ACM Research (ACMR), Advanced Energy Industries
(AEIS), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL),
Axcelis (ACLS), Brooks Automation (BRKS), Camtek (CAMT), Cohu
(COHU), Everspin Technologies (MRAM), FormFactor (FORM), Ichor
Systems (ICHR), inTEST Corporation (INTT), Intevac (IVAC), Kulicke
& Soffa (KLIC), Onto Innovation (ONTO) and Veeco Instruments
(VECO). Intro-act is sponsoring the conference.
The Virtual CEO Summit is by invitation only and
is open to accredited investors and publishing research analysts.
As space is limited, please RSVP early. Hosts reserve the right to
limit attendance as necessary. Advance registration and company
meeting selection is required. Last day for registration is
December 10, 2020.
RSVP Contacts for
12th Annual Virtual CEO Summit
2020
To RSVP for the Virtual CEO Summit, please contact
either of the Summit’s co-chairs.
Laura J. Guerrant-Oiye Guerrant Associates
Phone: (808) 960-2642 Email: laura@ga-ir.com
Claire E. McAdams Headgate Partners LLC Phone:
(530) 265-9899 Email: claire@headgatepartners.com
About Aehr Test
Systems Headquartered in Fremont, California, Aehr
Test Systems is a worldwide provider of test systems for burning-in
and testing logic, optical and memory integrated circuits and has
over 2,500 systems installed worldwide. Increased quality and
reliability needs of the Automotive and Mobility integrated circuit
markets are driving additional test requirements, incremental
capacity needs, and new opportunities for Aehr Test products in
package, wafer level, and singulated die/module level test. Aehr
Test has developed and introduced several innovative products,
including the ABTS™ and FOX-P™ families of test and
burn-in systems and FOX WaferPak™ Aligner, FOX-XP WaferPak
Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS
system is used in production and qualification testing of packaged
parts for both lower power and higher power logic devices as well
as all common types of memory devices. The FOX-XP and FOX-NP
systems are full wafer contact and singulated die/module test and
burn-in systems used for burn-in and functional test of complex
devices, such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The FOX-CP system is a new low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices and the newest addition to the
FOX-P product family. The WaferPak contactor contains a unique full
wafer probe card capable of testing wafers up to 300mm that enables
IC manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts: |
|
Aehr Test
SystemsKen SpinkChief Financial Officer(510) 623-9400
x309 |
MKR Investor Relations
Inc. Todd Kehrli or Jim Byers Analyst/Investor
Contact(323) 468-2300aehr@mkr-group.com |
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