Aehr to Showcase FOX-P™ Wafer-Level, Die and Module Test Solutions at Virtual SWTest Untethered 2020 Conference on November...
November 09 2020 - 07:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and reliability qualification equipment, will be
showcasing its FOX-P™ platform for multi-wafer, die and module test
and burn-in systems for high volume production at the Virtual
SWTest (Semiconductor Wafer Test) Untethered 2020 Conference and
Expo on November 11, 2020.
In concert with the conference focus on wafer and die level
probing, Aehr Test will be showcasing its FOX-P wafer level,
singulated die and module solutions, including its WafterPak™
Contactors and DiePak® Carriers, for test and burn-in of logic,
memory, optical and power devices to enhance the reliability of
product quality produced by semiconductor manufacturers, with a
specific focus on applications in 5G, Data Centers and Electric
Vehicles. These key high-growth market segments require new
technologies such as Gallium Arsenide (GaS), Gallium Nitride (GaN),
Indium Phosphide (InPh) and Silicon Carbide (SiC) that require test
and burn-in of every device to achieve the high-level quality
standards in mission critical applications.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We look forward to discussing the unique capabilities
of our FOX-P™ family of products, particularly for the silicon
carbide and silicon photonic markets where we have added
significant new customers who recognize the value of our solutions
in achieving success in the validation of their devices.
“Our wafer level test and burn-in systems are optimal for
reliability qualification in the emerging silicon carbide device
market that is expected to grow significantly. The high reliability
requirement of SiC in automotive and industrial applications
require the necessity of test and burn-in of every device, and a
critical capability that only our solution can provide on the
market today is the ability to test 100% of the die on a wafer in a
single insertion, while providing 100% traceability of pass fail
results of each device including exactly what time during the test
and burn in cycle the devices failed. This is a critical feature to
provide confidence to customers that they are removing all early
life failures prior to shipment.
“Our systems are able to test 100% of their devices on 4”, 6”,
8” and 12” wafers, and 150ºC burn-in 18 wafers at a time in a
single FOX-XP system. We believe our customers are able to save
significant costs by burning-in entire wafers at a time versus the
high costs associated with burning-in modules. Also, there are
significant cost savings as a result of detecting burn-in yield
losses at wafer level compared to yield losses detected at the more
expensive module level.”
The SWTest untethered 2020 Conference will be a one-day virtual
conference and expo featuring two keynote speakers, one in the AM
and one in the PM; seven technical presentations with live Q&A;
and an interactive Expo with live chat. The conference is the only
industry conference that focuses on all aspects of semiconductor
wafer and die level probe testing, featuring the perfect mixture of
manufacturer and vendor presentations. It is not a sales show, nor
an academic or theoretical conference, but rather a probe
technology forum where attendees come to learn about recent
developments in the industry and exchange ideas. Additional
information on the conference can be found on the SWTest website at
http://www.swtest.org.
The solutions Aehr test will feature include:
- The FOX family of products, which includes multi-wafer
test solutions that are capable of functional test and
burn-in/cycling of flash memories, microcontrollers and other
leading edge ICs in wafer form before they are assembled into
multi-die stacked packages. The FOX systems utilize Aehr
Test’s FOX WaferPak Contactors or DiePak® Carriers, which
provide a cost effective solution for making electrical contact
with a full wafer, panel, singulated die or module in a parallel
test and burn-in environment.
- The FOX-XP system, available with multiple WaferPakTM
Contactors (full wafer test) or multiple DiePak Carriers
(singulated die/module test) configurations, is capable of
functional test and burn-in/cycling of integrated devices such as
2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic
sensors, microcontrollers, optical modules, Silicon Carbide (SiC)
and other leading-edge ICs in either wafer formfactor, before they
are assembled into single or multi-die stacked packages, or in
singulated die or module formfactor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts: |
|
|
|
Aehr Test Systems |
MKR Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
E.V.P. of Sales & Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(323) 468-2300 |
vrogers@aehr.com |
aehr@mkr-group.com |
Aehr Test Systems (NASDAQ:AEHR)
Historical Stock Chart
From Feb 2024 to Mar 2024
Aehr Test Systems (NASDAQ:AEHR)
Historical Stock Chart
From Mar 2023 to Mar 2024