Aehr Receives Initial Order for FOX-XP DiePak® Carriers for Mobile Device Sensors with new Optical Output Monitoring and Pow...
November 05 2020 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced a design win and an initial order for
multiple DiePak® Carriers for test and burn-in of its lead
customer’s next generation 3D sensor modules for mobile devices.
The customer will use these Aehr proprietary DiePaks for production
qualification, test, and burn-in of these devices prior to volume
production orders for additional DiePaks forecasted for later in
Aehr’s current fiscal year.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are excited to receive this order for a new design
that expands deployment of our test solutions to additional devices
with this large multinational customer and to engage with them
earlier in the design cycle of their next generation 3D sensor
modules. We continue to work closely with them and have resources
on site for both engineering and production deployment of our tools
during COVID-19. Aehr is seeing an uptick in interest of our FOX
systems and DiePaks for production test and burn-in of complex 2D
and 3D sensors in multiple mobile applications and we continue to
be optimistic about this market space.
“Our FOX-XP solution has many advanced technical capabilities
needed for testing and burning-in these devices to meet the
critical quality, reliability, and traceability requirements of
this customer for their latest sensor modules. This high-power
configuration of our FOX-XP system is available with up to nine
individual Blades that can each test up to 1,024 devices per DiePak
Carrier. In addition, the system is capable of heating or cooling
devices using a proprietary design using thermal conductivity,
which is much more accurate than thermal convection. It can manage
up to 2 kW of thermal power and over 1000 amps per DiePak to ensure
that each device’s desired junction temperature is maintained very
accurately.”
Aehr’s FOX systems and full wafer and singulated die and module
solutions are significantly differentiated from other solutions on
the market and focused on providing 100% confidence and
traceability of test and burn-in of every device during the entire
test and burn-in duration. The features that are critical for
advanced 2D and 3D sensor module test and burn-in include:
- Reading and writing individual digital identification IDs
through I2C and SPI protocols across 1000s of devices
- Reading and logging both digital and analog temperatures per
device throughout the test and burn-in process
- Automatic monitoring of current and voltage supplied against
programmable limits (both high and low) and the ability to disable
them in real time per DUT
- Controlling temperature of the device via a new feature that
allows modulating the power delivered to the device via voltage,
current, and pulse width modulation of voltages and currents on a
per DUT basis
- Monitoring output power of VCSEL arrays, individual VCSELs,
lasers, and LEDs via internal photo diodes as well as using per
device external photo detection sensors in the DiePaks
- Controlling the device test and burn-in temperatures via
conduction (direct contact with each device) up to 150ºC
The FOX-XP system, available with multiple
WaferPak™ Contactors (full wafer test) or multiple DiePak
Carriers (singulated die/module test) configurations, is capable of
functional test and burn-in/cycling of integrated devices such as
2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic
sensors, microcontrollers, optical modules, Silicon Carbide (SiC)
and other leading-edge ICs in either wafer formfactor, before they
are assembled into single or multi-die stacked packages, or in
singulated die or module formfactor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and
FOX-P™ families of test and burn-in systems and FOX
WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The FOX-CP system is a new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and the newest addition to the FOX-P product
family. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
“may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going
to,” “could,” “intends,” “target,” “projects,” “contemplates,”
“believes,” “estimates,” “predicts,” “potential,” or “continue,” or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. These statements are based on information available to
Aehr as of the date hereof, are based on current expectations,
forecasts and assumptions, and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements in this press release
include, but are not limited to, statements regarding Aehr’s
expectations, beliefs, intentions or strategies regarding its
products and its business, including statements regarding future
market opportunities and conditions; Aehr’s product capabilities;
expected product shipment dates; customer orders, commitments or
product uses; and Aehr’s collaboration with its customers. These
forward-looking statements include risks and uncertainties such as,
without limitation, customer demand and acceptance of Aehr’s
products, the ability of new products to meet customer needs or
perform as described, as well as general market conditions and
Aehr’s ability to execute on its business strategy. The
forward-looking statements contained in this press release are also
subject to other risks and uncertainties, including those more
fully described in Aehr’s recent 10-K, 10-Q and other reports from
time to time filed with the Securities and Exchange Commission.
Aehr disclaims any obligation to update information contained in
any forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts:
Aehr Test Systems |
MKR Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
EVP Sales and Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(323) 468-2300 |
vrogers@aehr.com |
aehr@mkr-group.com |
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