Aehr Test Systems to Announce First Quarter Fiscal 2020 Financial Results on October 3, 2019
September 25 2019 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and reliability qualification equipment, today
announced that it will report financial results for its first
quarter of fiscal 2020 ended August 31, 2019 on Thursday, October
3, 2019 following the close of the market. The Company will host a
conference call and webcast at 5:00 p.m. Eastern time to discuss
the results.
What: |
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Aehr Test
Systems first quarter fiscal 2020 financial results conference
call. |
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When: |
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Thursday, October 3rd at 5:00 p.m. Eastern Time (2:00 p.m.
PT). |
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Dial in Number: |
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To access the live call, dial 888-254-3590 (US
and Canada) or +1 323-794-2551 (International) and
give the participant passcode 9820003. |
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Webcast: |
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To access the live webcast, please visit the investor relations
section at www.aehr.com. |
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Call Replay: |
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A phone replay of the call will be available approximately two
hours following the end of the call through 8:00 p.m. ET on
Thursday, October 10, 2019. To access the replay dial-in
information, please click here. |
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts:
Aehr Test SystemsKen SpinkChief
Financial Officer(510) 623-9400 x309
MKR Investor Relations Inc.Todd
Kehrli or Jim ByersAnalyst/Investor Contact(323)
468-2300aehr@mkr-group.com
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