Aehr Test Systems to Announce Third Quarter Fiscal 2019 Financial Results on April 4, 2019
March 25 2019 - 4:05PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and burn-in equipment, today announced that it
will report financial results for its third quarter of fiscal 2019
ended February 28, 2019 on Thursday, April 4, 2019 following the
close of the market. The Company will host a conference call and
webcast at 5:00 p.m. Eastern time to discuss the results.
What:
Aehr Test Systems third quarter fiscal 2019 financial results
conference call.
When:
Thursday, April 4th at 5:00 p.m. Eastern Time (2:00 p.m. PT).
Dial in
Number: To
access the live call, dial 800-263-0877 (US and
Canada) or +1 323-994-2132 (International) and
give the participant passcode
6357648.
Webcast:
To access the live webcast, please visit the investor relations
section at www.aehr.com.
Call Replay:
A phone replay of the call will be
available approximately two hours following the end of the call
through 8:00 p.m. ET on Thursday, April 11, 2019. To access the
replay dial-in information, please click here.
About Aehr Test Systems Headquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and FOX-P™
families of test and burn-in systems and FOX WaferPak™ Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP system is a full wafer contact and singulated die/module
test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal
processors, microprocessors, microcontrollers, systems-on-a-chip,
and integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts: |
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|
|
Aehr Test
Systems |
|
|
Investor
Relations Contact: |
Ken Spink |
|
|
Todd Kehrli or Jim
Byers |
Chief Financial
Officer |
|
|
MKR Group, Inc. |
(510) 623-9400
x309 |
|
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(323) 468-2300 |
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aehr@mkr-group.com |
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