Aehr to Showcase its Newest FOX-P™ Test and Reliability Qualification Solutions at SPIE Photonics West 2019 in San Francis...
February 01 2019 - 5:16PM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and reliability
qualification equipment, today announced it will be exhibiting in
booth 4046 at the SPIE Photonics West 2019 Conference February 5 -
7 in San Francisco, CA at the Moscone Convention Center.
Aehr will be showcasing its next generation solutions for
functional test and early failure rate (EFR) test of optical
devices in wafer, panel, singulated die or module form, including
its FOX-XPTM system for high volume production and its new FOX-NPTM
low cost, small footprint entry-level system. In addition to
functional test and reliability screening, the FOX systems provide
the ability to stabilize laser optical performance, which is
critical for the photonics market.
SPIE Photonics West is the world’s premier annual event for the
photonics, laser, and biomedical optics industries, spanning
biophotonics for brain research and healthcare, lasers for research
and advanced manufacturing, sensors and camera systems, imaging and
displays, communications and optoelectronics, plus the core optical
components that enable many of today’s consumer products.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are excited to be showcasing our next generation
FOX-P test and burn-in solutions at SPIE Photonics West, including
our newest systems that we believe will significantly expand the
market for our FOX-P products. We are very optimistic about the
silicon photonics and photonics sensors markets and believe they
will be significant growth drivers for Aehr. Market research
company Yole Développement predicts silicon photonics technology
will grow from being used in a few percent of the total optical
transceiver market in 2016 to 35% of the market in 2025, with a
market value for transceivers of almost $4 billion in 2025.
“The rapid growth of integrated optical devices in
high-performance servers and data centers, mobile devices,
automotive applications, and now wearable biosensors is driving
substantially higher requirements for initial quality and long-term
reliability, and the requirements are increasing with every new
product generation. We believe these new applications are driving
an entirely new level of quality and reliability expectation for
these systems and pose a significant long-term growth opportunity
for Aehr.”
Aehr’s FOX-P Platform is the company’s next-generation
multi-wafer and singulated die/module test solution that is capable
of functional test and burn-in/cycling of photonics devices, flash
memories, microcontrollers, sensors, and other leading-edge ICs
before they are assembled into single or multi-die stacked
packages. The FOX wafer-level systems utilize Aehr’s FOX WaferPakTM
contactors, which provide cost effective solutions for making
electrical contact with a full wafer or substrate in a multi-wafer
environment. The configuration with the DiePak® Carriers enables
burn-in of singulated die and multi-die modules to screen for
defects in both the die and the module assembly process. The
resulting known-good die, single-die or stacked-die packaged parts
can then be used for high reliability and quality applications such
as enterprise solid state drives, automotive devices, highly
valuable mobile applications, and mission critical integrated
circuits and sensors.
The key features of the FOX-P Platform that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test system
may be configured with up to 18 blades of wafer test resources,
enabling up to 18 wafers to be tested simultaneously. The footprint
of the 18-wafer test system is similar to the footprint of typical
semiconductor Automatic Test Equipment (ATE) that can only test one
wafer at a time. The highly integrated 2-blade FOX-NP system has a
very small footprint and is designed to be easily integrated into
product design, reliability and test lab applications.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr products in package, wafer level, and singulated die/module
level test. Aehr has developed and introduced several innovative
products, including the ABTSTM and FOX-PTM families of test and
burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak
Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS
system is used in production and qualification testing of packaged
parts for both lower power and higher power logic devices as well
as all common types of memory devices. The FOX-XP system is a full
wafer contact and singulated die/module test and burn-in system
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
FOX systems. The DiePak Carrier is a reusable, temporary package
that enables IC manufacturers to perform cost-effective final test
and burn-in of both bare die and modules. For more information,
please visit Aehr’s website at www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr’s expectations, beliefs, intentions or strategies
regarding its products, including statements regarding future
market opportunities and conditions, expected product shipment
dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr’s products, the ability of new products to meet
customer needs or perform as described, as well as general market
conditions and Aehr’s ability to execute on its business strategy.
See Aehr’s recent 10-K, 10-Q and other reports from time to time
filed with the Securities and Exchange Commission for a more
detailed description of the risks facing Aehr’s business. Aehr
disclaims any obligation to update information contained in any
forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts: |
|
|
|
|
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Aehr Test
Systems |
|
MKR Group Inc. |
Carl Buck |
|
Todd Kehrli or Jim
Byers |
V.P. of Marketing |
|
Analyst/Investor
Contact |
(510) 623-9400
x381 |
|
(323) 468-2300 |
cbuck@aehr.com |
|
aehr@mkr-group.com |
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