Aehr Test Announces New FOX-NP™ Test and Burn-in System
January 10 2019 - 4:06PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced its new FOX-NP Test and Burn-in System for wafers,
panels, singulated die and modules. The FOX-NP system is a new
configuration within the Company’s FOX-PTM product family that is a
low cost, small footprint entry-level system providing a
configuration and price point for companies to do initial product
development, product qualification and production. The FOX-NP
System will begin volume shipments early in Aehr Test’s fiscal
fourth quarter ending May 31, 2019. Aehr Test will showcase the new
FOX-NP system in Booth 4046 at the SPIE Photonics West conference
at the Moscone Convention Center in San Francisco February 2-7,
2019.
The FOX-NP system is 100% compatible with the FOX-XPTM Test and
Burn-in System. It uses the same blades as the FOX-XP system and is
configurable with up to two blades, versus the FOX-XP high-volume
production system that can be configured with up to 18 blades.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “The FOX-NP system provides a configuration and price
point for companies to do initial product qualification and New
Product Introduction, enabling an easier transition to the FOX-XP
system for full production test. Multiple FOX-NP systems enable
customers to run many wafers, panels, modules or die in parallel at
different temperatures and burn-in test conditions as part of their
development and qualification process. This allows customers to
quickly evaluate wafers fabricated at completely different process
variations and to perform production screening and life test in
parallel cost-effectively. Since each FOX-NP system has its own
thermal control system, multiple small FOX-NP chambers provide
multiple independent thermal temperature environments.
“We believe that the new FOX-NP system will significantly expand
the market for our FOX-P products. We have worked with multiple
customers to define this new FOX-NP system, and we have already
received a commitment from multiple customers to use the system for
test and burn-in of their devices. We expect an order imminently
from a new customer to use the FOX-NP system for test and burn-in
of silicon photonics devices. The FOX-NP system is affordable and
low risk for smaller companies or new applications where the
initial volumes are low. It also opens up a new application for
reliability screening requiring different
temperatures. Although the wafer sample size for reliability
qualification may be low, there are many unique wafer types, so a
customer may use many FOX-NP systems.
“The rapid growth of integrated optical devices in 3D sensing in
mobile devices, the 5G communications infrastructure,
high-performance servers and data centers, automotive safety and
driver assistance applications, and now wearable biosensor markets,
is driving a rapidly expanding base of customers providing products
for these applications. We believe these new applications are
driving an entirely new level of quality and reliability
expectation for products for these applications and pose a
significant long-term growth opportunity for Aehr Test,” Erickson
concluded.
Aehr Test’s FOX-P platform is the company’s next-generation
multi-wafer and singulated die/module test solution that is capable
of functional test and burn-in/cycling of photonics devices, flash
memories, microcontrollers, sensors, and other leading-edge ICs
before they are assembled into single or multi-die stacked
packages. The FOX-P wafer-level systems utilize Aehr Test's FOX
WaferPakTM contactors, which provide cost effective solutions for
making electrical contact with a full wafer or substrate in a
multi-wafer environment. The configuration with the DiePak®
Carriers enables burn-in of singulated die and multi-die modules to
screen for defects in both the die and the module assembly process.
The resulting known-good die, single-die or stacked-die packaged
parts can then be used for high reliability and quality
applications such as enterprise solid state drives, automotive
devices, highly valuable mobile applications, and mission critical
integrated circuits and sensors.
The key features of the FOX-P platform that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test system
may be configured with up to 18 blades of wafer test resources,
enabling up to 18 wafers to be tested simultaneously. The footprint
of the 18-wafer FOX-XP test system is similar to the footprint of
typical semiconductor Automatic Test Equipment (ATE) that can only
test one wafer at a time. The highly integrated 2-blade FOX-NP
system has a very small footprint and is designed to be easily
integrated into product design, reliability and test lab
applications.
About Aehr Test Systems Headquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and FOX-P families
of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak
Contactor, FOX DiePak Carrier and FOX DiePak Loader. The ABTS
system is used in production and qualification testing of packaged
parts for both lower power and higher power logic devices as well
as all common types of memory devices. The FOX-XP and FOX-NP
systems are full wafer contact and singulated die/module test and
burn-in systems used for burn-in and functional test of complex
devices, such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The WaferPak Contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers and panels on Aehr Test FOX systems. The DiePak Carrier is a
reusable, temporary package that enables IC manufacturers to
perform cost-effective final test and burn-in of both bare die and
modules. For more information, please visit Aehr Test Systems’
website at www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr Test as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr Test’s expectations, beliefs, intentions or
strategies regarding its products, including statements regarding
future market opportunities and conditions, expected product
shipment dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr Test’s products, the ability of new products to
meet customer needs or perform as described, as well as general
market conditions and Aehr Test’s ability to execute on its
business strategy. See Aehr Test’s recent 10-K, 10-Q and other
reports from time to time filed with the Securities and Exchange
Commission for a more detailed description of the risks facing Aehr
Test’s business. Aehr Test disclaims any obligation to update
information contained in any forward-looking statement to reflect
events or circumstances occurring after the date of this press
release.
Contacts: |
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Aehr Test
Systems Carl Buck V.P. of Marketing (510) 623-9400 x381
cbuck@aehr.com |
MKR Group
Inc.Todd Kehrli or Jim ByersAnalyst/Investor Contact (323)
468-2300aehr@mkr-group.com |
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