Aehr Receives Follow-on Order for FOX-XP™ Wafer Level Test and Burn-in System for Production Test of Silicon Photonics Dev...
September 27 2018 - 4:06PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced that it has received a $2.7 million follow-on order from
one of its lead FOX-XP Test and Burn-in System customers for a
FOX-XP Multi-Wafer Test and Burn-in System and WaferPakTM Aligner
to provide additional test capacity for the customer’s increasing
silicon photonics device production requirements. The order
includes down payments per Aehr Test’s standard terms and
conditions of sale. The FOX-XP System and WaferPak Aligner are
expected to ship in the next six months.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are excited to receive this follow-on order for an
additional full wafer test and burn-in system for silicon photonics
devices. This customer is one of the world’s largest semiconductor
manufacturers, and we are pleased to see their continuing ramp-up
in production wafer-level burn-in capacity. With the increasing
capacity of systems they are building up, we are expecting orders
for a significant number of our proprietary WaferPak contactors to
meet their production capacity, and we anticipate ongoing WaferPak
needs with each new device change. In addition, this customer is
forecasting capacity growth for silicon photonics devices that we
expect to drive the need for additional production burn-in capacity
for multiple years into the future.
“We continue to be very optimistic about the silicon photonics
and photonics sensors markets and believe they will be significant
growth drivers for Aehr Test. According to Market Research Engine,
silicon photonics for data center and high performance computing is
projected to grow at a compounded rate of 26.8% from 2017 through
2024. The rapid growth of integrated optical devices in mobile
devices, high-performance servers and data centers, automotive
applications, and now wearable biosensor markets, is driving
substantially higher requirements for initial quality and long-term
reliability, and they are increasing with every new product
generation. We believe these new applications are driving an
entirely new level of quality and reliability expectation for these
systems and pose a significant long-term growth opportunity for
Aehr Test.”
Aehr Test’s FOX-XP system is the company’s next-generation
multi-wafer and singulated die/module test solution that is capable
of functional test and burn-in/cycling of photonics devices, flash
memories, microcontrollers, sensors, and other leading-edge ICs in
wafer form before they are assembled into single or multi-die
stacked packages. The FOX wafer-level systems utilize Aehr Test's
FOX WaferPak contactors, which provide cost effective solutions for
making electrical contact with a full wafer or substrate in a
multi-wafer environment. The new configuration with the DiePak®
Carriers also enables burn-in of singulated die and multi-die
modules to screen for defects in both the die and the module
assembly process. The resulting known-good die or single-die or
stacked-die packaged parts can then be used for high reliability
and quality applications such as enterprise solid state drives,
automotive devices, highly valuable mobile applications, and
mission critical integrated circuits and sensors.
The key features of the FOX-XP test cell that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test
system may be configured with up to 18 blades of wafer test
resources, enabling up to 18 wafers to be tested simultaneously.
The footprint of the 18-wafer test system is similar to the
footprint of typical semiconductor Automatic Test Equipment (ATE)
that can only test one wafer at a time.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP system is a full wafer contact and singulated die/module
test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal
processors, microprocessors, microcontrollers, systems-on-a-chip,
and integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr Test as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr Test’s expectations, beliefs, intentions or
strategies regarding its products, including statements regarding
future market opportunities and conditions, expected product
shipment dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr Test’s products, the ability of new products to
meet customer needs or perform as described, as well as general
market conditions and Aehr Test’s ability to execute on its
business strategy. See Aehr Test’s recent 10-K, 10-Q and other
reports from time to time filed with the Securities and Exchange
Commission for a more detailed description of the risks facing Aehr
Test’s business. Aehr Test disclaims any obligation to update
information contained in any forward-looking statement to reflect
events or circumstances occurring after the date of this press
release.
Contacts: |
|
|
|
Aehr Test
Systems |
MKR Group
Inc. |
Carl Buck |
Todd Kehrli or Jim
Byers |
V.P of Marketing |
Analyst/Investor
Contact |
(510) 623-9400
x381 |
(323) 468-2300 |
cbuck@aehr.com |
aehr@mkr-group.com |
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