TSMC Commits to Reach Net Zero Emissions by 2050, Acting on Responsibility to Environmental Sustainability
September 16 2021 - 5:07AM
Business Wire
A Global Semiconductor Industry Leader in
Publishing TCFD Report
TSMC (TWSE: 2330, NYSE: TSM) today marked the International Day
for the Preservation of the Ozone Layer with a commitment to reach
net zero emissions by 2050. The Company also published its Task
Force on Climate-related Financial Disclosures (TCFD) Report,
becoming a semiconductor industry frontrunner in climate disclosure
while taking actions towards the Company’s environmental
sustainability goals.
As a responsible corporate citizen, TSMC strives to adapt to
climate change and mitigate climate impact to protect our shared
global environment. Guided by its ESG Policy and Environmental
Policy, TSMC actively plans and implements actions to mitigate
climate change, closely tracks a wide range of global climate
action indicators, and is now taking a step further to create its
roadmap to reach net zero emissions.
In 2018, TSMC published its Climate Change Statement, clearly
stating that the Company addresses climate change through the two
key measures of impact mitigation and risk adaption. At the same
time, TSMC adopted the framework set by the Financial Stability
Board's TCFD to identify risks and opportunities, as well as to set
measurement benchmarks and manage targets. With an effective grasp
of the progress and results of its actions taken on climate change,
TSMC is able to lower the financial impact of climate risk on
operations, and disclose results in the TSMC Corporate Social
Responsibility Report.
To further address stakeholders’ concerns on climate change and
focus on related issues, TSMC followed the TCFD framework and its
spirit to publish the TCFD report in 2021, systematically
disclosing management strategy and targets, ensuring sound
execution and controls, and providing a comprehensive description
of TSMC’s work and progress in responding to climate change.
“TSMC is deeply aware that climate change has a severe impact on
the environment and humanity. As a world-leading semiconductor
company, TSMC must shoulder its corporate responsibility to face
the challenge of climate change,” said Dr. Mark Liu, Chairman of
TSMC and Chairman of the Company’s ESG Steering Committee. “In
addition to becoming the world’s first semiconductor company to
join RE100, this year we have answered the call to action on net
zero and published our TCFD report, aiming to broaden our green
influence and drive the industry towards low-carbon
sustainability.”
In 2020, TSMC established its Net Zero Project, composed of
working groups from relevant organizations which discuss and
evaluate the net zero target. In the same year, TSMC’s global
offices achieved net zero emissions of greenhouse gases. To achieve
its goal of net zero by 2050, TSMC will set related mitigation
measures, continue to strengthen its wide variety of green
innovations, and actively adopt renewable energy. The Company has
set the short-term goals of zero emissions growth by 2025, and
reducing emissions to year 2020 levels by 2030. TSMC will continue
actively evaluating and investing in all types of opportunities to
reduce carbon emissions.
For TSMC 2020 TCFD Report, please visit
https://esg.tsmc.com/download/csr/TSMC_TCFD_Report_E.pdf
About TSMC
TSMC pioneered the pure-play foundry business model when it was
founded in 1987, and has been the world’s leading dedicated
semiconductor foundry ever since. The Company supports a thriving
ecosystem of global customers and partners with the industry’s
leading process technologies and portfolio of design enablement
solutions to unleash innovation for the global semiconductor
industry. With global operations spanning Asia, Europe, and North
America, TSMC serves as a committed corporate citizen around the
world.
TSMC deployed 281 distinct process technologies, and
manufactured 11,617 products for 510 customers in 2020 by providing
broadest range of advanced, specialty and advanced packaging
technology services. TSMC is the first foundry to provide
5-nanometer production capabilities, the most advanced
semiconductor process technology available in the world. The
Company is headquartered in Hsinchu, Taiwan. For more information,
please visit https://www.tsmc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20210916005379/en/
TSMC Spokesperson: Wendell Huang Vice President and CFO
Tel: +886-3-505-5901
TSMC Media Contacts: Nina Kao Head of Public Relations
Tel: 886-3-5636688 ext.7125036 Mobile: +886-988-239-163 E-Mail:
nina_kao@tsmc.com
Hui-Chung Su Public Relations Tel: 886-3-563-6688 ext.7125033
Mobile: +886-988-930-039 E-Mail: hcsuq@tsmc.com
Michael Kramer Public Relations Tel: 886-3-5636688 ext.7125031
Mobile: +886-988-931-352 E-Mail: pdkramer@tsmc.com
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