AMD Showcases Industry-Leading Innovation Across the High-Performance Computing Ecosystem at COMPUTEX 2021
May 31 2021 - 11:00PM
Today at COMPUTEX 2021, AMD (NASDAQ: AMD) showcased its latest
computing and graphics technology innovations to accelerate the
high-performance computing ecosystem, spanning gaming, PCs and the
data center. AMD President and CEO Dr. Lisa Su unveiled the latest
breakthrough in high-performance computing pioneered by AMD with
new 3D chiplet technology; expanded adoption of AMD computing and
graphics technologies in the automotive and mobile markets with
industry leaders Tesla and Samsung; new AMD Ryzen™ processor
offerings for enthusiasts and consumer PCs; leadership data center
performance with the latest 3rd Gen AMD EPYC™ processors; and a
full slate of new AMD graphics technologies for gamers.
“At Computex, we highlighted the growing
adoption of our high-performance computing and graphics
technologies as AMD continues setting the pace of innovation for
the industry,” said Dr. Su. “With the launches of our new Ryzen and
Radeon processors and the first wave of AMD Advantage notebooks, we
continue expanding the ecosystem of leadership AMD products and
technologies for gamers and enthusiasts. The next frontier of
innovation in our industry is taking chip design into the third
dimension. Our first application of 3D chiplet technology at
Computex demonstrates our commitment to continue pushing the
envelope in high-performance computing to significantly enhance
user experiences. We are proud of the deep partnerships we have
cultivated across the ecosystem to power the products and services
that are essential to our daily lives.”
Accelerating Chiplet and Packaging
InnovationAMD continues to build on its leadership IP and
investments in leading manufacturing and packaging technologies
with AMD 3D chiplet technology, a packaging breakthrough that
combines AMD’s innovative chiplet architecture with 3D stacking
using an industry-leading hybrid bond approach that provides over
200 times the interconnect density of 2D chiplets and more than 15
times the density compared to existing 3D packaging solutions.
Pioneered in close collaboration with TSMC, the industry-leading
technology also consumes less energy1 than current 3D solutions and
is the most flexible active-on-active silicon stacking technology
in the world.
AMD showed the first application of 3D chiplet
technology at COMPUTEX 2021 – a 3D vertical cache bonded to an AMD
Ryzen™ 5000 Series processor prototype that is designed to deliver
significant performance gains across a broad set of applications.
AMD is on-track to begin production on future high-end computing
products with 3D chiplets by the end of this year.
[33:49-38:49]
Bringing the AMD RDNA™ 2 Gaming
Architecture to New MarketsAMD announced that it is
bringing new gaming experiences to the automotive and mobile
markets through its deep partnerships with industry leaders.
- The newly designed infotainment
systems in the Tesla Model S and Model X are powered by an AMD
Ryzen Embedded APU and an AMD RDNA 2 architecture-based GPU that
enables AAA gaming. [11:19-12:02]
- AMD is partnering with Samsung on
its next generation Exynos SoC, which will feature custom AMD RDNA
2 architecture-based graphics IP that brings raytracing and
variable rate shading capabilities to flagship mobile devices.
[12:08-12:40]
AMD Radeon 6000M Series Mobile Graphics
Powering Next-Gen Premium Gaming Laptops AMD introduced
several powerful new solutions that take high-performance gaming to
new levels.
- AMD Radeon RX 6000M Series
Mobile Graphics: Designed to bring world-class
performance, incredible visual fidelity and immersive experiences
to gaming laptops, AMD Radeon RX 6000M Series GPUs harness the
breakthrough AMD RDNA 2 gaming architecture to deliver up to 1.5X2
higher gaming performance than AMD RDNA architecture.
[12:40-19:06]
- AMD Advantage Design
Framework: A collaborative effort between AMD and its
global PC partners to deliver the next generation of premium gaming
laptops by combining high-performance AMD Radeon RX 6000M Series
Mobile Graphics, AMD Radeon™ Software and AMD Ryzen™ 5000 Series
Mobile Processors with exclusive AMD smart technologies and other
advanced system design characteristics. The first AMD Advantage
laptops are expected to be available from leading OEMs starting
this month. [24:10-32:28]
- AMD FidelityFX Super
Resolution (FSR): A cutting-edge spatial upscaling
technology designed to boost framerates up to 2.5X in select titles
to deliver a high-quality, high-resolution gaming experience. The
open-source technology offers broad support on more than 100 AMD
processors and GPUs, as well as competitor GPUs, and more than 10
game developers plan to integrate FSR into their top titles and
game engines in 2021. [19:10-23:17]
Expanding the AMD Ryzen
Portfolio AMD expanded the Ryzen family of processors
further into the desktop space with new options for commercial
systems and enthusiasts.
- AMD Ryzen 5000G Series
Desktop APUs: The Ryzen 7 5700G and the Ryzen 5 5600G
bring the power of “Zen 3” and integrated Radeon graphics
performance together in a single chip and will be available to the
DIY market later this year. [8:26-10:20]
- AMD Ryzen PRO 5000 Series
Desktop Processors: The G- and GE-Series of desktop
processors, also launching today, bring leadership performance and
the most modern security features to business-ready,
enterprise-grade systems.
Solving Business Challenges with 3rd Gen
AMD EPYC™ ProcessorsAMD showcased how its leadership 3rd
Gen AMD EPYC processors and deep partnerships across the server
ecosystem are enabling the digital services and experiences that
billions of users rely on every day.
- With the introduction of 3rd Gen
EPYC processors, AMD has more than doubled the number of available
solutions compared to the previous generation processor, including
leading solutions for hyper converged infrastructure, data
management, data analytics and HPC that deliver outstanding
performance, security features and value to customers.
[2:45-5:00]
- In the first public competitive
demonstration against the latest Intel Xeon Scalable processors
using an e-commerce application, 3rd Gen EPYC processors delivered
50% more business transactions than the competition’s most powerful
two-socket system, while maintaining a comparable SLA3.
[5:00-6:48]
- AMD EPYC processors currently hold
220 world records4 across cloud, enterprise and HPC workloads
and applications.
Supporting Resources
- Watch the keynote
- Learn more about AMD Radeon 6000M Series GPUs
- Learn more about AMD Advantage
- Learn more about AMD FidelityFX Super Resolution
- Learn more about AMD Ryzen 5000 Series Desktop APUs
- Become a fan of AMD on Facebook
- Follow AMD on Twitter
About AMDFor more than 50 years
AMD has driven innovation in high-performance computing, graphics
and visualization technologies ― the building blocks for gaming,
immersive platforms and the data center. Hundreds of millions of
consumers, leading Fortune 500 businesses and cutting-edge
scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD
employees around the world are focused on building great products
that push the boundaries of what is possible. For more information
about how AMD is enabling today and inspiring tomorrow, visit the
AMD (NASDAQ: AMD) website, blog, Facebook and Twitter pages.
AMD, the AMD Arrow logo, EPYC, Radeon,
Ryzen and combinations thereof, are trademarks of Advanced Micro
Devices, Inc. Other names are for informational purposes only and
may be trademarks of their respective owners.
Cautionary StatementThis press
release contains forward-looking statements concerning Advanced
Micro Devices, Inc. (AMD) such as the features, functionality,
performance, availability, timing and expected benefits of AMD
Radeon™ RX 6000M Series Mobile Graphics GPUs, the AMD
Advantage Design Framework, AMD FidelityFX Super Resolution and AMD
Radeon RX 6000M-based laptops, which are made pursuant to the Safe
Harbor provisions of the Private Securities Litigation Reform Act
of 1995. Forward-looking statements are commonly identified by
words such as "would," "may," "expects," "believes," "plans,"
"intends," "projects" and other terms with similar meaning.
Investors are cautioned that the forward-looking statements in this
press release are based on current beliefs, assumptions and
expectations, speak only as of the date of this press release and
involve risks and uncertainties that could cause actual results to
differ materially from current expectations. Such statements are
subject to certain known and unknown risks and uncertainties, many
of which are difficult to predict and generally beyond AMD's
control, that could cause actual results and other future events to
differ materially from those expressed in, or implied or projected
by, the forward-looking information and statements. Material
factors that could cause actual results to differ materially from
current expectations include, without limitation, the following:
Intel Corporation’s dominance of the microprocessor market and its
aggressive business practices; global economic uncertainty; the
loss of a significant customer; the impact of the COVID-19 pandemic
on AMD’s business, financial condition and results of operations;
the competitive markets in which AMD’s products are sold; quarterly
and seasonal sales patterns; market conditions of the industries in
which AMD products are sold; the cyclical nature of the
semiconductor industry; AMD's ability to adequately protect its
technology or other intellectual property; unfavorable currency
exchange rate fluctuations; the ability of third party
manufacturers to manufacture AMD's products on a timely basis in
sufficient quantities and using competitive technologies; the
availability of essential equipment, materials, substrates or
manufacturing processes; expected manufacturing yields for AMD’s
products; AMD's ability to introduce products on a timely basis
with features and performance levels that provide value to its
customers; AMD's ability to generate revenue from its semi-custom
SoC products; potential security vulnerabilities; potential IT
outages, data loss, data breaches and cyber-attacks; uncertainties
involving the ordering and shipment of AMD’s products; AMD’s
reliance on third-party intellectual property to design and
introduce new products in a timely manner; AMD's reliance on
third-party companies for the design, manufacture and supply of
motherboards, software and other computer platform components;
AMD's reliance on Microsoft Corporation and other software vendors'
support to design and develop software to run on AMD’s products;
AMD’s reliance on third-party distributors and add-in-board
partners; the impact of modification or interruption of AMD’s
internal business processes and information systems; compatibility
of AMD’s products with some or all industry-standard software and
hardware; costs related to defective products; the efficiency of
AMD's supply chain; AMD's ability to rely on third party
supply-chain logistics functions; AMD’s ability to effectively
control the sales of its products on the gray market; the impact of
government actions and regulations such as export administration
regulations, tariffs and trade protection measures; AMD’s ability
to realize its deferred tax assets; potential tax liabilities;
current and future claims and litigation; the impact of
environmental laws, conflict minerals-related provisions and other
laws or regulations; the impact of acquisitions, joint ventures
and/or investments on AMD's business, including the announced
acquisition of Xilinx, and the failure to integrate acquired
businesses; AMD’s ability to complete the Xilinx merger; the impact
of the announcement and pendency of the Xilinx merger on AMD’s
business; the impact of any impairment of the combined company’s
assets on the combined company’s financial position and results of
operation; the restrictions imposed by agreements governing AMD’s
notes and the revolving credit facility; AMD's indebtedness; AMD's
ability to generate sufficient cash to service its debt obligations
or meet its working capital requirements; AMD's ability to
repurchase its outstanding debt in the event of a change of
control; AMD's ability to generate sufficient revenue and operating
cash flow or obtain external financing for research and development
or other strategic investments; political, legal, economic risks
and natural disasters; future impairments of goodwill and
technology license purchases; AMD’s ability to attract and retain
qualified personnel; AMD’s stock price volatility; and worldwide
political conditions. Investors are urged to review in detail the
risks and uncertainties in AMD’s Securities and Exchange Commission
filings, including but not limited to AMD’s most recent reports on
Forms 10-K and 10-Q.
1 Based on AMD engineering internal analysis,
May 20212 Testing done by AMD performance labs April 9 2021, on 25
games at 1440p using the flagship AMD RDNA 2 mobile part versus the
flagship AMD RDNA mobile part using 20.50-210215n driver, AMD Ryzen
9, 16GB DDR4-3200MHz, Win10 Pro 64. Performance may vary. RX-6613
MLN-092: SPECjbb® 2015-MultiJVM Critical comparison based on best
performing systems published at www.spec.org as of 4/28/2021, 2x
AMD EPYC™ 7763 scored 301,297 SPECjbb® 2015-MultiJVM Critical-jOPS
(359,067 max-jOPS,
https://spec.org/jbb2015/results/res2021q1/jbb2015-20210224-00612.html)
which has 50% higher critical server-side Java® operations than the
top “Ice Lake” 2x Intel® Xeon® Platinum 8380 that scored 201,334
critical-jOPS (258,368 max-jOPS,
https://spec.org/jbb2015/results/res2021q2/jbb2015-20210324-00635.html).
2x AMD EPYC 7H12 scored 248,942 critical-jOPS (315,663 max-jOPS,
http://spec.org/jbb2015/results/res2020q2/jbb2015-20200423-00550.html).
SPEC® and SPECjbb® are registered trademarks of the Standard
Performance Evaluation Corporation. See www.spec.org for more
information.4 EPYC-22: For a complete list of world records see
https://www.amd.com/en/processors/epyc-world-records.
Contact:Sarah
Feller AMD Communications(512)
602-4333sarah.feller@amd.com
Laura GravesAMD Investor
Relations(408) 749-5467 Laura.Graves@amd.com
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