IRVINE, Calif., May 4, 2021 /PRNewswire/ -- Interlink
Electronics Inc. (NASDAQ: LINK)—world-leading trusted technology
partner in the rapidly advancing world of human-machine interface
(HMI) devices, sensors, and other cutting-edge technologies—is
pleased to announce Dr. Gene Chen
has joined the team as vice president of engineering and advanced
materials. Chen will head up the company's new R&D and
materials science laboratory in Camarillo, Calif., and direct its global
engineering team.
Chen comes to Interlink with more than two decades of experience
in electrical engineering and has managed teams and projects in a
variety of fields, including force sensing technology. Prior to
joining Interlink, he was CTO at force sensor company New Degree
Technology, where he led its R&D and product development teams.
His diverse, interdisciplinary background has also included roles
managing projects working on nanomaterials and advanced materials
for applications ranging from LEDs and OLEDs to semiconductors to
dielectric coatings for spaceships. Chen has also served on
numerous grant review panels for the NSF and Department of
Energy.
"Interlink is constantly pushing its technological horizons
forward, with a particular emphasis on developing original,
in-house product solutions," said Steven N.
Bronson, chairman, president, and CEO of Interlink
Electronics. "Capitalizing on Gene's experience managing projects
in advanced materials, we can extend our product offerings."
Chen earned a doctorate of philosophy in electrical
engineering—focusing on electro-physics and microelectronics—from
the University of Maryland, College
Park. An active member of the scientific community, he holds
14 patents, has published 17 scientific papers, and has sat on
multiple peer review panels.
"It's wonderful to be joining Interlink during this amazing
period of expansion," said Dr. Chen. "The company's recent
investments in resources and personnel will allow us the freedom to
develop new technological solutions that shake up the status
quo."
About Interlink Electronics
Interlink Electronics is a
world-leading trusted provider of HMI, sensor, and IoT solutions.
In addition to standard product offerings, Interlink utilizes its
expertise in materials science, manufacturing, firmware, and
software to produce in-house system solutions for custom
applications. For 35 years, Interlink has led the printed
electronics industry in the commercialization of its patented Force
Sensing Resistor® technology and has supplied some of
the world's top electronics manufacturers with intuitive sensor and
interface technologies like the VersaPad and the new VersaPad Plus,
which boasts the largest active surface area of any resistive
touchpad. It also has a proven track record of supplying
technological solutions for mission-critical applications in a
diverse range of markets—including medical, automotive,
consumer electronics, telecommunications, and industrial
control—providing standard and custom-designed sensors that give
engineers the flexibility and functionally they seek in today's
sophisticated electronic devices. Interlink serves an international
customer base from its headquarters in Irvine, Calif., and world-class materials
science lab and R&D center in Camarillo, Calif. They are supported by
strategic global locations covering manufacturing, distribution,
and sales support. For more information, please visit
InterlinkElectronics.com.
Investor Relations:
Steven N. Bronson, CEO &
President
IR@iefsr.com
805-617-4419
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SOURCE Interlink Electronics