Amtech Announces Record New Orders for Advanced Reflow Systems
March 09 2021 - 7:30AM
Business Wire
Amtech Systems, Inc. (NASDAQ: ASYS), a manufacturer of capital
equipment, including thermal processing and wafer polishing, and
related consumables used in fabricating semiconductor devices, such
as silicon carbide (SiC) and silicon power devices, analog and
discrete devices, electronic assemblies and light-emitting diodes
(LEDs), announced today strong order momentum for its PYRAMAX™
reflow systems sold into advanced packaging applications.
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The new orders were from several customers and included
multi-unit follow-on orders from leading multi-national advanced
packaging OSATs in the Asia Pacific region. These orders include
PYRAMAX TrueFlat™ convection reflow ovens used to eliminate warpage
for very thin substrates in advanced packaging applications.
“We continue to see strong bookings with an increase in activity
from strategic accounts globally, especially from key Asian
advanced packaging companies,” said Michael Whang, Chief Executive
Officer of Amtech. “Customer need drove the development of the
Pyramax TrueFlat system, and we continue to work with key customers
to add new capabilities to the TrueFlat system that will expand its
use in the marketplace,” added Mr. Whang.
The PYRAMAX family of high-throughput convection reflow ovens is
widely recognized as the global standard of excellence for both
printed circuit board solder reflow and for semiconductor
packaging. The Pyramax features an exclusive closed loop convection
control and process temperatures up to 400°C. For the most
demanding applications, PYRAMAX can provide O2 levels as low as
2ppm above source in the peak reflow zone. The PYRAMAX TrueFlat is
designed for very thin substrates of 0.15mm to 0.30mm, ensuring
flatness throughout the heating and cooling process – eliminating
die tilt.
For more information, visit www.amtechsystems.com.
About Amtech Systems, Inc.
Amtech Systems, Inc. is a global supplier of advanced thermal
processing and polishing equipment and related consumables to the
semiconductor / electronics, power IC businesses, and advanced
lighting manufacturing markets. Amtech's equipment includes
diffusion, solder reflow systems, and polishing equipment and
related consumables for surface preparation of various materials,
including silicon carbide (“SiC”), sapphire and silicon. The
Company's thermal processing, polishing and consumable products
currently address the diffusion, oxidation, and deposition steps
used in the fabrication of semiconductors, printed circuit boards,
semiconductor packaging, MEMS, and advanced lighting, including the
polishing of newly sliced sapphire and silicon wafers. Amtech’s
products are recognized under the leading brand names BTU
International, Bruce TechnologiesTM, and PR HoffmanTM.
Cautionary Note Regarding Forward-Looking Statements
Certain information contained in this press release is
forward-looking in nature. All statements in this press release, or
made by management of Amtech Systems, Inc. and its subsidiaries
(“Amtech”), other than statements of historical fact, are hereby
identified as “forward-looking statements” (as such term is defined
in Section 27A of the Securities Act of 1933, as amended, and
Section 21E of the Securities Exchange Act of 1934, as amended).
The forward-looking statements in this press release relate only to
events or information as of the date on which the statements are
made in this press release. Examples of forward-looking statements
include statements regarding Amtech’s future financial results,
operating results, business strategies, projected costs, products
under development, competitive positions, plans and objectives of
Amtech and its management for future operations, efforts to improve
operational efficiencies and effectiveness and greater China
sourcing. In some cases, forward-looking statements can be
identified by terminology such as “may,” “will,” “should,” “would,”
“expects,” “plans,” “anticipates,” “intends,” “believes,”
“estimates,” “predicts,” “potential,” “continue,” or the negative
of these terms or other comparable terminology used in this press
release or by our management, which are intended to identify such
forward-looking statements. These statements are not guarantees of
future performance and involve risks, uncertainties and assumptions
that are difficult to predict. The Form 10-K that Amtech filed with
the Securities and Exchange Commission (the “SEC”) for the
year-ended September 30, 2020, listed various important factors
that could affect the company’s future operating results and
financial condition and could cause actual results to differ
materially from historical results and expectations based on
forward-looking statements made in this document or elsewhere by
Amtech or on its behalf. These factors can be found under the
heading “Risk Factors” in the Form 10-K and investors should refer
to them. Because it is not possible to predict or identify all such
factors, any such list cannot be considered a complete set of all
potential risks or uncertainties. Except as required by law, we
undertake no obligation to publicly update forward-looking
statements, whether as a result of new information, future events,
or otherwise.
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version on businesswire.com: https://www.businesswire.com/news/home/20210309005567/en/
Amtech Systems, Inc. Lisa D. Gibbs Chief Financial Officer (480)
360-3756 irelations@amtechsystems.com
Sapphire Investor Relations, LLC Erica Mannion and Mike Funari
Investor Relations (617) 542-6180 irelations@amtechsystems.com
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