TowerJazz Announces Release of its Advanced 5V 65nm CMOS and Low Voltage Power Process Addressing LED Lighting, Analog Switch...
September 14 2017 - 6:00AM
Provides key advantages over 0.18um 5V
technologies with enhanced Rdson and digital density
TowerJazz, the global specialty foundry leader,
today announced the release of its advanced 5V 65nm power process
providing customers with multiple advantages over 0.18um 5V
technologies. The advanced 5V 65nm technology increases TowerJazz’s
footprint in the 5V power market by offering enhanced Rdson
efficiency with an attractive die cost advantage over 0.18um 5V
processes. This technology is based on TowerJazz’s automotive 300mm
65nm process platform manufactured in its Uozu, Japan facility and
supports both best in class quality and manufacturing cycle
time.
The advanced 5V 65nm contains a rich portfolio
of analog features and many different metal combinations to
optimize cost/performance for any application. The first products,
for several strategic customers, were already prototyped with
outstanding performance. The technology is now fully released and
supports Multi-layer Masking (MLM) and an MPW option to reduce
engineering costs. The first MPW is targeted for November 2017.
TowerJazz’s leading 5V 65nm power technology
offers high Rdson efficiency using tighter design rules for power
devices, and a thick copper top metal for large current
applications, enabling the 5V transistors using a 65nm design to
achieve dense digital capabilities and a dense analog periphery,
with a low number of manufacturing masks. The technology offers an
average of 30% area reduction for a given 5V power transistor and
typically a 35% die size reduction for a mixed-signal chip. An
optimization effort to minimize cost and manufacturing layers
needed to support 5V enables highly competitive solutions for many
different markets such as automotive, industrial and consumer. The
advanced 5V 65nm supports high current power applications such as
PMIC, DC/DC converters, load switches and point of load ICs using
single and dual 3.3um thick copper metal layers.
“Streamlining our feature rich automotive
quality 65nm technology allows TowerJazz to provide very attractive
5V power and mixed-signal solutions with the high quality standard
set required for servicing the automotive market,” said Shimon
Greenberg, Vice President and General Manager of Mixed-Signal and
Power Management Business Unit, TowerJazz. “This technology is
utilized for relatively high current power ICs at 5V which have
large growth drivers to advanced analog and mixed-signal ICs.”
About TowerJazz Tower Semiconductor Ltd.
(NASDAQ:TSEM) (TASE:TSEM) and its subsidiaries operate collectively
under the brand name TowerJazz, the global specialty foundry
leader. TowerJazz manufactures next-generation integrated circuits
(ICs) in growing markets such as consumer, industrial, automotive,
medical and aerospace and defense. TowerJazz’s advanced technology
is comprised of a broad range of customizable process platforms
such as: SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image
sensor, integrated power management (BCD and 700V), and MEMS.
TowerJazz also provides world-class design enablement for a quick
and accurate design cycle as well as Transfer Optimization and
development Process Services (TOPS) to IDMs and fabless companies
that need to expand capacity. To provide multi-fab sourcing and
extended capacity for its customers, TowerJazz operates two
manufacturing facilities in Israel (150mm and 200mm), two in the
U.S. (200mm) and three facilities in Japan (two 200mm and one
300mm). For more information, please visit www.towerjazz.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect TowerJazz’s business is included under the heading "Risk
Factors" in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority and Jazz’s most recent
filings on Forms 10-K and 10-Q, as were filed with the SEC,
respectively. Tower and Jazz do not intend to update, and expressly
disclaim any obligation to update, the information contained in
this release.
TowerJazz Company Contact:
Lauri Julian | +1 949-280-5602 |
lauri.julian@towerjazz.comTowerJazz Investor Relations
Contact: Noit Levi | +972-4-604-7066 |
noit.levi@towerjazz.com
Tower Semiconductor (NASDAQ:TSEM)
Historical Stock Chart
From Mar 2024 to Apr 2024
Tower Semiconductor (NASDAQ:TSEM)
Historical Stock Chart
From Apr 2023 to Apr 2024