TTM Technologies, Inc. Announces Upcoming Conference Participation
May 15 2017 - 4:05PM
TTM Technologies, Inc. (NASDAQ:TTMI), a leading global printed
circuit board (PCB) manufacturer, today announced that members of
its management team will present at the following investor
conferences:
- The J.P. Morgan Technology, Media, Telecom Conference in Boston
at the Westin Copley Place on May 24th, 2017 at 8:40am Eastern
Time;
- The Stifel Technology, Internet, Media Conference in San
Francisco at the Fairmount Hotel on June 5th, 2017 at 3:00pm
Pacific Time;
- The Needham Automotive Technology Conference in New York at the
Needham Offices at 445 Park Avenue on June 6th, 2017;
- The Barclays High Yield Bond & Syndicated Loan Conference
in Colorado Springs at the Broadmoor Hotel on June 8th at 8:50am
Mountain Time; and
- The Goldman Sachs Leveraged Finance Conference in Rancho Palos
Verdes at the Terranea Resort on June 20th at 4:25pm Pacific
Time.
All presentations will be webcast live on the company’s website,
www.ttm.com, and a replay will be accessible for a limited time
following the events.
About TTMTTM Technologies, Inc. is a leading
global printed circuit board manufacturer, focusing on quick-turn
and volume production of technologically advanced PCBs, backplane
assemblies and electro-mechanical solutions. TTM stands for
time-to-market, representing how TTM's time-critical, one-stop
manufacturing services enable customers to shorten the time
required to develop new products and bring them to market.
Additional information can be found at www.ttm.com.
Contact:
Sameer Desai,
Senior Director, Corporate
Development & Investor Relations
sameer.desai@ttmtech.com
714-327-3050
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