UMC Enters Mass Production for 14nm Customer ICs
February 23 2017 - 4:00AM
Business Wire
Chips based on UMC’s high performance 14nm
FinFET process shipping in volume to key customers
United Microelectronics Corporation (NYSE:UMC;TWSE: 2303)
("UMC"), a leading global semiconductor foundry, today announced
that it has entered mass production for customer ICs based on the
company’s self-developed 14nm FinFET technology. The foundry is
shipping 14nm wafers to its lead customers and has achieved
industry-competitive yields for the highly advanced process, which
is being utilized for pioneering new consumer electronic
applications.
Po-Wen Yen, CEO of UMC said, “This 14nm volume production
milestone is the culmination of UMC’s close collaboration with its
customers, demonstrating the success of our collaborative approach
to bringing leading-edge technologies to market. We will continue
to refine this process and are working with other customers to
bring the full performance, power and gate density benefits of 14nm
FinFET to enable next generation silicon in areas such as
networking, AI and various consumer products."
UMC’s 14nm FinFET technology performance is competitive with the
semiconductor industry’s leading standards, featuring 55% higher
speed and twice the gate density over 28nm process technology. The
leading-edge 14nm process also consumes approximately 50% less
power than 28nm. UMC is producing the 14nm customer ICs at the
company’s Fab 12A in Tainan, Taiwan and expects to steadily ramp
its 14nm manufacturing capacity according to customer demand.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry that provides advanced IC production for applications
spanning every major sector of the electronics industry. UMC’s
robust foundry solutions enable chip designers to leverage the
company’s sophisticated technology and manufacturing, which include
high volume production 28nm gate-last High-K/Metal Gate technology,
ultra-low power platform processes specifically engineered for
Internet of Things (IoT) applications and the automotive industry’s
highest-rated AEC-Q100 Grade-0 manufacturing capabilities for
production of ICs found in cars. UMC’s 11 wafer fabs are
strategically located throughout Asia and are able to produce over
500,000 wafers per month. The company employs nearly 19,000 people
worldwide, with offices in Taiwan, China, Europe, Japan, Korea,
Singapore, and the United States. UMC can be found on the web at
http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward
looking within the meaning of the U.S. Federal Securities laws,
including statements about future outsourcing, wafer capacity,
technologies, business relationships and market conditions.
Investors are cautioned that actual events and results could differ
materially from these statements as a result of a variety of
factors, including conditions in the overall semiconductor market
and economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission, including its registration
statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in
each case as amended. UMC does not undertake any obligation to
update any forward-looking statement as a result of new
information, future events or otherwise, except as required under
applicable law.
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version on businesswire.com: http://www.businesswire.com/news/home/20170223005554/en/
UMC Corporate CommunicationsRichard Yu, (886) 2-2658-9168 ext.
16951richard_yu@umc.com
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