Invensas Announces Teledyne DALSA Signs DBI Technology Transfer and License Agreement
February 16 2017 - 4:05PM
Business Wire
Revolutionary Wafer Bonding and 3D Interconnect
Technology To Enable Delivery Of Next-Generation MEMS and Image
Sensor Solutions
Invensas Corporation, a wholly owned subsidiary of Tessera
Holding Corporation (Nasdaq:TSRA), today announced
that Teledyne DALSA, a Teledyne Technologies company, has
signed a technology transfer and license agreement for Direct Bond
Interconnect (DBI®) technology. This agreement enables Teledyne
DALSA to leverage Invensas’ revolutionary semiconductor wafer
bonding and 3D interconnect technologies to deliver next-generation
MEMS and image sensor solutions to customers in the automotive, IoT
and consumer electronics markets. Teledyne DALSA is an
international leader in high performance digital imaging and
semiconductors and also one of the world’s foremost pure-play MEMS
foundries.
“DBI technology is a key enabler for true 3D-integrated MEMS and
image sensor solutions,” said Edwin Roks, president of Teledyne
DALSA. “We are excited about the prospect of developing new
products and providing new foundry services to our customers that
utilize this technology. By working closely with Invensas, we will
be able to move more quickly to deploy this capability efficiently
and effectively.”
DBI technology is a low temperature hybrid wafer bonding
solution that allows wafers to be bonded instantaneously with
exceptionally fine pitch 3D electrical interconnect without
requiring bond pressure. The technology is applicable to a wide
range of semiconductor devices including MEMS, image sensors, RF
Front Ends and stacked memory.
“We are pleased that Teledyne DALSA, a recognized leader in
digital imaging products and MEMS solutions, has chosen our DBI
technology to accelerate the development and commercialization of
their next generation MEMS and image sensor products,” said Craig
Mitchell, president of Invensas. “As device makers look for
increasingly powerful semiconductor solutions in smaller packages,
the need for cost-efficient, versatile 3D technologies is greater
than ever before. We are confident that the superior performance
and manufacturability of DBI technology will help Teledyne DALSA
deliver tremendous value to their customers.”
For more information on DBI technology and other advanced
semiconductor packaging and interconnect solutions from Invensas,
please visit www.invensas.com.
About Tessera Holding Corporation
Tessera Holding Corporation is the parent company of DTS,
FotoNation, Invensas and Tessera. We are one of the world’s leading
product and technology licensing companies. Our technologies and
intellectual property are deployed in areas such as premium audio,
computational imaging, computer vision, mobile computing and
communications, memory, data storage, 3D semiconductor interconnect
and packaging. We invent smart sight and sound technologies that
enhance and help to transform the human connected experience.
For more information, call +1 408-321-6000 or
visit www.tesseraholdingcorporation.com.
About Teledyne DALSA
Teledyne DALSA is an international technology leader in sensing,
imaging, and specialized semiconductor fabrication. Our image
sensing solutions span the spectrum from infrared through visible
to X-ray; our MEMS foundry has earned a world-leading reputation.
In addition, through our subsidiaries Teledyne Optech and Teledyne
Caris, we deliver advanced 3D survey and geospatial information
systems. Teledyne DALSA employs approximately 1,400 employees
worldwide and is headquartered in Waterloo, Canada. For more
information, visit www.teledynedalsa.com.
Tessera, Invensas, and their respective logos, are trademarks or
registered trademarks of affiliated companies of Tessera Holding
Corporation in the United States and other countries. All other
company, brand and product names may be trademarks or registered
trademarks of their respective companies.
Forward-Looking Statements
This press release contains forward-looking statements, which
are made pursuant to the safe harbor provisions of the Private
Securities Litigation Reform Act of 1995. Forward-looking
statements involve risks and uncertainties that could cause actual
results to differ significantly from those projected, particularly
with respect to the expected benefits of the cooperation agreement,
plans with respect to other markets and the expected first uses of
the initial deployment. Material factors that may cause results to
differ from the statements made include the plans or operations
relating to the businesses of the Company; market or industry
conditions; changes in patent laws, regulation or enforcement, or
other factors that might affect the Company's ability to protect or
realize the value of its intellectual property; the expiration of
license agreements and the cessation of related royalty income; the
failure, inability or refusal of licensees to pay royalties;
initiation, delays, setbacks or losses relating to the Company's
intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; fluctuations in
operating results due to the timing of new license agreements and
royalties, or due to legal costs; the risk of a decline in demand
for semiconductors and products
utilizing FotoNation technologies; failure by the
industry to use technologies covered by the Company's patents; the
expiration of the Company's patents; the Company's ability to
successfully complete and integrate acquisitions of businesses; the
risk of loss of, or decreases in production orders from, customers
of acquired businesses; financial and regulatory risks associated
with the international nature of the Company's businesses; failure
of the Company's products to achieve technological feasibility or
profitability; failure to successfully commercialize the Company's
products; changes in demand for the products of the Company's
customers; limited opportunities to license technologies due to
high concentration in the markets for semiconductors and related
products; the impact of competing technologies on the demand for
the Company's technologies; failure to realize the anticipated
benefits of the Company’s recent acquisition of DTS, Inc.,
including as a result of integrating the business of DTS; pricing
trends, including the Company's ability to achieve economies of
scale; the expected amount and timing of cost savings and operating
synergies; and other developments in the markets that the Company
operates, as well as management's response to any of the
aforementioned factors. You are cautioned not to place undue
reliance on the forward-looking statements, which speak only as of
the date of this release.
The foregoing review of important factors should not be
construed as exhaustive and should be read in conjunction with the
other cautionary statements that are included herein and elsewhere,
including the Risk Factors included in the Company’s recent reports
on Form 10-K and Form 10-Q and other documents of the Company on
file with the Securities and Exchange Commission (the
"SEC"). The Company's SEC filings are available publicly
on the SEC's website at www.sec.gov. Any forward-looking
statements made or incorporated by reference herein are qualified
in their entirety by these cautionary statements, and there can be
no assurance that the actual results or developments anticipated by
the Company will be realized or, even if substantially realized,
that they will have the expected consequences to, or effects on,
the Company or its business or operations. Except to the extent
required by applicable law, the Company undertakes no obligation to
update publicly or revise any forward-looking statement, whether as
a result of new information, future developments or otherwise.
TSRA-I
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version on businesswire.com: http://www.businesswire.com/news/home/20170216005335/en/
PR Agency Contact:Zeno GroupDan Sorensen, +1
650-801-0944dan.sorensen@zenogroup.comorTessera PR Contact:Tessera
Holding CorporationJordan Miller, +1
818-436-1082PR@tessera.comorInvestor Contact:Tessera Holding
CorporationGeri Weinfeld, +1 818-436-1231IR@tessera.comorMedia
Relations Contact:Teledyne DALSAGeralyn Miller, +1
519-886-6000geralyn.miller@teledyne.com
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