Kulicke & Soffa to Participate at IPC APEX EXPO 2017
February 09 2017 - 09:05AM
Business Wire
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke
& Soffa”, “K&S” or the “Company”), announced today that it
will be exhibiting at the IPC APEX EXPO 2017 trade show from
February 14 to 16, 2017.
Kulicke & Soffa will be showcasing its market leading
packaging solutions at San Diego Convention Center, Booth Number
3422.
- AsterionTM – a single
platform hybrid wedge bonder with the capability to handle a
multitude of interconnect materials including large and small
aluminum wire, copper wire, PowerRibbonTM, as well as aluminum
copper-clad ribbon. In addition, the Asterion’s interconnect
bonding technology has recently been extended to battery
applications
- Hybrid – a multi-application
solution for advanced packaging, ideal for Wafer Level Packaging
(WLP), Fan-Out Wafer Level Packaging (FOWLP), System-in-Package
(SiP), Multi-Chip Module (MCM), flip-chip, modules and embedded
components.
- iFlex – its new design features
an increase in feeder capacity, achieving 25% more feeder
positions. Combining this increased feeder capacity, with the high
volume and high quality iX system delivers the Flexline, which
offers flexibility, fast changeovers, lower cost-of-ownership and
the lowest defect rates. The iFlex H1 is now available with a
different placement head for placing components up to 50mm in
height over pre-mounted components of 50mm.
- Industry 4.0 – factory
connectivity solution, via intelligent monitoring systems, latest
technology traceability, material management and scheduling
intelligence across our current and future platforms.
Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for
AP-Hybrid, Electronics Assembly, Wedge Bonders, Capillaries and
Blades Business Lines, said, “The IPC APEX EXPO has always been a
valuable platform for us to connect with our partners in the
Americas. We look forward to sharing how our wire bonding,
electronic assembly and advanced packaging offerings can solve
evolving industry challenges.”
Kulicke & Soffa will be holding a technical seminar during
the IPC APEX EXPO 2017 trade show on February 13, 2017, at Hotel
del Coronado, San Diego.
Please contact your local sales and services representative for
more information on K&S’ comprehensive solutions and the
seminar.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of
semiconductor packaging and electronic assembly solutions
supporting the global automotive, consumer, communications,
computing and industrial segments. As a pioneer in the
semiconductor space, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S
has expanded its product offerings through strategic acquisitions
and organic development, adding advanced packaging, electronics
assembly, wedge bonding and a broader range of expendable tools to
its core offerings. Combined with its extensive expertise in
process technology and focus on development, K&S is well
positioned to help customers meet the challenges of packaging and
assembling the next-generation of electronic devices.
(www.kns.com)
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version on businesswire.com: http://www.businesswire.com/news/home/20170209005107/en/
Kulicke & Soffa Industries, Inc.Marilyn SimPublic
RelationsP: +65-6880-9309F: +65-6880-9580msim@kns.comorKulicke
& Soffa Industries, Inc.Joseph ElgindyInvestor Relations
& Strategic InitiativesP: +1-215-784-7500P: +31-40-272-3016F:
+1-215-784-6180investor@kns.com
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