Aehr Test Systems to Showcase Next Generation FOX-XP™ Test and Burn-in System at the 2016 International Test Conference in ...
November 14 2016 - 7:30AM
Aehr Test Systems (NASDAQ:AEHR)
,
a worldwide supplier of semiconductor test and burn-in equipment,
today announced that it will be showcasing its FOX-XP System, its
next generation multi-wafer test and burn-in system for high volume
production and early failure rate (EFR) test at the 2016
International Test Conference (ITC) taking place November 15-17 in
Fort Worth, Texas at the Fort Worth Convention Center (Booth #318).
Aehr Test’s FOX-XP system is capable of functional test and
burn-in/cycling of flash memories, microcontrollers, sensors,
optical devices, laser diodes, VCSELs, LEDs and other leading-edge
ICs in wafer form before they are assembled into multi-die packages
or other applications where known good die are critical. These end
applications can span enterprise solid state drives, automotive
devices, highly valuable mobile applications, communications and
mission critical integrated circuits and sensors.
The key features of the new FOX-XP test cell that contribute to
the cost-effectiveness of the solution include the ability to
provide up to 2,048 “Universal Channels” per wafer, which allows
the system to test all the devices on the wafer in parallel. The
new “Universal Channel” architecture allows any channel to be any
function (I/O, Device Power Supply (DPS) or Per-pin Precision
Measurement Unit (PPMU)). This enhanced architecture now allows
customers to perform per pin parametric testing, more extensive
digital pattern test with deeper data stimulus / capture memory
(32M per pin), and deeper scan (768M) optimized for BIST/DFT
testing.
A single FOX-XP test system may be configured with up to 18
slots of wafer test resources enabling up to 18 wafers to be tested
simultaneously. It also includes Aehr’s proprietary WaferPak full
wafer contactor, which enables meeting the very high pin count and
small pad size and pad pitch requirements of today’s devices, and
Aehr’s high performance thermal chucks that enable managing the
temperature of the high power density of the devices on the wafer.
The footprint of the 18 wafer test system is similar to the
footprint of typical semiconductor Automatic Test Equipment (ATE)
that can only test one wafer at a time.
With the highest wafer throughput available in the ATE industry,
the flexibility of Aehr Test’s new “Universal Channel”
architecture, and the ability to perform both functional pattern
verification and parametric testing at full-wafer parallel test,
the FOX-XP system provides a highly differentiated solution from
competitive alternatives.
The FOX-XP system utilizes Aehr Test's FOX WaferPak contactor,
which provides a cost effective solution for making full wafer
electrical die contact in a multi-wafer environment. Aehr Test’s
WaferPak contactors contain up to tens of thousands of probes to
contact all die simultaneously on wafers and substrates up to
300mm.
Aehr Test will also be showcasing the ABTS family of products,
which is based on a state-of-the-art hardware and software platform
that is designed to address not only today’s devices, but also
future devices for many years to come. It can test and burn-in both
logic and memory devices and includes resources for high pin-count
devices and configurations for high-power and low-power
applications. ABTS systems can be configured with up to 72 burn-in
boards, up to 320 I/O channels, 32M of test vector memory per
channel and up to 16 independent device power supplies. The ABTS
system can be configured with a scalable cost-effective individual
device temperature control solution for up to 64 devices per
burn-in board and up to 75 watts per device or more. Individual
temperature control enables high-power devices with a broad range
of power dissipation to be burned-in simultaneously in a single
burn-in chamber while maintaining a precise device temperature. The
ABTS system also uses N+1 redundancy technology for many key
components in the system to maximize system uptime.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic and memory integrated
circuits and has an installed base of more than 2,500 systems
worldwide. Increased quality and reliability needs of theAutomotive
and Mobility integrated circuit markets are driving additional test
requirements, capacity needs and opportunities for Aehr Test
products in package and wafer level test. Aehr Test has developed
and introduced several innovative products, including the ABTSTM
and FOX families of test and burn-in systems and the DiePak®
carrier. The ABTS system is used in production and qualification
testing of packaged parts for both lower-power and higher-power
logic as well as all common types of memory devices. The FOX system
is a full wafer contact test and burn-in system used for burn-in
and functional test of complex devices, such as leading-edge
memories, digital signal processors, microprocessors,
microcontrollers and systems-on-a-chip. The DiePak carrier is a
reusable, temporary package that enables ICmanufacturers to perform
cost-effective final test and burn-in of bare die. For more
information, please visit the Company’s website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr Test as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr Test's expectations, beliefs, intentions or
strategies regarding the FOX products, including statements
regarding future market opportunities and conditions, expected
product shipment dates and customer orders or commitments. These
risks and uncertainties include, without limitation, acceptance by
customers of the FOX and WaferPak contactor technologies,
acceptance by customers of the FOX-XP system, WaferPak Aligner and
WaferPak contactors shipped upon receipt of a purchase order and
the ability of new products to meet customer needs or perform as
described, as well as general market conditions, customer demand
and acceptance of Aehr Test’s products and Aehr Test’s ability to
execute on its business strategy. See Aehr Test’s recent 10-K, 10-Q
and other reports from time to time filed with the Securities and
Exchange Commission for a more detailed description of the risks
facing Aehr Test’s business. Aehr Test disclaims any obligation to
update information contained in any forward-looking statement to
reflect events or circumstances occurring after the date of this
press release.
Contacts:
Aehr Test Systems
Carl Buck
V.P of Marketing
(510) 623-9400 x381
cbuck@aehr.com
MKR Group Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
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