Micron Introduces Mobile 3D NAND Solution for Next-Generation Smartphones
August 09 2016 - 8:00AM
Micron Technology, Inc., (Nasdaq:MU) today introduced the company’s
first 3D NAND memory technology optimized for mobile devices and
its first products based on the Universal Flash Storage (UFS) 2.1
standard. Micron’s initial mobile 3D NAND-based 32GB solution is
targeted specifically for the high and mid-end smartphone segments
which make up approximately 50 percent of worldwide smartphone
volume[1]. As mobile devices bypass personal computers as
consumers’ primary computing device, user behaviors heavily impact
the device’s mobile memory and storage requirements. Micron’s
mobile 3D NAND addresses these concerns, enabling an unparalleled
user experience that includes seamless high definition video
streaming, higher bandwidth gameplay, faster boot up times, camera
performance and file loading.
“Micron continues to advance NAND technology with our
introduction of 3D NAND and UFS products for the mobile segment,”
said Mike Rayfield, vice president of Micron’s mobile business
unit. “The improved performance, higher capacity and enhanced
reliability of 3D NAND will help our customers meet the
ever-growing demand for mobile storage and will enable much more
exciting end user experiences.”
To meet the elevated hardware demands stemming from increased
mobile video and multimedia consumption, as well as the anticipated
increased storage demands that will result from the introduction of
5G wireless networks, Micron 3D NAND technology stacks layers of
data storage cells vertically with extraordinary precision to
create storage solutions with three times more capacity than
previous generation planar NAND technologies. Because capacity is
achieved by stacking cells vertically, Micron is able to pack more
storage cells into a much smaller die area, resulting in the
delivery of the industry’s smallest 3D NAND memory die measuring
only 60.217mm2. A smaller die enables a tiny memory packaging
footprint which can free up space for additional mobile battery
size or enable smaller form factor devices.
“3D NAND technology will be vital to the continued development
of smartphones and other mobile devices,” said Greg Wong, founder
and principal analyst at Forward Insights. “With the advent of 5G
and mobile’s increasing influence in our digital lives, smartphone
makers are in need of the most advanced technology to store and
manage the ever-increasing volume of data. Micron’s 3D NAND for
mobile is well suited to address the market’s evolving data storage
needs by enabling a more seamless user experience for high
resolution video, gaming, and photography.”
3D NAND: Powering the Changing Mobile
LandscapeMicron's first 3D NAND for mobile offers several
competitive technical advantages. New features include:
- Industry’s first mobile product built on floating gate
technology, a universally utilized design refined through years of
high-volume planar flash manufacturing
- Micron’s first memory devices with UFS 2.1 standard, which
enable best-in class Sequential Read Performance for the mobile
market
- 3D NAND-based multichip packages (MCPs) also include low power
LPDDR4X, providing up to 20 percent more energy efficiency than
standard LPDDR4 memory
- Industry’s smallest 3D NAND memory die, measuring only
60.217mm2, allows tiny memory packaging ideal for ultra-small form
factor devices; Micron’s 3D NAND die is up to 30% smaller than
planar NAND die of the same capacity.
Micron’s 3D NAND solutions for mobile are now sampling with
mobile customers and partners and will be widely available by the
end of 2016.
[1] Source: Micron internal forecast
Additional Resources:
- Lean more about Micron mobile memory solutions
- Learn more about Micron’s 3D NAND products
- 3D NAND for Mobile Data Sheet
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Micron Technology, Inc. Micron Technology,
Inc., is a global leader in advanced semiconductor systems.
Micron’s broad portfolio of high-performance memory
technologies—including DRAM, NAND and NOR Flash—is the basis for
solid state drives, modules, multichip packages and other system
solutions. Backed by more than 35 years of technology
leadership, Micron’s memory solutions enable the world’s most
innovative computing, consumer, enterprise storage, networking,
mobile, embedded and automotive applications. Micron's common
stock is traded on the NASDAQ under the MU symbol. To learn more
about Micron Technology, Inc., visit www.micron.com.
Media Contact
Sarah Lewis
Zeno Group for Micron Technology
650-801-0937
sarah.lewis@zenogroup.com
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