New Micron
Mobile 32GB 3D NAND memory technology delivers better quality,
performance and reliability for next-generation mobile multimedia
and streaming experiences
SANTA CLARA, Calif., Aug. 09, 2016
(GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq:MU) today
introduced the company's first 3D NAND memory technology optimized
for mobile devices and its first products based on the Universal
Flash Storage (UFS) 2.1 standard. Micron's initial mobile 3D
NAND-based 32GB solution is targeted specifically for the high and
mid-end smartphone segments which make up approximately 50 percent
of worldwide smartphone volume[1]. As mobile
devices bypass personal computers as consumers' primary computing
device, user behaviors heavily impact the device's mobile memory
and storage requirements. Micron's mobile 3D NAND addresses these
concerns, enabling an unparalleled user experience that includes
seamless high definition video streaming, higher bandwidth
gameplay, faster boot up times, camera performance and file
loading.
"Micron continues to advance NAND technology with
our introduction of 3D NAND and UFS products for the mobile
segment," said Mike Rayfield, vice president of Micron's mobile
business unit. "The improved performance, higher capacity and
enhanced reliability of 3D NAND will help our customers meet the
ever-growing demand for mobile storage and will enable much more
exciting end user experiences."
To meet the elevated hardware demands stemming
from increased mobile video and multimedia consumption, as well as
the anticipated increased storage demands that will result from the
introduction of 5G wireless networks, Micron 3D NAND technology
stacks layers of data storage cells vertically with extraordinary
precision to create storage solutions with three times more
capacity than previous generation planar NAND technologies. Because
capacity is achieved by stacking cells vertically, Micron is able
to pack more storage cells into a much smaller die area, resulting
in the delivery of the industry's smallest 3D NAND memory die
measuring only 60.217mm2. A
smaller die enables a tiny memory packaging footprint which can
free up space for additional mobile battery size or enable smaller
form factor devices.
"3D NAND technology will be vital to the continued
development of smartphones and other mobile devices," said Greg
Wong, founder and principal analyst at Forward Insights. "With the
advent of 5G and mobile's increasing influence in our digital
lives, smartphone makers are in need of the most advanced
technology to store and manage the ever-increasing volume of data.
Micron's 3D NAND for mobile is well suited to address the market's
evolving data storage needs by enabling a more seamless user
experience for high resolution video, gaming, and photography."
3D NAND: Powering the
Changing Mobile Landscape
Micron's first 3D NAND for mobile offers several competitive
technical advantages. New features include:
- Industry's first mobile product built on floating
gate technology, a universally utilized design refined through
years of high-volume planar flash manufacturing
- Micron's first memory devices with UFS 2.1
standard, which enable best-in class Sequential Read Performance
for the mobile market
- 3D NAND-based multichip packages (MCPs) also
include low power LPDDR4X, providing up to 20 percent more energy
efficiency than standard LPDDR4 memory
- Industry's smallest 3D NAND memory die, measuring
only 60.217mm2, allows tiny
memory packaging ideal for ultra-small form factor devices;
Micron's 3D NAND die is up to 30% smaller than planar NAND die of
the same capacity.
Micron's 3D NAND solutions for mobile are now
sampling with mobile customers and partners and will be widely
available by the end of 2016.
[1] Source: Micron internal forecast
Additional
Resources:
- Lean more about Micron mobile memory
solutions
- Learn more about Micron's 3D NAND products
- 3D NAND for Mobile Data Sheet
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Micron Technology,
Inc.
Micron Technology, Inc., is a global leader in advanced
semiconductor systems. Micron's broad portfolio of high-performance
memory technologies-including DRAM, NAND and NOR Flash-is the basis
for solid state drives, modules, multichip packages and other
system solutions. Backed by more than 35 years of technology
leadership, Micron's memory solutions enable the world's most
innovative computing, consumer, enterprise storage, networking,
mobile, embedded and automotive applications. Micron's common
stock is traded on the NASDAQ under the MU symbol. To learn more
about Micron Technology, Inc., visit www.micron.com.
Media Contact
Sarah Lewis
Zeno Group for Micron Technology
650-801-0937
sarah.lewis@zenogroup.com